公开(公告)号：EP1709684A1

公开(公告)日：2006-10-11

申请号：EP04775652.3

申请日：2004-10-09

申请人： Advanpack Solutions Pte Ltd

发明人： TAN, Kim Hwee, Block 104A, Ang Mo Kio Street 11 ,  CH'NG, Han-Shen, 688E Woodlands Drive 75 ,  TAGAPULOT, Rosemarie, Advanpack Solutions Pte Ltd ,  BONG, Yin Yen ,  MA, L. Nang Htoi, Advanpack Solutions Pte Ltd ,  LIM, Tiong Soon, Advanpack Solutions Pte Ltd ,  LIU, Shikui, Block 683D, Woodlands Drive 62 ,  BALASUBRAMANIAN,S., Block 803,Yishun RingRoad

IPC分类号： H01L23/485 ,  H01L21/48 ,  H01L21/60 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/14051 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

摘要： A die, comprising a substrate (10), has pillar bumps (34) formed over its surface in a series of rows and columns. The pillar bump is comprised a copper pillar (26) topped with a solder cap (28) which has been refloewd (28’). The solder can be lead or lead-free. The pillar bump can be columnar, rectangular, ring shaped or wall shaped. The pillar bump may form a square. The pillar bump can find use in high power applications such a Surface Acoustic Wave devices or MEM devices.