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    Circuit pattern forming method and circuit pattern forming device
    1.
    发明公开
    Circuit pattern forming method and circuit pattern forming device 审中-公开
    Verfahren und Vorrichtung zur Bildung eines Schaltkreises

    公开(公告)号：EP1737285A2

    公开(公告)日：2006-12-27

    申请号：EP06012740.4

    申请日：2006-06-21

    申请人： CANON KABUSHIKI KAISHA

    发明人： Mori, Takashi Canon K.K. ,  Tsuruoka, Yuji Canon K.K. ,  Furukawa, Masao Canon K.K. ,  Kamiya, Seiichi Canon K.K. ,  Yamaguchi, Nobuhito Canon K.K.

    IPC分类号： H05K3/12

    CPC分类号： H05K3/125 ,  H05K3/4647 ,  H05K2203/013 ,  H05K2203/1476

    摘要： The present invention provides a circuit pattern forming device and a circuit pattern forming method both of which can eliminate problems, such as open circuits and short circuits, when forming circuit patterns on the substrate and which can form circuit patterns of a thin film uniform in thickness. To this end, the present invention forms liquid dots (12) on the substrate (1) with gaps (17) between the dots. Then, it further forms liquid dots between the liquid dots (12), thus forming a liquid circuit pattern. The circuit pattern is then solidified by a fixing step.

    摘要翻译： 本发明提供一种电路图案形成装置和电路图案形成方法，当在基板上形成电路图形时，可以消除开路和短路等问题，并且可以形成厚度均匀的薄膜的电路图案 。 为此，本发明在基板（1）上形成在点之间具有间隙（17）的液体点（12）。 然后，在液体点（12）之间进一步形成液体点，从而形成液体电路图案。 然后通过固定步骤使电路图形固化。

    Circuit pattern forming method, circuit pattern forming device and printed circuit board
    3.
    发明公开
    Circuit pattern forming method, circuit pattern forming device and printed circuit board 审中-公开
    Verfahren und Vorrichtung zur Bildung eines Schaltkreises und Leiterplatte

    公开(公告)号：EP1737284A2

    公开(公告)日：2006-12-27

    申请号：EP06012739.6

    申请日：2006-06-21

    申请人： CANON KABUSHIKI KAISHA

    发明人： Furukawa, Masao Canon K.K. ,  Tsuruoka, Yuji Canon K.K. ,  Mori, Takashi Canon K.K. ,  Yamaguchi, Nobuhito Canon K.K. ,  Kamiya, Seiichi Canon K.K.

    IPC分类号： H05K3/12

    CPC分类号： H05K3/125 ,  H05K3/245 ,  H05K3/4664 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/1476 ,  Y10S428/901

    摘要： A circuit pattern forming method is provided which can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern and thereby can form a highly reliable printed circuit board. To that end, this invention overlappingly draws a conductive pattern (11) and an insulating pattern (13) of a predetermined thickness by scanning a liquid ejection head and a substrate (10) relative to each other a plurality of times while ejecting droplets of a conductive pattern forming solution (11) and an insulating pattern forming solution (13). When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times until the conductive pattern has a predetermined thickness.

    摘要翻译： 提供一种电路图案形成方法，其可以减少在制造导电图案时形成的卫星在电路中产生不期望的短路的可能性，从而可以形成高度可靠的印刷电路板。 为此，本发明通过多次扫描液体喷射头和基板（10），同时喷射液滴的液滴而重叠地绘制具有预定厚度的导电图案（11）和绝缘图案（13） 导电图案形成溶液（11）和绝缘图案形成溶液（13）。 当在衬底上形成彼此相邻的导电图案和绝缘图案时，在多次执行的导电图案形成步骤之间执行形成至少一次扫描的绝缘图案的步骤，直到导电图案具有 预定厚度。