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公开(公告)号：EP2591497A2
公开(公告)日：2013-05-15
申请号：EP11728250.9
申请日：2011-06-23
IPC分类号： H01L21/48 , H01L23/498
CPC分类号： B23K1/20 , H01L21/4853 , H01L23/49816 , H01L24/11 , H01L2224/11462 , H01L2924/00015 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/1134
摘要： Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.
摘要翻译： 描述了一种在基板上形成焊料沉积物的方法，包括以下步骤：i）提供包括至少一个内接触区域的基板，ii）使包括所述至少一个内接触区域的整个基板区域与适合于 在衬底表面上提供导电层，iii）形成图案化的抗蚀剂层，iv）将包含锡或锡合金的焊料沉积层电镀到内部接触区域上，v）去除图案化的抗蚀剂层，vi）形成阻焊剂 在基板表面上具有阻焊剂开口。
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公开(公告)号：EP3560304A1
公开(公告)日：2019-10-30
申请号：EP17818584.9
申请日：2017-12-22
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公开(公告)号：EP2601822B1
公开(公告)日：2019-07-10
申请号：EP11737966.9
申请日：2011-07-29
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公开(公告)号：EP1427869B1
公开(公告)日：2005-02-23
申请号：EP02754692.8
申请日：2002-06-17
IPC分类号： C23C18/00
CPC分类号： C23C18/1617
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公开(公告)号：EP2377376B1
公开(公告)日：2019-08-07
申请号：EP09783824.7
申请日：2009-10-07
发明人： EWERT, Ingo , LAMPRECHT, Sven , MATEJAT, Kai-Jens , PLIET, Thomas
IPC分类号： H01L23/498 , C25D5/18
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公开(公告)号：EP2591497B1
公开(公告)日：2016-01-06
申请号：EP11728250.9
申请日：2011-06-23
IPC分类号： H01L21/48 , H01L23/498
CPC分类号： B23K1/20 , H01L21/4853 , H01L23/49816 , H01L24/11 , H01L2224/11462 , H01L2924/00015 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2224/1134
摘要： Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.
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7.发明公开METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES 审中-公开在基板上形成焊料沉积物和非熔融缓冲结构的方法
公开(公告)号：EP2601822A1
公开(公告)日：2013-06-12
申请号：EP11737966.9
申请日：2011-07-29
CPC分类号： H05K3/4007 , H01L21/4853 , H01L23/49816 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0346 , H01L2224/0401 , H01L2224/05567 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11462 , H01L2224/11474 , H01L2224/1148 , H01L2224/11825 , H01L2224/11849 , H01L2224/11906 , H01L2224/13007 , H01L2224/13022 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13171 , H01L2224/13562 , H01L2224/13611 , H01L2224/81192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01038 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/01056 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K3/3473 , H05K2203/054 , H05K2203/0577 , H01L2924/00 , H01L2224/05552
摘要： Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate including a permanent resin layer on top of at least one contact area and a temporary resin layer on top of the permanent resin layer, ii) contact the entire substrate area including the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface and i) electroplate a metal or metal alloy layer onto the conductive layer.
摘要翻译： 描述了一种在基材上形成金属或金属合金层的方法，包括以下步骤：i）提供在至少一个接触区域（101）的顶部上包括永久树脂层（103）的基材（102）和临时树脂 ii）使包括所述至少一个接触区域的整个衬底区域与适合于在衬底表面上提供导电层（106）的溶液接触，以及iii）电镀金属或金属 合金层（107）到导电层上。
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8.发明公开METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES 有权VERFAHREN ZUR BILDUNG VON LOTABSCHEIDUNGEN AUF SUBSTRATEN
公开(公告)号：EP2377376A1
公开(公告)日：2011-10-19
申请号：EP09783824.7
申请日：2009-10-07
发明人： EWERT, Ingo , LAMPRECHT, Sven , MATEJAT, Kai-Jens , PLIET, Thomas
CPC分类号： H05K3/3473 , C25D3/32 , C25D5/022 , C25D5/18 , C25D5/505 , C25D7/123 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05023 , H01L2224/05027 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05572 , H01L2224/1134 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K3/064 , H05K3/3452 , H05K2203/043 , H05K2203/054 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one contact area, ii) form a solder mask layer that is placed on the substrate surface and patterned to expose the at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the conductive layer and v) etch away an amount of the solder deposit layer containing tin or tin alloy sufficient to remove the solder deposit layer from the solder mask layer area leaving a solder material layer on the at least one contact area.
摘要翻译： 描述了在衬底上形成焊料沉积物的方法，其包括以下步骤：i）提供包括表面承载电路的衬底，其包括至少一个接触区域，ii）形成放置在衬底表面上的焊料掩模层，以及 图案化以暴露所述至少一个接触区域，iii）使包括焊料掩模层和至少一个接触区域的整个衬底区域与适于在衬底表面上提供导电层的溶液接触，iv）电镀焊料沉积层 在导电层上含有锡或锡合金，以及v）蚀刻一定量的包含锡或锡合金的焊料沉积层，其足以从焊料掩模层区域移除焊料沉积层，从而在至少一个 接触面积
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公开(公告)号：EP4018790A1
公开(公告)日：2022-06-29
申请号：EP20756871.8
申请日：2020-08-19
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公开(公告)号：EP1629704B1
公开(公告)日：2006-12-13
申请号：EP04739481.2
申请日：2004-06-01
CPC分类号： H05K3/423 , C25D21/18 , H05K2201/09563 , H05K2203/0796
摘要： The invention provides a process for filling µ-blind vias in the manufacture of printed circuit boards, which process comprises the following steps: (i) providing a bath electrolyte for galvanic plating with metallic coatings comprising a copper metal salt and optionally organic additives, (ii) operating the bath with direct current density of 0.5 to 10 A/dm2, or current pulses at an effective current density of 0.5 to A/dm2, (iii) withdrawing part of the electrolyte from the galvanic bath, (iv) adding an oxidizing agent to the part of the electrolyte which has been withdrawn, (v) optionally irradiating the withdrawn electrolyte with UV light and (vi) recycling the withdrawn part to the galvanic bath and replacing the organic additives destroyed by the oxidation treatment.
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