利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.011 秒)

    THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM
    1.
    发明公开
    THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM 有权
    热固性树脂组合物，其固化物，活性酯树脂，半导体密封材料，预浸料坯组装的PCB，建筑和电影

    公开(公告)号：EP2589625A1

    公开(公告)日：2013-05-08

    申请号：EP11800587.5

    申请日：2011-06-08

    申请人： DIC Corporation

    发明人： ARITA Kazuo ,  SUZUKI Etsuko

    IPC分类号： C08L63/00 ,  C08G59/62 ,  C08J5/24 ,  H01B3/40 ,  H05K1/03

    CPC分类号： C08G65/48 ,  C08G59/08 ,  C08G59/42 ,  C08G59/4223 ,  C08G59/4276 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/08 ,  C08L63/00 ,  C08L67/03 ,  C08L71/08 ,  C09D171/08 ,  H01B3/40 ,  H01B3/421 ,  H05K1/0326 ,  H05K3/323 ,  H05K3/4676 ,  H05K2201/012 ,  Y10T428/31511 ,  Y10T428/31529

    摘要： The present invention provides a thermosetting resin composition exhibiting excellent heat resistance and flame retardancy while maintaining a low dielectric constant and low dielectric loss tangent when formed into a cured product, a cured product thereof, an active ester resin which develops these properties, and a semiconductor encapsulating material, a prepreg, a circuit board, and a build-up film which are produced using the composition. A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

    摘要翻译： 本发明提供一种热固性树脂组合物表现出优异的耐热性和阻燃性，同时保持低介电常数和低介电损耗角正切在形成的固化产物，其固化物，以活性酯树脂，其开发出合成的特性，以及半导体 封装材料，预浸料坯，电路板，并且其使用的组合物生产的积聚的电影。 的热固性树脂组合物含有的活性酯树脂（A）和环氧树脂（B）为具有树脂结构，其包括一个polyaryleneoxy结构（I）必要成分，该活性酯树脂（A）和在一个其中芳族羧酸原子 所述polyaryleneoxy结构（I）的多个被通过由结构式1（表示的结构部位（II）连接的worin氩darstellt亚苯基，亚苯基核取代被1至3的烷基基团各自具有1至4个碳原子 ，亚萘基，或亚萘基的核取代被1至3的烷基基团各自具有1至4个碳原子）。

    ACTIVE ESTER RESIN, METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM
    2.
    发明公开
    ACTIVE ESTER RESIN, METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM 有权
    活性酯树脂，用于生产，热固性树脂组合物硬化产品THEREOF，半导体密封材料，预浸料，PCB，建筑和电影

    公开(公告)号：EP2617747A1

    公开(公告)日：2013-07-24

    申请号：EP12793961.9

    申请日：2012-05-25

    申请人： DIC Corporation

    发明人： TAKEUCHI Kan ,  SUZUKI Etsuko ,  MORINAGA Kunihiro ,  ARITA Kazuo

    IPC分类号： C08G8/32 ,  C08G59/42 ,  C08J5/24 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

    CPC分类号： H05K3/00 ,  C08G8/32 ,  C08G59/4223 ,  C08G63/133 ,  C08G63/605 ,  C08J5/24 ,  C09D161/14 ,  C09D167/00 ,  H01L23/29 ,  H01L2924/0002 ,  H05K1/0353 ,  Y10T428/2915 ,  Y10T428/31529 ,  Y10T442/2475 ,  C08L63/00 ,  H01L2924/00

    摘要： A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3) in such a manner that the amount of the component (a2) is 0.4 to 0.95 moles and the amount of the component (a3) is 0.3 to 0.025 moles per mole of phenolic hydroxyl groups of the component (a1) is used as a curing agent for epoxy resin. The polyfunctional phenolic compound (a1) is represented by structural formula (1) below:

    (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).

    摘要翻译： 低介电常数，低介电损耗角正切和耐热性得以实现。 的活性酯树脂确实具有通过使与单官能芳族羧酸或其酰氯（a2）中的多官能酚化合物（a1）产生的树脂结构和芳族二羧酸或其酰氯（A3）的寻求的方式没有的量 组分（A2）为0.4〜0.95摩尔，成分（A3）是每组分（a1）的酚羟基的摩尔为0.3〜0025摩尔被用作固化剂的环氧树脂的量。 的多官能酚化合物（a1）是由结构式（1）所示：（其中Ar darstellt苯环，萘环，苯环通过在具有1至4个碳原子，或一个萘环烷基核取代 核substituiertem通过在具有1至4个碳原子的烷基，X darstellt亚甲基，二价的环状脂肪族烃基，亚苯基二亚甲基，或亚联苯基二亚甲基氧基，n darstellt重复单元和所述平均的数量 其是在至10的范围内的0.5）。