公开(公告)号：EP2792721A4

公开(公告)日：2015-05-06

申请号：EP12857139

申请日：2012-12-10

Applicant: DEXERIALS CORP

Inventor： ODAKA RYOSUKE ,  SATO DAISUKE

IPC: C09J4/02 ,  C08F220/32 ,  C09J5/06 ,  C09J163/10 ,  H01R11/01 ,  H01R43/00 ,  H05K1/14

CPC classification number: C09J4/00 ,  C08F220/32 ,  C09J4/06 ,  C09J163/10 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221

公开(公告)号：EP2792722A4

公开(公告)日：2015-07-29

申请号：EP12857225

申请日：2012-12-10

Applicant: DEXERIALS CORP

Inventor： SATO DAISUKE ,  ODAKA RYOSUKE

IPC: C09J4/02 ,  C09J4/06 ,  C09J5/00 ,  C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  H01B1/22 ,  H01R11/01 ,  H01R43/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J133/14 ,  C09J2433/00 ,  H01B1/22 ,  H01B13/00 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0425

Abstract: There are provided an electrically conductive adhesive agent capable of providing good electrical continuity to a substrate to which a preflux treatment has been applied, and a method for connecting electronic components. The electrically conductive adhesive agent to be used comprises a polymerizable acrylic compound, an organic peroxide, and the solder particles, said organic peroxide having a one minute half-life temperature lower than the solidus temperature of said solder particles. At the time of thermocompression bonding, the solder particles are crushed and an oxide film is removed, and a preflux layer on the surface of a bump is also removed by melting and flowing thereof, whereby electrical continuity is secured, and then an adhesive component is completely cured.

Abstract translation: 有在能够向基材提供良好的电连续性的导电性粘接剂提供到一个预焊剂处理得到了应用，以及用于连接电子元件的方法。 半衰期导电性粘接剂中使用含有聚合性丙烯酸类化合物的有机过氧化物，和焊料粒子，具有一分钟的温度比所述焊料粒子的固相线温度低于所述有机过氧化物。 在热压接时，焊料颗粒粉碎和在氧化膜被去除，并且因此形成凸块的表面上的预焊剂层通过熔化和它们的流动去除，由此电连续性被固定，然后以粘合剂组分是 彻底治愈电话。