公开(公告)号：EP3366091A1

公开(公告)日：2018-08-29

申请号：EP16787798.4

申请日：2016-10-24

Applicant: Universität des Saarlandes

Inventor： OLBERDING, Simon ,  STEIMLE, Jürgen

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H01G4/33 ,  G09F9/30 ,  G06F3/044 ,  H05K3/00 ,  G06T17/00 ,  H05K1/03 ,  H05K3/12

CPC classification number: H05K1/028 ,  G06F3/044 ,  G06F3/0488 ,  G06F2203/0339 ,  G06F2203/04102 ,  G06T19/00 ,  G06T2219/021 ,  G09F9/301 ,  H03K17/962 ,  H03K2217/960775 ,  H05K1/0326 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/162 ,  H05K3/0005 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10053 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: The invention is directed to an object (2) with a three-dimensional shape made of a folded sheet (4) so as to form at least one face (6), at least one corner (10) and/or at least one edge (8), the object comprising electrically conductive traces (14) printed on the sheet (4); and at least one functional area (12) printed on one of the at least one face (6), adjacent to one of the at least one edge (8), or adjacent to one of the at least one corner (10), the at least one functional area (12) being electrically connected to the conductive traces (14) and forming at least one control for a touch input, for a display output, and/or for sensing a change of shape of the object.

公开(公告)号：EP3163984B1

公开(公告)日：2018-08-08

申请号：EP16195933.3

申请日：2016-10-27

Applicant: Tyco Electronics (Dongguan) Ltd. ,  Tyco Electronics (Shanghai) Co., Ltd. ,  Shenzhen AMI Technology Co. Ltd ,  TE Connectivity Germany GmbH

Inventor： SHEN, Hongzhou ,  ZHANG, Dandan ,  ZENG, Qinglong ,  LU, Roberto Francisco-Yi ,  DUBNICZKI, George

IPC: H05K1/11 ,  C25D5/50 ,  H05K3/34

CPC classification number: H05K3/403 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/08 ,  H05K1/117 ,  H05K3/101 ,  H05K3/3405 ,  H05K2201/09381 ,  H05K2201/09745 ,  H05K2201/10287 ,  H05K2203/0165 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/0392 ,  H05K2203/1105 ,  H05K2203/16

Abstract: The present disclosure discloses pre-tin system shaping system and method. The pre-tin shaping system is adapted to shape a pre-tin on a pad (5) of a circuit board (4). The pre-tin shaping system includes: a board holding unit (2) for securely holding the circuit board; a heat-press unit (1) for performing a heat-press operation to the pre-tin on the pad of the circuit board so as to shape the pre-tin; and a motion unit (3) for moving the heat-press unit relative to the board holding unit; wherein the heat-press unit includes a heat presser (10) for shaping the pre-tin on the pad of the circuit board. With the pre-tin system shaping system and method provided herein, by performing a shaping operation to the pre-tin on the pad of the circuit board, position of an electrical contact on the pad of the circuit board during soldering will be precisely controlled, thereby guaranteeing soldering quality and reducing a risk of dry joint or faulty joint and the like.

公开(公告)号：EP3229564A1

公开(公告)日：2017-10-11

申请号：EP16163665.9

申请日：2016-04-04

Applicant: SICK AG

Inventor： Birkle, Stefan ,  Reichenbach, Hans-Peter

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/111 ,  H05K1/117 ,  H05K1/14 ,  H05K3/3442 ,  H05K3/366 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2203/046 ,  Y02P70/611

Abstract: Leiterplattenanordnung mit mindestens zwei senkrecht zueinander stehenden Leiterplatten (2, 8), wobei eine erste Leiterplatte (2) an einer Seite (4) an einer Leiterplattenkante (3) erste Kontaktflächen (6) aufweist, wobei eine zweite Leiterplatte (8) auf einer Seite (4) zweite Kontaktflächen (10) aufweist, wobei die zweiten Kontaktflächen (10) der zweiten Leiterplatte (8) senkrecht liegend an den ersten Kontaktflächen (6) der ersten Leiterplatte (2) angeordnet sind und die ersten Kontaktflächen (6) der ersten Leiterplatte (2) mit den zweiten Kontaktflächen (10) der zweiten Leiterplatte (8) elektrisch mittels Lötmittel (5) verbunden sind, wobei die Kontaktflächen (6, 10) einer Leiterplatte (2, 8) entlang einer Verbindungsstelle (11) zur anderen Leiterplatte (3) überstehend zu gegenüberliegenden Kontaktflächen (10, 6) der gegenüberliegenden Leiterplatte (8, 2) sind und mindestens die Kontaktflächen (6, 10) einer Leiterplatte (2, 8) sich in Richtung der Verbindungsstelle (11) verjüngen oder verkleinern.

Abstract translation: 具有至少两个互相垂直的印刷电路板的电路板组件（2，8），其中，第一电路板（2）在一侧（4）到电路板的边缘（3）的第一接触表面（6），其中的第二电路板（8）上的一个侧 （4）具有第二接触表面（10），所述第二电路板的第二接触表面（10）（8）被布置垂直位于第一接触表面（6）的第一印刷电路板（2）与所述第一接触表面（6）的所述第一电路基板上 （2）通过焊料（5），其中，所述接触面（6，10）的电路板沿接合处（11）（2,8）的装置（其他印制电路板连接到第二电路板（8）电的第二接触表面（10） 3）站立在相对的接触表面（10，6）相对的电路板（8，2）和至少接触面（6，10）的电路板（2,8）延伸（朝向连接点11） 重新振兴或缩小。

公开(公告)号：EP2973625A4

公开(公告)日：2017-02-22

申请号：EP14774544

申请日：2014-03-13

Applicant: HIQ SOLAR INC

Inventor： WILLIS ANDRE P

IPC: H05K1/11 ,  H01G2/06 ,  H01G4/12 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

公开(公告)号：EP3104671A1

公开(公告)日：2016-12-14

申请号：EP16167926.1

申请日：2016-05-02

Applicant: Joylabz LLC

Inventor： WILCOX, Bryan Randall ,  EDDIE, Todd ,  SILVER, Jay Saul

IPC: H05K1/11 ,  H01R11/30 ,  H01R13/62 ,  H01R12/72 ,  H05K5/00

CPC classification number: H01R13/6205 ,  G06F1/16 ,  H01R11/24 ,  H01R13/6658 ,  H01R2201/06 ,  H05K1/11 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K5/0278 ,  H05K2201/083 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09481 ,  H05K2201/10386

Abstract: Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

Abstract translation: 用于磁耦合的系统和方法。 一个系统包括外部计算设备和具有导电端的连接器。 该系统还包括印刷电路板。 印刷电路板包括与背面相对的连接器侧。 连接器侧具有带孔的接触垫。 印刷电路板还包括位于印刷电路板背面的磁体。 磁体提供磁场，其被配置为向接触接触垫的连接器提供磁力吸引力。 印刷电路板还包括通信终端。 该系统还包括通过连接器和接触垫与印刷电路板通信的电路。

公开(公告)号：EP2914072A1

公开(公告)日：2015-09-02

申请号：EP15156919.1

申请日：2015-02-27

Applicant: Nissin Kogyo Co., Ltd.

Inventor： Miyasaka, Sakae

IPC: H05K3/30 ,  H05K3/34

CPC classification number: B60T15/028 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/09154 ,  H05K2201/09381 ,  H05K2201/10151 ,  H05K2203/048

Abstract: One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer. When the electrode portion is seen from thereabove, an outer circumferential line of the pad touches each of four sides of the land. Exposed portions where the solder layer is exposed are formed individually at four corners of a front surface of the electrode portion. And, the exposed portions are formed to have the same shape.

Abstract translation: 一个实施例提供一种具有基板和设置在基板上的电极部分的电路板。 所述电极部包括：设置在所述基板的前表面上的四边形区域; 焊料层，其层叠在所述焊盘的整个前表面上; 以及与焊料层的前表面接合的焊盘。 当从上方观察电极部分时，焊盘的外周线接触焊盘四面中的每一侧。 焊料层露出的露出部分分别形成在电极部分的前表面的四个角处。 并且，露出部分形成为具有相同的形状。

公开(公告)号：EP2047724B1

公开(公告)日：2010-02-24

申请号：EP07729101.1

申请日：2007-05-14

Applicant: Continental Automotive GmbH

Inventor： FINK, Martin ,  FISCHER, Georg

IPC: H05K3/28

CPC classification number: H05K1/118 ,  B60R16/0215 ,  H05K3/365 ,  H05K2201/09363 ,  H05K2201/09381 ,  H05K2201/099 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The invention relates to a conductor carrier (2) comprising a base insulating film (5), a contact insulating film (3), and at least one first strip conductor and one second strip conductor (4, 6). The contact insulating film (3) comprises at least one first recess and one second recess (8, 10). The strip conductors are embedded between the two insulating films and each form a first overlapping region with the first or second recess (8, 10) of the contact insulating film (3). The conductor carrier (2) also comprises an insulating region (12) which separates the first strip conductor (4) from the second strip conductor (6) in an insulating manner due to the contact insulating film (3) being less raised than outside the insulating region (12), and extends between the first and second recess (8, 10) of the contact insulating film (3) in a meandering manner.

公开(公告)号：EP2084786A4

公开(公告)日：2010-01-20

申请号：EP07844156

申请日：2007-10-11

Applicant: 3M INNOVATIVE PROPERTIES CO

Inventor： SATO YOSHIAKI ,  KAWATE KOHICHIRO ,  HARA TOMIHIRO ,  KIKUCHI NORIKO

IPC: H05K3/36

CPC classification number: H01R4/04 ,  H01R12/52 ,  H01R12/61 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126

公开(公告)号：EP2051339B1

公开(公告)日：2009-12-30

申请号：EP07114688.0

申请日：2007-08-21

Applicant: Giga-Byte Technology Co., Ltd.

Inventor： Lai, Tien-Ko ,  Uang, Muh-Jin ,  Chang, Chia-Cheng

IPC: H01R13/648

CPC classification number: H01R13/6485 ,  H01R12/57 ,  H01T4/08 ,  H05K1/026 ,  H05K1/111 ,  H05K2201/09381 ,  Y02P70/611

公开(公告)号：EP1940207A3

公开(公告)日：2009-11-04

申请号：EP07122615.3

申请日：2007-12-07

Applicant: ROBERT BOSCH GMBH

Inventor： Klein, Christian ,  Finzer, Guido ,  Haalboom, Thomas ,  Haiss, Eberhard

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: Es wird eine elektrische Vorrichtung mit einem Trägerelement (11), insbesondere einer Leiterplatte, vorgeschlagen. Diese Vorrichtung weist zumindest eine auf dem Trägerelement (11) angeordnete Anschlussfläche (16) auf, die zur Kontaktierung eines Bauelements (50) dient. Die Öffnung ist dadurch gekennzeichnet, dass die benetzbare Anschlussfläche (16) jeweils aus zumindest zwei Teilflächen (28, 31) besteht, wobei eine der Teilflächen (28) schmaler als die andere Teilfläche (31) ist.