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1.发明公开ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS 有权附件和修改程序高级金属油墨溶剂型和水性BASIS
公开(公告)号：EP2253002A2
公开(公告)日：2010-11-24
申请号：EP09717000.5
申请日：2009-03-02
IPC分类号： H01B1/22
CPC分类号： H01B1/22 , C09D11/101 , C09D11/52 , H05K1/097
摘要： A conductive ink includes metallic nanoparticles, a polymeric dispersant, and a solvent. The polymeric dispersant may be ionic, non-ionic, or any combination of ionic and non-ionic polymeric dispersants. The solvent may include water, an organic solvent, or any combination thereof. The conductive ink may include a stabilizing agent, an adhesion promoter, a surface tension modifier, a defoaming agent, a leveling additive, a rheology modifier, a wetting agent, an ionic strength modifier, or any combination thereof.
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公开(公告)号：EP2412007A1
公开(公告)日：2012-02-01
申请号：EP10756901.4
申请日：2010-03-26
发明人： YANIV, Zvi , YANG, Mohshi , LAXTON, Peter B.
IPC分类号： H01L21/223
CPC分类号： H05K1/092 , B22F3/105 , B22F7/04 , B22F2998/00 , B23K26/32 , B23K26/34 , B23K35/0244 , B23K2101/36 , B23K2103/50 , B23K2103/52 , H01L21/268 , H01L21/288 , H01L21/4867 , H01L21/76877 , H01L2924/0002 , H05K1/0201 , H05K3/10 , H05K3/125 , H05K3/1283 , H05K3/4664 , H05K2201/062 , H05K2203/107 , Y10T29/49156 , B22F1/0018 , H01L2924/00
摘要： Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.
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公开(公告)号：EP2356678A1
公开(公告)日：2011-08-17
申请号：EP09826725.5
申请日：2009-11-12
申请人： Applied Nanotech Holdings, Inc. , Li, Yunjun , Laxton, Peter B. , Novak, James , Roundhill, David Max
IPC分类号： H01L23/48
CPC分类号： C09D11/38 , C09D11/36 , C09D11/52 , H01B1/22 , H01L24/03 , H01L24/05 , H01L31/022425 , H01L2224/0401 , H01L2224/16 , H01L2924/01057 , H01L2924/01067 , H01L2924/01077 , H01L2924/10158 , H01L2924/12032 , Y02E10/50 , H01L2924/00
摘要： A silicon solar cell is formed with an N-type silicon layer on a P-type silicon semiconductor substrate. An antireflective and passivation layer is deposited on the N-type silicon layer, and then an aluminum ink composition is printed on the back of the silicon wafer to form the back contact electrode. The back contact electrode is sintered to produce an ohmic contact between the electrode and the P-type silicon layer. The aluminum ink composition may include aluminum powders, a vehicle, an inorganic polymer, and a dispersant. Other electrodes on the solar cell can be produced in a similar manner with the aluminum ink composition.
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公开(公告)号：EP2412007B1
公开(公告)日：2020-07-22
申请号：EP10756901.4
申请日：2010-03-26
发明人： YANIV, Zvi , YANG, Mohshi , LAXTON, Peter B.
IPC分类号： B22F3/105 , B22F7/04 , B23K26/34 , H01L21/288 , B23K35/02 , H05K3/12 , H01L21/48 , B23K26/32 , H01L21/268 , H05K3/46 , H01L21/768 , B23K101/36 , B23K103/00
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5.发明授权ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS 有权溶剂和水基金属导电油墨的添加剂和改性剂
公开(公告)号：EP2253002B1
公开(公告)日：2017-12-13
申请号：EP09717000.5
申请日：2009-03-02
CPC分类号： H01B1/22 , C09D11/101 , C09D11/52 , H05K1/097
摘要： A conductive ink includes metallic nanoparticles, a polymeric dispersant, and a solvent. The polymeric dispersant may be ionic, non-ionic, or any combination of ionic and non-ionic polymeric dispersants. The solvent may include water, an organic solvent, or any combination thereof. The conductive ink may include a stabilizing agent, an adhesion promoter, a surface tension modifier, a defoaming agent, a leveling additive, a rheology modifier, a wetting agent, an ionic strength modifier, or any combination thereof.
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