A LATERAL FIELD EFFECT TRANSISTOR OF SiC, A METHOD FOR PRODUCTION THEREOF AND A USE OF SUCH A TRANSISTOR
    1.
    发明公开
    A LATERAL FIELD EFFECT TRANSISTOR OF SiC, A METHOD FOR PRODUCTION THEREOF AND A USE OF SUCH A TRANSISTOR 有权
    LATERAL碳化硅基于场效应晶体管,制造过程及这种晶体管的使用

    公开(公告)号:EP1163696A1

    公开(公告)日:2001-12-19

    申请号:EP00906825.5

    申请日:2000-02-01

    申请人: Acreo AB

    摘要: A lateral field effected transistor of SiC for high switching frequencies comprises a source region layer (5) and a drain region layer (6) laterally spaced and highly doped n-type, an n-type channel layer (4) extending laterally and interconnecting the source region layer and the drain region layer for conducting a current between these layers in the on-state of the transistor, and a gate electrode (9) arranged to control the channel layer to be conducting or blocking through varying the potential applied to the gate electrode. A highly doped p-type base layer (12) is arranged next to the channel layer at least partially overlapping the gate electrode and being at a lateral distance to the drain region layer. The base layer is shorted to the source region layer.

    A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE OF SiC
    2.
    发明公开
    A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE OF SiC 有权
    METHOD FOR PRODUCING SiC构成的半导体部件

    公开(公告)号:EP1258034A1

    公开(公告)日:2002-11-20

    申请号:EP01902922.2

    申请日:2001-01-26

    申请人: Acreo AB

    摘要: The invention relates to a method for selective etching of SiC, the etching being carried out by applying a positive potential to a layer (3; 8) of p-type SiC being in contact with an etching solution containing fluorine ions and having an oxidising effect on SiC. The invention also relates to a method for producing a SiC micro structure having free hanging parts (i.e. diaphragm, cantilever or beam) on a SiC-substrate, a method for producing a MEMS device of SiC having a free hanging structure, and a method for producing a piezo-resistive pressure sensor comprising the step of applying a positive potential to a layer (8) of p-type SiC being in contact with an etching solution containing fluorine ions and having an oxidising effect on SiC.

    PROTECTIVE LAYER FOR A SEMICONDUCTOR DEVICE
    3.
    发明公开
    PROTECTIVE LAYER FOR A SEMICONDUCTOR DEVICE 审中-公开
    保护层,半导体器件

    公开(公告)号:EP1214740A1

    公开(公告)日:2002-06-19

    申请号:EP00917573.8

    申请日:2000-03-15

    申请人: Acreo AB

    IPC分类号: H01L23/29

    摘要: A semiconductor device comprises at least one first semiconductor layer (1-4) and a second layer (8) applied on at least a surface portion of the first layer for protecting the device. The protecting layer is of a second material having a larger energy gap between the valence band and the conduction band than a first material forming said first layer. The second material has at least in one portion of said protecting layer a nano-crystalline and amorphous structure by being composed of crystalline grains with a size less than 100 nm and a resistivity at room temperature exceeding 1x1010 Φcm.