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1.发明公开IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY 有权改进方法铜MIKROAUFRAUHUNGSBEHANDLUNG及混合金属电路
公开(公告)号：EP1668967A2
公开(公告)日：2006-06-14
申请号：EP04789106.4
申请日：2004-09-27
IPC分类号： H05K3/38
CPC分类号： C23F1/18 , H05K3/022 , H05K3/064 , H05K3/383 , H05K3/4641 , H05K2201/0338 , H05K2201/068 , H05K2203/124
摘要： Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
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公开(公告)号：EP1299575A2
公开(公告)日：2003-04-09
申请号：EP01965078.7
申请日：2001-07-06
发明人： HAUF, Uwe , FUERHAUPTER, Harry , STIOP, Alexey , GRIESER, Udo
CPC分类号： H05K3/383 , C23C22/52 , C23F1/18 , H05K3/064 , H05K3/28 , H05K2203/0796 , H05K2203/124
摘要： The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R 3 =R 1 , R 1 -O, R 1 -S, amino or substituted amino, wherein R 1 and R 2 may especially be phenyl or substituted phenyl.
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3.发明授权IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY 有权改进方法铜MIKROAUFRAUHUNGSBEHANDLUNG及混合金属电路
公开(公告)号：EP1668967B1
公开(公告)日：2009-11-04
申请号：EP04789106.4
申请日：2004-09-27
IPC分类号： H05K3/38
CPC分类号： C23F1/18 , H05K3/022 , H05K3/064 , H05K3/383 , H05K3/4641 , H05K2201/0338 , H05K2201/068 , H05K2203/124
摘要： Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
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公开(公告)号：EP1299575B1
公开(公告)日：2004-08-25
申请号：EP01965078.7
申请日：2001-07-06
发明人： HAUF, Uwe , FUERHAUPTER, Harry , STIOP, Alexey , GRIESER, Udo
CPC分类号： H05K3/383 , C23C22/52 , C23F1/18 , H05K3/064 , H05K3/28 , H05K2203/0796 , H05K2203/124
摘要： The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R 3 =R 1 , R 1 -O, R 1 -S, amino or substituted amino, wherein R 1 and R 2 may especially be phenyl or substituted phenyl.
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