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1.发明授权IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY 有权改进方法铜MIKROAUFRAUHUNGSBEHANDLUNG及混合金属电路
公开(公告)号：EP1668967B1
公开(公告)日：2009-11-04
申请号：EP04789106.4
申请日：2004-09-27
IPC分类号： H05K3/38
CPC分类号： C23F1/18 , H05K3/022 , H05K3/064 , H05K3/383 , H05K3/4641 , H05K2201/0338 , H05K2201/068 , H05K2203/124
摘要： Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
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2.发明公开IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY 有权改进方法铜MIKROAUFRAUHUNGSBEHANDLUNG及混合金属电路
公开(公告)号：EP1668967A2
公开(公告)日：2006-06-14
申请号：EP04789106.4
申请日：2004-09-27
IPC分类号： H05K3/38
CPC分类号： C23F1/18 , H05K3/022 , H05K3/064 , H05K3/383 , H05K3/4641 , H05K2201/0338 , H05K2201/068 , H05K2203/124
摘要： Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.
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