公开(公告)号：EP1506565A1

公开(公告)日：2005-02-16

申请号：EP03726907.3

申请日：2003-05-16

申请人： Applied Materials, Inc.

发明人： HONG, Ilyoung, Richard ,  TSUNG, James, H. ,  MILLER, Michael, Andrew ,  LUBBEN, Daniel, C. ,  DING, Peijun ,  MAITY, Nirmalya

IPC分类号： H01J37/34

CPC分类号： H01J37/3408 ,  H01J37/3455

摘要： A small unbalanced magnet assembly (60) is scanned in a preferably retrograde planetary or epicyclic path (92) about the back of a target (90) being plasma sputtered including an orbital rotation about the center axis (72) of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly may pass through the target center, thus allowing full target coverage. A geared planetary mechanism may include a rotating drive plate (74), a fixed center gear (62), and an idler gear (76) and a follower gear (74) rotatably supported in the drive plate supporting a cantilevered magnet assembly (84) on the side of the drive plate facing the target. A belt (342) and pulleys (344, 346) may be substituted for the gears. The erosion profile may be controlled by varying the rotation rate through the rotation cycle or by modulating the target power. A second planetary stage (302, 304, 306) may be added or non-circular gears (310) be used. Auxiliary electromagnetic coils (254, 258) positioned beside the chamber and below the pedestal (122) may create a focusing magnetic field.

公开(公告)号：EP1459353A2

公开(公告)日：2004-09-22

申请号：EP02784777.1

申请日：2002-12-10

申请人： Applied Materials, Inc.

发明人： DING, Peijun ,  XU, Zheng ,  MOSELY, Roderick, C. ,  RENGARAJAN, Suraj ,  MAITY, Nirmalya ,  CARL, Daniel, A. ,  CHIN, Barry ,  SMITH, Paul, F. ,  ANGELO, Darryl ,  TOLIA, Anish ,  FU, Jianming ,  CHEN, Fusen ,  GOPALRAJA, Praburam ,  TANG, Xianmin ,  FORSTER, John, C.

IPC分类号： H01J37/34 ,  H01J37/32

CPC分类号： H01L21/76844 ,  C23C14/046 ,  C23C14/345 ,  C23C14/3457 ,  C23C14/358 ,  H01J37/321 ,  H01J37/3408 ,  H01J2237/3327 ,  H01L21/2855 ,  H01L21/76805 ,  H01L21/76846 ,  H01L21/76862 ,  H01L21/76864 ,  H01L21/76865 ,  H01L21/76868 ,  H01L21/76873 ,  H01L21/76877 ,  H01L2221/1089

摘要： A magnetron sputter reactor for sputtering deposition materials such as tantalum, tantalum nitride and copper, for example, and its method of use, in which self-ionized plasma (SIP) sputtering and inductively coupled plasma (ICP) sputtering are promoted, either together or alternately, in the same chamber. Also, bottom coverage may be thinned or eliminated by ICP resputtering. SIP is promoted by a small magnetron having poles of unequal magnetic strength and a high power applied to the target during sputtering. ICP is provided by one or more RF coils which inductively couple RF energy into a plasma. The combined SIP-ICP layers can act as a liner or barrier or seed or nucleation layer for hole. In addition, an RF coil may be sputtered to provide protective material during ICP resputtering.