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    DAMAGE SENSORS AND PROCESSING ARRANGEMENTS THEREFOR
    1.
    发明公开
    DAMAGE SENSORS AND PROCESSING ARRANGEMENTS THEREFOR 审中-公开
    BESCHÄDIGUNGSSENSORUND VERARBEITUNGSANORDNUNGENDAFÜR

    公开(公告)号：EP2291630A1

    公开(公告)日：2011-03-09

    申请号：EP09754135.3

    申请日：2009-05-21

    Applicant: BAE Systems PLC

    Inventor： SIDHU, Jagit ,  FOOTE, Peter, David

    IPC: G01M5/00 ,  G01B7/16 ,  G01N3/06

    CPC classification number: G01B7/16 ,  G01M5/00 ,  G01N2203/0244 ,  G01N2203/0617

    Abstract: A damage sensing system, and a method of sensing damage using the system, are described. The system comprises: a plurality of tuned circuits arranged in parallel, each tuned circuit having a different resonant frequency; and processing means for discriminating the response of the different tuned circuits according to their respective different resonant frequencies, for example by processing changes in the respective Q-factors of the respective tuned circuits; wherein each of the plurality of tuned circuits comprises a respective damage sensor, each damage sensor comprising at least one direct write resistive element applied to an area of a substrate by a direct write process. Each tuned circuit may comprise a common resistor in series with the respective damage sensor. The plurality of the tuned circuits may be coupled to the processing means by a shared single pair of external connections.

    Abstract translation: 描述了损伤感测系统以及使用该系统感测损坏的方法。 该系统包括：并联布置的多个调谐电路，每个调谐电路具有不同的谐振频率; 以及处理装置，用于根据各自不同的谐振频率来鉴别不同调谐电路的响应，例如通过处理各个调谐电路的各个Q因子的变化; 其中所述多个调谐电路中的每一个包括相应的损伤传感器，每个损伤传感器包括通过直接写入过程施加到衬底的区域的至少一个直接写入电阻元件。 每个调谐电路可以包括与相应的损伤传感器串联的公共电阻器。 多个调谐电路可以通过共享的一对外部连接耦合到处理装置。

    DAMAGE SENSORS AND PROCESSING ARRANGEMENTS THEREFOR
    2.
    发明公开
    DAMAGE SENSORS AND PROCESSING ARRANGEMENTS THEREFOR 审中-公开
    损坏传感器和处理安排THEREFOR

    公开(公告)号：EP2291629A1

    公开(公告)日：2011-03-09

    申请号：EP09754133.8

    申请日：2009-05-21

    Applicant: BAE Systems PLC

    Inventor： SIDHU, Jagit ,  FOOTE, Peter, David

    IPC: G01M5/00

    CPC classification number: G01M5/0033 ,  G01M5/0083

    Abstract: A damage sensor, for example a crack gauge, a method of providing the same, and a method of sensing damage using the same, are described. The damage sensor comprises at least one direct write resistive element applied to an area of a substrate by a direct write process. Conductive tracks may be connected along two separated portions of the perimeter of the area of the direct write resistive element. The damage sensor may comprise plural direct write resistive elements, for example rectangular-shaped elements, each extending between and connected to two conducting tracks. In a further damage sensor, plural annular resistive elements are positioned in an annular arrangement with respect to each other. In all the damage sensors, the resistive elements may be applied around a hole in a substrate, or extending over a bonded edge between two substrates.

    IMPROVEMENTS RELATING TO ADDITIVE MANUFACTURING PROCESSES
    3.
    发明公开
    IMPROVEMENTS RELATING TO ADDITIVE MANUFACTURING PROCESSES 有权
    的改进相对于添加剂制造加工过程

    公开(公告)号：EP2351472A1

    公开(公告)日：2011-08-03

    申请号：EP09744438.4

    申请日：2009-10-28

    Applicant: BAE Systems PLC

    Inventor： SIDHU, Jagit

    IPC: H05K3/24 ,  C25D5/04

    CPC classification number: C25D5/04 ,  B33Y10/00 ,  B33Y30/00 ,  C25D5/02 ,  H05K3/1241 ,  H05K3/188 ,  H05K3/241 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0195 ,  H05K2203/092 ,  H05K2203/101

    Abstract: A method of and apparatus for forming components on a substrate. The method comprise in a first step applying a surface treatment to said substrate to form a patterned area having at least some electrical conductivity; in a second step electroplating onto the patterned area by means of a tool comprising a first electrode and a source for in situ supply of electrolyte, by providing an anode current to the first electrode, causing the patterned area at least in the vicinity of the tool to function as a cathode, and passing electrolyte between said patterned area and said first electrode, thereby to deposit conductive material onto said patterned area. The apparatus implements the method. Conductive material may be built up to an extent that the component so formed approximates to the bulk properties of the conductive material. The surface treatment itself therefore is not required to create good conduction properties.

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