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公开(公告)号：EP3744795A1
公开(公告)日：2020-12-02
申请号：EP19744434.2
申请日：2019-01-23
申请人： Daicel Corporation
发明人： EGAWA, Tomoya , HORIUCHI, Junpei
IPC分类号： C09D4/02 , B32B27/36 , B32B27/38 , C09D163/00
摘要： Provided is a resin composition for forming a hard coating layer, which is capable of forming a cured product having not only high hardness but also excellent scratch resistance, bending resistance, and crack resistance. The resin composition according to an embodiment of the present invention contains components (A) to (D) below: the component (A): a tri- or higher-functional alicyclic epoxy compound and/or a tri- or higher-functional oxetane compound; the component (B): a polyfunctional (meth)acrylic compound; the component (C): a photocationic polymerization initiator; and the component (D): a photoradical polymerization initiator.
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公开(公告)号：EP2650319A1
公开(公告)日：2013-10-16
申请号：EP11846305.8
申请日：2011-11-29
申请人： Daicel Corporation
发明人： EGAWA, Tomoya
CPC分类号： C07F19/00 , C08G77/12 , C08G77/20 , C08G77/56 , C08G77/80 , C08K5/5419 , C08K5/5425 , C08K5/56 , C08L83/00 , C08L83/14 , C09D183/04 , C09D183/14
摘要： Provided is a metallosiloxane compound (A) prepared by reacting a bifunctional silane compound (S1), a monofunctional silane compound (S2), a boron compound (M), and optionally H 2 O in a molar ratio of [the silane compound (S1)]:[the silane compound (S2)]:[the boron compound (M)]:[H 2 O] of n:m: k: a, where n, m, k, and a satisfy all conditions (i), (ii), and (iii), in which the metallosiloxane compound has at least one Si-H bond or C 2-10 alkenyl group per molecule, and the conditions (i), (ii), and (iii) are expressed as follows:
(i) n>0, m>0, k>0, a≥0 ;
(ii) m/n≥0.5; and
(iii) (n+m)/k≥1.8摘要翻译： 本发明提供通过使二官能性硅烷化合物（S1），单官能性硅烷化合物（S2），硼化合物（M）和根据需要的水以[硅烷化合物（S1）]的摩尔比反应而得到的金属硅氧烷化合物（A） ：[硅烷化合物（S2）]：[硼化合物（M）]：n:m:k:a [H2O]，其中n，m，k和a满足条件（i）， （iii），其中金属硅氧烷化合物每分子具有至少一个Si-H键或C2-10烯基，并且条件（i），（ii）和（iii）表示如下： ）n> 0，m> 0，k> 0，a≥0; （ii）m /n≥0.5; 和（iii）（n + m）/k≥1.8
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公开(公告)号：EP4012726A1
公开(公告)日：2022-06-15
申请号：EP20850274.0
申请日：2020-08-04
申请人： Daicel Corporation
摘要： An object of the present disclosure is to provide a paste that can suppress fluctuations in viscosity at a printing temperature to perform printing without unevenness, and is sintered fast even in an inert gas atmosphere such as nitrogen to form a highly accurate conductive wiring and a joined structure excellent in joining strength. The present disclosure provides an adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect electronic elements, the adhesive conductive paste including a conductive particle and a solvent. The adhesive conductive paste contains, as the conductive particle, a silver particle (A) having an average particle size of 1 nm or greater and less than 100 nm and a silver particle (B) having an average particle size of 0.1 µm or greater and 10 µm or less, the silver particle (A) being a silver nanoparticle having a configuration in which a surface is coated with a protective agent containing amine, and
the adhesive conductive paste contains, as the solvent, a compound (C) represented by Formula (I) below:
Ra-O-(X-O) n -R b ... (I)
where in Formula (I), R a represents a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, X represents a divalent group selected from a hydrocarbon group having from 2 to 6 carbon atoms, R b represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, R a and R b may be the same, n represents an integer from 1 to 3.-
公开(公告)号：EP3006481A1
公开(公告)日：2016-04-13
申请号：EP14804282.3
申请日：2014-05-21
申请人： Daicel Corporation
CPC分类号： H01L33/56 , C08G59/02 , C08G59/24 , C08G59/60 , C08G59/68 , C08G59/688 , C08G65/18 , C08L63/00 , C08L2205/02 , H01B1/22 , H01L51/0035 , H01L51/5237
摘要： A curable composition according to the present invention for sealing optical semiconductor includes components (A), (B), and (C). Another curable composition according to the present invention for sealing optical semiconductor further includes a component (D) in addition to the components (A), (B) and (C). The component (A) is a compound containing at least one functional group selected from the group consisting of epoxy groups, oxetanyl groups, vinyl ether groups, and (meth)acryloyl groups. The component (B) is a cycloaliphatic epoxy compound. The component (C) is a curing catalyst including a cationic component and an anionic component and generating an acid upon application of light or heat, where the cationic component contains an aromatic ring, and the anionic component contains a central element selected from boron and phosphorus. The component (D) is conductive fiber-bearing particles each including a particulate substance and a fibrous conductive substance lying on or over the particulate substance.
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