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84 条记录 (耗时 0.014 秒)

    Labeling apparatus
    2.
    发明授权
    Labeling apparatus 有权
    标签

    公开(公告)号：EP1771340B1

    公开(公告)日：2011-08-03

    申请号：EP06774053.0

    申请日：2006-06-27

    申请人： NORDSON CORPORATION

    发明人： FORT, Wesley, C. ,  VARGA, Leslie, J. ,  LINGIER, Eric

    IPC分类号： B65C9/22

    CPC分类号： B65C9/2221 ,  B65C9/2208 ,  B65C9/2217 ,  Y10T156/10 ,  Y10T156/1062 ,  Y10T156/1374 ,  Y10T156/1798

    摘要： A labeling apparatus (38) and method for applying individual labels (44) onto individual objects (52) moving along a conveyor (50) includes a label delivery mechanism (40) configured to hold a plurality of the labels (44) and operable to deliver individual ones of the labels (44) adjacent to the conveyor (50). A non-contact adhesive spray applicator (42) including at least one nozzle (144) having a plurality of individual adhesive discharge orifices (146) may be positioned and arranged to discharge adhesive from the orifices (146) onto either the labels (44) or the objects (52) such that the labels (44) may be respectively adhered to the objects (52).

    EDGE BANDING APPARATUS AND METHOD
    3.
    发明公开
    EDGE BANDING APPARATUS AND METHOD 审中-公开
    KANTENLAMINIERUNGS-VORRICHTUNG UND VERFAHREN

    公开(公告)号：EP1216090A4

    公开(公告)日：2007-10-17

    申请号：EP00960195

    申请日：2000-07-27

    申请人： CASTLE INC

    发明人： DURNEY MAX W ,  COLE DAVID P

    IPC分类号： B05B15/04 ,  B26D1/20 ,  B26D5/12 ,  B26D5/38 ,  B26D7/22 ,  B27D5/00 ,  B29C63/00 ,  B01F3/04 ,  B32B31/00 ,  B65H29/00

    CPC分类号： B26D7/22 ,  B05B15/0456 ,  B26D1/205 ,  B26D5/12 ,  B26D5/38 ,  B27D5/003 ,  B29C63/003 ,  Y10S118/03 ,  Y10S156/908 ,  Y10T156/1343 ,  Y10T156/1374

    摘要： An edge banding apparatus (21) for adhesively securing banding material (28) to an edge of a board (27). The apparatus (21) includes a board support structure (22) formed to support a board (26) in a near vertical orientation with the edge (27) to be banded in a downwardly facing orientation. An adhesive applying assembly (23) is positioned relative to the board support structure (22) and is formed to apply adhesive (54) to the downwardly facing edge (27) during relative motion between the board (26) and the adhesive applying assembly (23). The apparatus (21) includes a banding material applying assembly (24) positioned downstream of the adhesive applying assembly (23) and formed to apply a banding material (28) to the edge after the adhesive (54) is applied and a cutoff assembly (25) which cuts off the banding material (28) as the banded board (26) passes the cutoff device (25). Pneumatic adhesive level sensing assembly (71) and a pneumatic adhesive refilling assembly are both disclosed, as is a method of edge banding a board (26).

    摘要翻译： 一种用于将带状材料（28）粘附固定到板（27）的边缘上的封边装置（21）。 装置（21）包括板支撑结构（22），该板支撑结构（22）形成为以接近垂直的方向支撑板（26），边缘（27）以面朝下的方向被结合。 粘合剂施加组件（23）相对于板支撑结构（22）定位并且被形成为在板（26）和粘合剂施加组件之间的相对运动期间将粘合剂（54）施加到面向下的边缘（27） 23）。 装置（21）包括位于粘合剂施加组件（23）下游的带状材料施加组件（24），并且被形成为在施加粘合剂（54）之后将带状材料（28）施加到边缘，并且切割组件 25），当带状板（26）通过切断装置（25）时切断捆扎材料（28）。 披露了气动粘合剂水平传感组件（71）和气动粘合剂再填充组件，以及边缘绑定板（26）的方法。

    EDGE BANDING APPARATUS AND METHOD
    6.
    发明公开
    EDGE BANDING APPARATUS AND METHOD 审中-公开
    边带装置和方法

    公开(公告)号：EP1216090A1

    公开(公告)日：2002-06-26

    申请号：EP00960195.6

    申请日：2000-07-27

    申请人： Castle Inc.

    发明人： DURNEY, Max, W. ,  COLE, David, P.

    IPC分类号： B01F3/04 ,  B32B31/00 ,  B65H29/00

    CPC分类号： B26D7/22 ,  B05B12/24 ,  B26D1/205 ,  B26D5/12 ,  B26D5/38 ,  B27D5/003 ,  B29C63/003 ,  Y10S118/03 ,  Y10S156/908 ,  Y10T156/1343 ,  Y10T156/1374

    摘要： An edge banding apparatus (21) for adhesively securing banding material (28) to an edge of a board (27). The apparatus (21) includes a board support structure (22) formed to support a board (26) in a near vertical orientation with the edge (27) to be banded in a downwardly facing orientation. An adhesive applying assembly (23) is positioned relative to the board support structure (22) and is formed to apply adhesive (54) to the downwardly facing edge (27) during relative motion between the board (26) and the adhesive applying assembly (23). The apparatus (21) includes a banding material applying assembly (24) positioned downstream of the adhesive applying assembly (23) and formed to apply a banding material (28) to the edge after the adhesive (54) is applied and a cutoff assembly (25) which cuts off the banding material (28) as the banded board (26) passes the cutoff device (25). Pneumatic adhesive level sensing assembly (71) and a pneumatic adhesive refilling assembly are both disclosed, as is a method of edge banding a board (26).

    摘要翻译： 一种用于将带状材料（28）粘附固定到板（27）的边缘上的封边装置（21）。 装置（21）包括板支撑结构（22），该板支撑结构（22）形成为以接近垂直的方向支撑板（26），边缘（27）以面朝下的方向被结合。 粘合剂施加组件（23）相对于板支撑结构（22）定位并且被形成为在板（26）和粘合剂施加组件之间的相对运动期间将粘合剂（54）施加到面向下的边缘（27） 23）。 装置（21）包括位于粘合剂施加组件（23）下游的带状材料施加组件（24），并且被形成为在施加粘合剂（54）之后将带状材料（28）施加到边缘，并且切割组件 25），当带状板（26）通过切断装置（25）时切断捆扎材料（28）。 披露了气动粘合剂水平传感组件（71）和气动粘合剂再填充组件，以及边缘绑定板（26）的方法。

    Member separating apparatus and processing apparatus
    8.
    发明公开
    Member separating apparatus and processing apparatus 审中-公开
    Vorrichtung zum Trennen von Elementen und Herstellungsvorrichtung

    公开(公告)号：EP0948032A2

    公开(公告)日：1999-10-06

    申请号：EP99302393.6

    申请日：1999-03-29

    申请人： CANON KABUSHIKI KAISHA

    发明人： Sakaguchi, Kiyofumi, c/o Canon Kabushiki Kaisha ,  Omi, Kazuaki, c/o Canon Kabushiki Kaisha ,  Miyakogawa, Toshikazu, c/o Canon Kabushiki Kaisha ,  Yonehara, Takao, c/o Canon Kabushiki Kaisha ,  Yanagita, Kazutaka, c/o Canon Kabushiki Kaisha

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67092 ,  H01L21/76259 ,  Y10T83/364 ,  Y10T156/1374 ,  Y10T156/17 ,  Y10T156/1922 ,  Y10T156/1928

    摘要： This invention is to prevent a substrate from dropping when it is transferred/received to/from a separating apparatus. The support surfaces of substrate holding portions (22, 23) are made horizontal, and a substrate (21) to be separated is mounted on one substrate holding portion (22) in a horizontal state (2A). The substrate holding portions (22, 23) are pivoted about rotary shafts (26, 27), respectively, to make the support surfaces of the substrate holding portions (22, 23) vertical so that the substrate (21) is sandwiched by the substrate holding portions (22, 23) (2B). The substrate holding portions (22, 23) are rotated about rotary shafts (24, 25), respectively, and simultaneously, high-pressure, high-speed water is ejected from an ejection nozzle (28) to separate the substrate (21) into two substrates (21a, 21c). The substrate holding portions (22, 23) are pivoted about the rotary shafts (26, 27), respectively, to make the support surfaces horizontal (2C). With this arrangement, the substrate can be supported from the lower side and transferred in the horizontal state.

    摘要翻译： 本发明是为了防止当基板从分离装置传送/接收时掉落。 衬底保持部分（22,23）的支撑表面是水平的，并且待分离的衬底（21）以水平状态（2A）安装在一个衬底保持部分（22）上。 基板保持部分（22,23）分别围绕旋转轴（26,27）枢转，以使基板保持部分（22,23）的支撑表面垂直，使得基板（21）被基板 保持部（22,23）（2B）。 基板保持部分（22,23）分别围绕旋转轴（24,25）旋转，并且同时从喷嘴（28）喷出高压高速水以将基板（21）分离成 两个基板（21a，21c）。 基板保持部分（22,23）分别围绕旋转轴（26,27）枢转，以使支撑表面水平（2C）。 通过这种布置，基板可以从下侧被支撑并且以水平状态传送。