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公开(公告)号：EP3287549A1
公开(公告)日：2018-02-28
申请号：EP16185395.7
申请日：2016-08-23
发明人： WEINHOLD, Ray , SCHMITT, Bernd
CPC分类号： C25D17/001 , C25D17/10 , C25D17/12
摘要： The present invention refers to an anode providing improved coatings during electroplating, a module containing said anode and a treatment device containing said anode or module. Furthermore, the present invention refers to a method providing an improved coating using electroplating. Additionally, the present invention refers to the use of the inventive anode for electroplating.
摘要翻译： 本发明涉及在电镀期间提供改进的涂层的阳极，包含所述阳极的模块和包含所述阳极或模块的处理装置。 此外，本发明涉及使用电镀提供改进的涂层的方法。 另外，本发明涉及本发明的阳极用于电镀的用途。
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公开(公告)号：EP3309279B1
公开(公告)日：2020-07-15
申请号：EP16193990.5
申请日：2016-10-14
IPC分类号： C25D17/00 , C25D17/06 , H01L21/677 , H01L21/683 , C25F1/00 , C23C18/16 , C23F1/00
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公开(公告)号：EP2935660A1
公开(公告)日：2015-10-28
申请号：EP13801546.6
申请日：2013-12-03
发明人： WEINHOLD, Ray , WIENER, Ferdinand
摘要： The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate wherein the device comprises at least a first device element and a second device element, which are arranged in a vertical manner parallel to each other, wherein the first device element comprises at least a first anode element having a plurality of through-going conduits and at least a first carrier element having a plurality of through-going conduits, wherein said at least first anode element and said at least first carrier element are firmly connected to each other; and wherein the second device element comprises at least a first substrate holder which is adapted to receive at least a first substrate to be treated, wherein said at least first substrate holder is at least partially surrounding the at least first substrate to be treated along its outer frame after receiving it; and wherein the distance between the first anode element of the at least first device element and the at least first substrate holder of the second device element ranges from 2 to 15 mm. Further, the present invention is generally directed to a method for vertical galvanic metal deposition on a substrate using such a device.
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公开(公告)号：EP3384071B1
公开(公告)日：2020-06-03
申请号：EP16805782.6
申请日：2016-12-01
发明人： WEINHOLD, Ray , KIRBACH, Uwe
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5.发明授权DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE 有权VORRICHTUNG ZUR VERTIKALEN GALVANISCHEN METALLABSCHEIDUNG AUF EINEM SUBSTRAT
公开(公告)号：EP2935660B1
公开(公告)日：2016-06-15
申请号：EP13801546.6
申请日：2013-12-03
发明人： WEINHOLD, Ray , WIENER, Ferdinand
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公开(公告)号：EP2904133A1
公开(公告)日：2015-08-12
申请号：EP13765337.4
申请日：2013-09-16
CPC分类号： C25D17/06 , C25D7/12 , C25D17/001 , C25D17/004 , H05K3/007 , Y10T29/49117
摘要： A holding device for a treatment of a product (5), which holding device comprises a first holding part (41) and a second holding part (42). The first holding part (41) comprises at least one first electrical contact element (13) for establishing a contact with a first side (6) of the product (5). The second holding part (42) comprises at least one second electrical contact element (14) for establishing a contact with a second side (7) of the product (5), which second side that lies opposite the first side (6). The first holding part (41) and the second holding part (42) are arranged in such a way that they can be fastened to one another in a detachable manner for the purpose of holding the product (5). A product seal (15, 16) and a housing seal (17) provide a sealing arrangement to prevent the penetration of fluid into the at least one first electrical contact element (13) and the at least one second electrical contact element (14) in a treatment state.
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公开(公告)号：EP3384071A1
公开(公告)日：2018-10-10
申请号：EP16805782.6
申请日：2016-12-01
发明人： WEINHOLD, Ray , KIRBACH, Uwe
摘要： This invention concerns a method for galvanic metal deposition of a substrate using an anode and an electrolyte, wherein from each of a plurality of electrolyte nozzles a locally confined electrolyte stream is directed towards a part of a substrate surface which is to be treated, wherein a relative movement is carried out between the substrate and the electrolyte stream during deposition, characterized in that a first movement is carried out along a first path, wherein at least along a part of the first path a second movement is carried out along a second path, wherein the first and the second movement each are relative movements between the electrolyte stream and the substrate. Further, the invention concerns a substrate holder reception apparatus and an electrochemical treatment apparatus.
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公开(公告)号：EP3309279A1
公开(公告)日：2018-04-18
申请号：EP16193990.5
申请日：2016-10-14
IPC分类号： C25D17/00 , C25D17/06 , H01L21/677 , H01L21/683 , C25F1/00 , C23C18/16 , C23F1/00
摘要： The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.
摘要翻译： 本发明涉及一种使用触摸抓取器和非接触式抓取器来处理晶片状基底的方法。 此外，本发明涉及一种用于处理包含触摸抓取器和非接触式抓取器的晶片状基底的设备。 另外，本发明涉及使用本发明的装置来处理晶片状基底。
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公开(公告)号：EP2904133B1
公开(公告)日：2018-02-21
申请号：EP13765337.4
申请日：2013-09-16
CPC分类号： C25D17/06 , C25D7/12 , C25D17/001 , C25D17/004 , H05K3/007 , Y10T29/49117
摘要： A holding device for a treatment of a product (5), which holding device comprises a first holding part (41) and a second holding part (42). The first holding part (41) comprises at least one first electrical contact element (13) for establishing a contact with a first side (6) of the product (5). The second holding part (42) comprises at least one second electrical contact element (14) for establishing a contact with a second side (7) of the product (5), which second side that lies opposite the first side (6). The first holding part (41) and the second holding part (42) are arranged in such a way that they can be fastened to one another in a detachable manner for the purpose of holding the product (5). A product seal (15, 16) and a housing seal (17) provide a sealing arrangement to prevent the penetration of fluid into the at least one first electrical contact element (13) and the at least one second electrical contact element (14) in a treatment state.
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