摘要:
The invention concerns a method wherein a useful layer (1) is initially connected by a sacrificial layer (2) to a layer (3) constituting a substrate. Prior to etching of the sacrificial layer (2), at least part of the surface (4, 5) of at least one of the layers in contact with the sacrificial layer (2) is doped. After etching of the sacrificial layer (2), the surface (4, 5) is superficially etched, so as to increase the roughness of its doped part. Prior to doping, a mask (9) is deposited on part of the useful layer (1) so as to delimit a doped region and a non-doped region of the surface (4, 5), one of the regions constituting a stop after the surface etching phase.
摘要:
The invention relates to level realignment following an epitaxy step on a face (31) of a substrate (30), consisting in producing at least one initial reference mark (32) on the face of the substrate, whereby said mark is designed to be transferred during the epitaxy to the surface of the epitaxy layer (36). The initial reference mark (32) is produced such that, during the epitaxy, the edges thereof create growth defects which propagate to the surface of the epitaxy layer (36) in order to provide a transferred reference mark (37) on the surface of the epitaxy layer, which reproduces the shape of the initial reference mark (32) and which is aligned therewith.
摘要:
The invention relates to level realignment following an epitaxy step on a face (31) of a substrate (30), consisting in producing at least one initial reference mark (32) on the face of the substrate, whereby said mark is designed to be transferred during the epitaxy to the surface of the epitaxy layer (36). The initial reference mark (32) is produced such that, during the epitaxy, the edges thereof create growth defects which propagate to the surface of the epitaxy layer (36) in order to provide a transferred reference mark (37) on the surface of the epitaxy layer, which reproduces the shape of the initial reference mark (32) and which is aligned therewith.
摘要:
The invention concerns a method wherein a useful layer (1) is initially connected by a sacrificial layer (2) to a layer (3) constituting a substrate. Prior to etching of the sacrificial layer (2), at least part of the surface (4, 5) of at least one of the layers in contact with the sacrificial layer (2) is doped. After etching of the sacrificial layer (2), the surface (4, 5) is superficially etched, so as to increase the roughness of its doped part. Prior to doping, a mask (9) is deposited on part of the useful layer (1) so as to delimit a doped region and a non-doped region of the surface (4, 5), one of the regions constituting a stop after the surface etching phase.
摘要:
The invention relates to an encapsulated microstructure and to a method of producing one such microstructure. The inventive microstructure comprises a first layer which is insulated from a substrate (6) by an insulting layer (7), said first layer containing: at least one sensitive element (1) which is connected to at least one contact pad (3) by means of an electrical connection (2) and which is protected by a cap (5). According to the invention, the sensitive element (1), the electrical connection (2) and the contact pad (3) form an assembly (10) that is defined in the first layer by at least one channel (11), said assembly (10) being covered by the cap (5). The cap (5), which comprises at least one opening (12) above the contact pad (3), is solidly connected to (i) the contact pad (3) at the periphery of the opening (12) and (ii) an area (9) located beyond the channel (11) in relation to the assembly (10). The invention is suitable for micro-electro-mechanical structures.
摘要:
The invention relates to a method for testing the tightness of a MEMS or of a small encapsulated component, the MEMS or small component being mounted in a cavity of a support. Said cavity is closed by sealing means and contains a gas having a density different than that if it were at the pressure of the medium outside of the cavity. The method comprises a step for measuring the density of the gas contained inside the cavity.
摘要:
The microsystem (1) is made in a planar substrate and includes two oscillating masses (2a, 2b) that are connected to the substrate via suspension springs (3a, 3b). The oscillating masses (2a, 2b) are coupled by a rigid coupling bar (11) so as to make said oscillating masses (2a, 2b) move in phase opposition when they are excited in a predetermined excitation direction (Ox). The coupling bar (11) is connected to intermediate zones of the corresponding suspension springs (3a, 3b), which are located on opposite sides (7a, 7b) of the oscillating masses (2a, 2b). The intermediate zones are located between a first end of the suspension springs (3a, 3b), which is fastened to the corresponding oscillating mass (2a, 2b), and a second end of the suspension springs (3a, 3b), which is fastened to the substrate by a corresponding anchoring point (4a, 4b).
摘要:
The invention essentially relates to a variable-capacity capacitor comprising at least two interdigial combs (102, 104) which are equipped with teeth (108.1, 108.2, 108.3,... 108. n, 109.1, 109.2, 109.3, ...109. n), in which the cross-section of an end of a tooth disposed near the other comb is greater than the cross-section of an end disposed far from the other comb. The invention is particularly for gyrometers and accelerometers.
摘要:
Electrostatic motor and its fabrication process, said electric motor comprising a fixed part (200, 204, 206, 208) called stator with an elastically deformable membrane (208) and a movable part (230) called rotor and arranged on the membrane (208) and moved by means of deformation waves from the elastic membrane, said electric motor being characterized in that it is provided with electrostatic means (204, 205) for deforming the membrane (208).
摘要:
The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.