公开(公告)号：EP2555426A4

公开(公告)日：2017-04-26

申请号：EP11765420

申请日：2011-03-24

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU ,  KOJO YUKA

IPC: H03H9/02 ,  H01L23/04 ,  H01L23/053 ,  H01L23/12 ,  H01L23/13 ,  H01L23/498 ,  H03H9/10 ,  H05K3/34

CPC classification number: H05K5/0091 ,  H01L23/053 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K3/3431 ,  H05K3/3442 ,  H05K5/0095 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10075 ,  Y02P70/613 ,  H01L2924/00

Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal. The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

Abstract translation: 表面安装型电子部件封装的基座保持电子部件元件，并用导电性接合材料安装在电路基板上。 基座具有主表面和用于电连接到电路板的外部连接端子。 外部连接端子形成在主表面中。 基座包括形成在外部连接端子上的凸块。 凸点比外部连接端子小。 基部沿着外部连接端子上的应力的衰减方向在外部连接端子的外周端缘与凸块的外周端缘之间具有距离d。 伴随底座在电路板上的安装而产生应力。 距离d大于0.00mm并且等于或小于0.45mm。

公开(公告)号：EP1187323A4

公开(公告)日：2005-04-06

申请号：EP01908254

申请日：2001-03-02

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU ,  ISHIHARA HIROYUKI ,  OGASAWARA YOSHIKIYO ,  MORI AKIHIRO ,  HIRAO SUSUMU ,  MURAKAMI TATSUYA

IPC: H03H9/13

CPC classification number: H03H9/0509 ,  H03H9/0519 ,  H03H9/131

Abstract: A crystal vibration device comprising a crystal diaphragm formed on the opposite main surfaces thereof with exciting electrodes and extraction electrodes extracted from respective exciting electrodes, and an electrode pad formed on a base and electrically connected with the crystal diaphragm via a silicon-based conductive adhesive. Each of at least extraction electrodes, out of the exciting electrodes and the extraction electrodes, comprises a Cr film layer, an Au film layer, and a Cr thin film layer or an Ag thin film layer sequentially laminated on the crystal diaphragm. The electrode pad comprises a tungsten- or molybdenum-made metallized layer, a Ni film layer and an Au film layer sequentially laminated on the base, and at least a specified region, to which a silicon conductive adhesive is applied, in the Au film layer of the electrode pad is diffused with Ni in the Ni film layer.

公开(公告)号：EP3086471A4

公开(公告)日：2017-04-12

申请号：EP14870753

申请日：2014-12-04

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU ,  KOJO TAKUYA

IPC: H03H9/10 ,  H03B5/32 ,  H03H3/02 ,  H03H9/02 ,  H03H9/05 ,  H03H9/13 ,  H03H9/17

CPC classification number: H03H3/02 ,  H01L2224/16225 ,  H03H9/0561 ,  H03H9/1021 ,  H03H9/1035 ,  H03H9/131 ,  H03H9/17

Abstract: A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation and reduce the size or height. A crystal resonator 101 includes a crystal resonator plate 2, a first sealing member 3 and a second sealing member 4. A sealing-member-side first bonding pattern 321 and a sealing-member-side second bonding pattern 421, both to be bonded to the crystal resonator plate 2, are formed respectively on the first sealing member 3 and the second sealing member 4. On the crystal resonator plate 2, a resonator-plate-side first bonding pattern 251 to be bonded to the first sealing member 3 is formed on a first main surface 211 and a resonator-plate-side second bonding pattern 252 to be bonded to the second sealing member 4 is formed on a second main surface 212. The sealing-member-side first bonding pattern 321 is bonded to the resonator-plate-side first bonding pattern 251, and the sealing-member-side second bonding pattern 421 is bonded to the resonator-plate-side second bonding pattern 252, both by diffusion bonding.