公开(公告)号：EP2773484A1

公开(公告)日：2014-09-10

申请号：EP13777315.6

申请日：2013-10-09

申请人： Alpha Metals, Inc.

发明人： CHOUDHURY, Pritha ,  DE AVILA RIBAS, Morgana ,  MUKHERJEE, Sutapa ,  KUMAR, Anil ,  SARKAR, Siuli ,  PANDHER, Ranjit ,  BHATKAL, Ravi ,  SINGH, Bawa

IPC分类号： B23K35/26 ,  B23K35/02

CPC分类号： B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K2203/12 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  Y10T403/479

摘要： A lead-free, antimony-free solder alloy comprising: (a) 10 wt.% or less of silver, (b) 10 wt.% or less of bismuth, (c) 3 wt.% or less of copper, (d) at least one of the following elements up to 1 wt.% of nickel up to 1 wt.% of titanium up to 1 wt.% of cobalt up to 3.5 wt.% of indium up to 1 wt.% of zinc up to 1 wt.% of arsenic, (e) optionally one or more of the following elements 0 to 1 wt.% of manganese,0 to 1 wt. % of chromium, 0 to 1 wt.% of germanium,0 to 1 wt.% of iron, 0 to 1 wt.% of aluminum, 0 to 1 wt.% of phosphorus, 0 to 1 wt.% of gold, 0 to 1 wt.% of gallium, 0 to 1 wt.% of tellurium, 0 to 1 wt.% 20 of selenium, 0 to 1 wt.% of calcium, 0 to 1 wt.% of vanadium, 0 to 1 wt.% of molybdenum, 0 to 1 wt.% of platinum, 0 to 1 wt.% of magnesium, 0 to 1 wt.% of rare earths, (f) the balance tin, together with any unavoidable 2 impurities.

公开(公告)号：EP2739432A1

公开(公告)日：2014-06-11

申请号：EP12756540.6

申请日：2012-08-02

申请人： Alpha Metals, Inc.

发明人： PANDHER, Ranjit ,  SINGH, Bawa ,  SARKAR, Siuli ,  CHEGUDI, Sujatha ,  KUMAR, Anil K. N. ,  CHATTOPADHYAY, Kamanio ,  LODGE, Dominic ,  DE AVILA RIBAS, Morgana

IPC分类号： B23K35/26 ,  C22C12/00 ,  C22C13/02

CPC分类号： B23K35/262 ,  B23K1/002 ,  B23K1/0056 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/264 ,  B23K2201/42 ,  C22C12/00 ,  C22C13/02 ,  Y10T403/479

摘要： High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

摘要翻译： 包含35-59重量％的Bi，Mn浓度高达1.0重量％，浓度高达1重量％的Cu和余量的Sn以及任何不可避免的杂质的无铅焊料合金。 一些实施方案还含有高达约1重量％的Ag。

公开(公告)号：EP3157704A1

公开(公告)日：2017-04-26

申请号：EP15733870.8

申请日：2015-06-19

申请人： Alpha Metals, Inc.

发明人： RAMAKRISHNA, Hosur Venkatagiriyappa ,  DE AVILA RIBAS, Morgana ,  PANDHER, Ranjit ,  SARKAR, Siuli ,  MUKHERJEE, Sutapa ,  SINGH, Bawa

IPC分类号： B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  B23K35/26 ,  B23K35/362 ,  B23K35/02 ,  H05K3/34 ,  B23K35/36 ,  H01L21/56 ,  H01L23/00

CPC分类号： H05K3/3489 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/025 ,  B23K35/26 ,  B23K35/3613 ,  B23K35/362 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/83011 ,  H01L2224/83024 ,  H01L2224/83815 ,  H01L2224/8392 ,  H01L2924/0665 ,  H05K1/09 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3431 ,  H01L2924/014

摘要： A method of forming a solder joint, the method comprising: (i) providing a solder flux; (ii) providing solder particles; (iii) providing two or more work pieces to be joined; and (iv) heating the solder flux and the solder particles in the vicinity of the two or more work pieces to be joined to form: (i) a solder joint between the two or more work pieces to be joined, and (ii) a solder flux residue. The solder flux residue substantially covers the exposed surfaces of the solder joint.

摘要翻译： 一种形成焊点的方法，该方法包括：提供焊剂; 提供焊料颗粒; 提供两个或多个要连接的工件; 以及在两个或更多个待接合工件附近加热助焊剂和焊料颗粒以形成：（i）两个或更多个待接合工件之间的焊接接头，以及（ii）助焊剂残留物 其中焊剂残余物基本上覆盖焊点的暴露表面。

公开(公告)号：EP2739431A2

公开(公告)日：2014-06-11

申请号：EP12756541.4

申请日：2012-08-02

申请人： Alpha Metals, Inc.

发明人： DE AVILA RIBAS, Morgana ,  LODGE, Dominic ,  PANDHER, Ranjit ,  SINGH, Bawa ,  BHATKAL, Ravindra M ,  RAUT, Rahul ,  SARKAR, Siuli ,  CHATTOPADHYAY, Kamanio ,  NANDI, Proloy

IPC分类号： B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36

摘要： A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.