公开(公告)号：EP0880792B1

公开(公告)日：2002-06-05

申请号：EP97906646.1

申请日：1997-02-14

申请人： Axcelis Technologies, Inc.

发明人： ROSE, Peter, John ,  BRAILOVE, Adam, A.

IPC分类号： H01J37/18 ,  H01J37/317 ,  H01L21/00

CPC分类号： H01L21/67109 ,  H01J27/14 ,  H01J37/08 ,  H01J37/18 ,  H01J37/3002 ,  H01J37/3007 ,  H01J37/3171 ,  H01J2237/022 ,  H01J2237/083 ,  H01J2237/184 ,  H01J2237/2001 ,  H01J2237/2007 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31705 ,  H01L21/67069 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67778 ,  H01L21/6838

摘要： The present invention provides a loadlock assembly for a high throughput ion implantation system that rapidly and efficiently processes large quantities of workpieces, such as flat panel displays. The loadlock assembly (310) increases the throughput of the implantation system by continuously cycling workpieces through the process chamber (318), thus increasing the system's throughput. The loadlock assembly includes a plurality of loadlock stacking elements (354) that are axially positioned relative to each other to form a stacked array of loadlocks. Additionally, the loadlocks of the array are configured to nest with an adjacent loadlock to form a stackable and nestable loadlock assembly.

公开(公告)号：EP0880798B1

公开(公告)日：2004-09-22

申请号：EP97908672.5

申请日：1997-02-14

申请人： Axcelis Technologies, Inc.

发明人： BRAILOVE, Adam, A. ,  ROSE, Peter, H. ,  BLAKE, Julian, G. ,  YANG, Zhongmin ,  PURSER, Kenneth, H.

IPC分类号： H01L21/00 ,  H01J37/317

CPC分类号： H01L21/67109 ,  H01J27/14 ,  H01J37/08 ,  H01J37/18 ,  H01J37/3002 ,  H01J37/3007 ,  H01J37/304 ,  H01J37/3171 ,  H01J2237/022 ,  H01J2237/083 ,  H01J2237/184 ,  H01J2237/2001 ,  H01J2237/2007 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31705 ,  H01L21/67069 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67778 ,  H01L21/6838

摘要： A system and method for conductively and/or convectively transferring heat away from a workpiece that has been processed by a processing system, such as an ion implantation system. The conductive transfer of heat from the workpiece is effectuated by disposing the workpiece in relatively close proximity with a floor of a load lock, which is maintained at a relatively cool temperature. The chamber pressure is disposed at a selected pressure by a pressure regulator and a vacuum pressure is applied to the backside of the workpiece closest to draw the workpiece into contact with the chamber floor, thereby effecting heat transfer from the workpiece to the cooling surface.

公开(公告)号：EP0880793B1

公开(公告)日：2000-09-06

申请号：EP97906006.8

申请日：1997-02-14

申请人： Axcelis Technologies, Inc.

发明人： BLAKE, Julian, G. ,  PURSER, Kenneth, H. ,  BRAILOVE, Adam, A. ,  ROSE, Peter, H. ,  HUGHEY, Barbara, J.

IPC分类号： H01J37/30 ,  H01J37/317

CPC分类号： H01L21/67109 ,  H01J27/14 ,  H01J37/3007 ,  H01J37/3171 ,  H01J2237/083 ,  H01J2237/31701 ,  H01L21/67069 ,  H01L21/67778

公开(公告)号：EP0932911B1

公开(公告)日：2003-04-16

申请号：EP97907647.8

申请日：1997-02-14

申请人： Axcelis Technologies, Inc.

发明人： BLAKE, Julian, G. ,  SFERLAZZO, Piero ,  ROSE, Peter, H. ,  BRAILOVE, Adam, A.

IPC分类号： H01J37/304 ,  H01J37/317

CPC分类号： H01L21/67109 ,  H01J27/14 ,  H01J37/08 ,  H01J37/18 ,  H01J37/3002 ,  H01J37/3007 ,  H01J37/304 ,  H01J37/3171 ,  H01J2237/022 ,  H01J2237/083 ,  H01J2237/184 ,  H01J2237/2001 ,  H01J2237/2007 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31705 ,  H01L21/67069 ,  H01L21/67739 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67778 ,  H01L21/6838