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公开(公告)号：EP4172593A1
公开(公告)日：2023-05-03
申请号：EP21740175.1
申请日：2021-06-28
Applicant: BAE SYSTEMS plc
Inventor： STURLAND, Ian Michael , FIGGURES, Christopher Colin
IPC: G01N17/04
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公开(公告)号：EP2504273B1
公开(公告)日：2016-01-27
申请号：EP10785498.6
申请日：2010-11-22
Applicant: BAE Systems PLC
Inventor： HUCKER, Martyn John , STURLAND, Ian Michael , ELEY, Rebecka
IPC: B81B3/00 , H01L41/09 , H01L41/313
CPC classification number: H01L41/313 , B81B3/0021 , B81B2201/032 , B81B2203/0118 , B81B2203/051 , H01L41/096
Abstract: A MEMS device (e.g. a piezoelectric actuator), and method of fabrication thereof, having a moveable portion comprising a layer of material (6) (e.g. a substrate layer formed from a substrate wafer) having relatively low rigidity in a direction in the plane of a surface of the layer of material (6), and relatively high rigidity in a direction through the plane; wherein the relatively low rigidity is provided by ridges and grooves (60) in a further surface of the layer of material (6), the further surface of the material (6) being substantially perpendicular to the direction in the plane. The MEMS device may comprise a layer of piezoelectric material (2) bonded to the surface of the layer of material (6). Actuation of the MEMS device (e.g. actuation in the plane of the surface of the layer of material (6)) may be performed by applying an electrical field across the piezoelectric material.
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公开(公告)号：EP2504274B1
公开(公告)日：2016-04-20
申请号：EP10787532.0
申请日：2010-11-22
Applicant: BAE Systems PLC
Inventor： ELEY, Rebecka , HUCKER, Martyn John , STURLAND, Ian Michael
CPC classification number: H02N2/043 , B81B3/0021 , B81B2201/032 , B81B2203/0109 , H01L41/0933 , H01L41/22
Abstract: A MEMS device, and method of fabrication thereof, comprising: a wall arranged as a closed loop(for example, comprising a plurality of interconnected lengths (11-18)); and a bridging portion (54) having two ends and an intermediate portion between these ends; the bridging portion (54) is connected at one end to a first portion of the wall and at the other end to a second portion of the wall non-contiguous to the first; whereby when the intermediate portion is displaced in a direction through a plane defined between the two ends, the portions of the wall connected to the bridging portion (54) are each displaced in a respective direction in the plane, and at least one further portion of the wall is displaced in a direction that is in the plane and that is different to the directions that the two portions connected to the bridging portion (54) are displaced in.
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Patent Agency Ranking
公开(公告)号：EP2504273A1
公开(公告)日：2012-10-03
申请号：EP10785498.6
申请日：2010-11-22
Applicant: BAE Systems Plc.
Inventor： HUCKER, Martyn John , STURLAND, Ian Michael , ELEY, Rebecka
CPC classification number: H01L41/313 , B81B3/0021 , B81B2201/032 , B81B2203/0118 , B81B2203/051 , H01L41/096
Abstract: A MEMS device (e.g. a piezoelectric actuator), and method of fabrication thereof, having a moveable portion comprising a layer of material (6) (e.g. a substrate layer formed from a substrate wafer) having relatively low rigidity in a direction in the plane of a surface of the layer of material (6), and relatively high rigidity in a direction through the plane; wherein the relatively low rigidity is provided by ridges and grooves (60) in a further surface of the layer of material (6), the further surface of the material (6) being substantially perpendicular to the direction in the plane. The MEMS device may comprise a layer of piezoelectric material (2) bonded to the surface of the layer of material (6). Actuation of the MEMS device (e.g. actuation in the plane of the surface of the layer of material (6)) may be performed by applying an electrical field across the piezoelectric material.
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公开(公告)号：EP4158310A1
公开(公告)日：2023-04-05
申请号：EP21730273.6
申请日：2021-05-26
Applicant: BAE SYSTEMS plc
Inventor： ELEY, Rebecka , BALMOND, Mark, David , FIGGURES, Christopher, Colin , STURLAND, Ian Michael , CHURCH, Simon Robert
IPC: G01N17/04
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公开(公告)号：EP2504274A1
公开(公告)日：2012-10-03
申请号：EP10787532.0
申请日：2010-11-22
Applicant: BAE Systems Plc.
Inventor： ELEY, Rebecka , HUCKER, Martyn John , STURLAND, Ian Michael
CPC classification number: H02N2/043 , B81B3/0021 , B81B2201/032 , B81B2203/0109 , H01L41/0933 , H01L41/22
Abstract: A MEMS device, and method of fabrication thereof, comprising: a wall arranged as a closed loop(for example, comprising a plurality of interconnected lengths (11-18)); and a bridging portion (54) having two ends and an intermediate portion between these ends; the bridging portion (54) is connected at one end to a first portion of the wall and at the other end to a second portion of the wall non-contiguous to the first; whereby when the intermediate portion is displaced in a direction through a plane defined between the two ends, the portions of the wall connected to the bridging portion (54) are each displaced in a respective direction in the plane, and at least one further portion of the wall is displaced in a direction that is in the plane and that is different to the directions that the two portions connected to the bridging portion (54) are displaced in.
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公开(公告)号：EP2126155B1
公开(公告)日：2019-03-13
申请号：EP07824741.8
申请日：2007-11-28
Applicant: BAE Systems PLC
Inventor： STURLAND, Ian Michael , HAWKE, Tracey Anne
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公开(公告)号：EP2126155A1
公开(公告)日：2009-12-02
申请号：EP07824741.8
申请日：2007-11-28
Applicant: BAE Systems PLC
Inventor： STURLAND, Ian Michael , HAWKE, Tracey Anne
CPC classification number: G01C19/5684 , B01J20/02 , B01J20/28011 , B01J20/28026 , B01J20/28033 , B01J20/28035 , B01J20/28057 , B01J20/3204 , B01J20/3217 , B01J20/3236 , B01J20/3289 , B81B7/0038 , C23C14/16 , C23C14/34 , C23C14/54 , Y10T428/24942 , Y10T428/24992
Abstract: Improved thin film getter devices (300, 500) comprise a layer (350, 550) of getter material deposited on a substrate (320, 520). The layer has a main portion (340, 540) and a cap portion (360, 560), which forms an external surface of the device. The cap portion has a lower specific area than the main portion.
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