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6 条记录 (耗时 0.012 秒)

    ASSEMBLY STRUCTURE
    1.
    发明公开
    ASSEMBLY STRUCTURE 审中-公开

    公开(公告)号：EP4221470A3

    公开(公告)日：2023-09-13

    申请号：EP23158349.3

    申请日：2016-06-20

    申请人： Delta Electronics, Inc.

    发明人： YE, Haoyi ,  ZENG, Jianhong ,  ZHANG, Yu ,  HU, Peiqing ,  ZHOU, Ziying

    IPC分类号： H05K1/02 ,  G06F1/18 ,  H01L25/065 ,  H05K1/14 ,  H05K7/10 ,  G06F1/20 ,  H01L25/16

    摘要： The present disclosure provides an assembly structure for providing power for a chip, which includes a circuit board (21, 61, 101), configured to provide a first electrical energy; a chip (22, 62, 102); a first power converting module (23, 63, 103, 69'); and a second power converting module (23, 63, 103, 69') electrically connected with the first power converting module (23, 63, 103, 69'); the first power converting module (23, 63, 103, 69') or the second power converting module (23, 63, 103, 69') receives and converts the first electrical energy, and supplies the converted electrical energy to the chip (22, 62, 102); and the circuit board (21, 61, 101), the chip (22, 62, 102), the first power converting module (23, 63, 103, 69') and the second power converting module (23, 63, 103, 69') are stacked to form the assembly structure.

    ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME
    2.
    发明公开
    ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开

    公开(公告)号：EP3986094A3

    公开(公告)日：2022-07-20

    申请号：EP21197847.3

    申请日：2016-06-20

    申请人： Delta Electronics, Inc.

    发明人： YE, Haoyi ,  ZENG, Jianhong ,  ZHANG, Yu ,  HU, Peiqing ,  ZHOU, Ziying

    IPC分类号： H05K1/02 ,  G06F1/18 ,  H01L25/065 ,  H05K1/14 ,  H05K7/10 ,  G06F1/20

    摘要： The present disclosure provides an assembly structure for providing power for a chip (22, 62, 102) and an electronic device using the same. The assembly structure includes: a circuit board (21, 61, 101), configured to provide a first power supply; a chip (22, 62, 102); and a first power converting module (23, 63, 103, 69'), configured to electrically connect the circuit board (21, 61, 101) and the chip (22, 62, 102), convert the first power supply to a second power supply, and supply the second power supply to the chip (22, 62, 102), wherein the circuit board (21, 61, 101), the chip (22, 62, 102) and the first power converting module (23, 63, 103, 69') are stacked to form the assembly structure. The present disclosure assembles a power converting module (23, 63, 103) with a circuit board (21, 61, 101) and a chip (22, 62, 102) in a stacking manner, which may shorten a current path between the power converting module (23, 63, 103) and the chip (22, 62, 102), reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

    ASSEMBLY STRUCTURE
    4.
    发明公开
    ASSEMBLY STRUCTURE 审中-公开

    公开(公告)号：EP4221470A2

    公开(公告)日：2023-08-02

    申请号：EP23158349.3

    申请日：2016-06-20

    申请人： Delta Electronics, Inc.

    发明人： YE, Haoyi ,  ZENG, Jianhong ,  ZHANG, Yu ,  HU, Peiqing ,  ZHOU, Ziying

    IPC分类号： H05K1/02 ,  G06F1/18 ,  H01L25/065 ,  H05K1/14 ,  H05K7/10 ,  G06F1/20

    摘要： The present disclosure provides an assembly structure for providing power for a chip, which includes a circuit board (21, 61, 101), configured to provide a first electrical energy; a chip (22, 62, 102); a first power converting module (23, 63, 103, 69'); and a second power converting module (23, 63, 103, 69') electrically connected with the first power converting module (23, 63, 103, 69'); the first power converting module (23, 63, 103, 69') or the second power converting module (23, 63, 103, 69') receives and converts the first electrical energy, and supplies the converted electrical energy to the chip (22, 62, 102); and the circuit board (21, 61, 101), the chip (22, 62, 102), the first power converting module (23, 63, 103, 69') and the second power converting module (23, 63, 103, 69') are stacked to form the assembly structure.

    ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME
    5.
    发明公开
    ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开

    公开(公告)号：EP3986094A2

    公开(公告)日：2022-04-20

    申请号：EP21197847.3

    申请日：2016-06-20

    申请人： Delta Electronics, Inc.

    发明人： YE, Haoyi ,  ZENG, Jianhong ,  ZHANG, Yu ,  HU, Peiqing ,  ZHOU, Ziying

    IPC分类号： H05K1/02 ,  G06F1/18 ,  H01L25/065 ,  H05K1/14 ,  H05K7/10 ,  G06F1/20

    摘要： The present disclosure provides an assembly structure for providing power for a chip (22, 62, 102) and an electronic device using the same. The assembly structure includes: a circuit board (21, 61, 101), configured to provide a first power supply; a chip (22, 62, 102); and a first power converting module (23, 63, 103, 69'), configured to electrically connect the circuit board (21, 61, 101) and the chip (22, 62, 102), convert the first power supply to a second power supply, and supply the second power supply to the chip (22, 62, 102), wherein the circuit board (21, 61, 101), the chip (22, 62, 102) and the first power converting module (23, 63, 103, 69') are stacked to form the assembly structure. The present disclosure assembles a power converting module (23, 63, 103) with a circuit board (21, 61, 101) and a chip (22, 62, 102) in a stacking manner, which may shorten a current path between the power converting module (23, 63, 103) and the chip (22, 62, 102), reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

    ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME
    6.
    发明公开
    ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开
    安东尼奥斯克里克斯堡（EORKTRONISCHE VORRICHTUNG DAMIT）

    公开(公告)号：EP3110238A3

    公开(公告)日：2017-04-26

    申请号：EP16175340.5

    申请日：2016-06-20

    申请人： Delta Electronics, Inc.

    发明人： YE, Haoyi ,  ZENG, Jianhong ,  ZHANG, Yu ,  HU, Peiqing ,  ZHOU, Ziying

    IPC分类号： H05K1/02 ,  G06F1/18 ,  H01L25/065 ,  H05K1/14 ,  H05K7/10

    CPC分类号： H05K7/02 ,  G06F1/188 ,  G06F1/20 ,  H01L25/0657 ,  H05K1/0218 ,  H05K1/0262 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/368 ,  H05K7/10 ,  H05K7/2039 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10545

    摘要： The present disclosure provides an assembly structure for providing power for a chip (22, 62, 102) and an electronic device using the same. The assembly structure includes: a circuit board (21, 61, 101), configured to provide a first power supply; a chip (22, 62, 102); and a first power converting module (23, 63, 103, 69'), configured to electrically connect the circuit board (21, 61, 101) and the chip (22, 62, 102), convert the first power supply to a second power supply, and supply the second power supply to the chip (22, 62, 102), wherein the circuit board (21, 61, 101), the chip (22, 62, 102) and the first power converting module (23, 63, 103, 69') are stacked to form the assembly structure. The present disclosure assembles a power converting module (23, 63, 103) with a circuit board (21, 61, 101) and a chip (22, 62, 102) in a stacking manner, which may shorten a current path between the power converting module (23, 63, 103) and the chip (22, 62, 102), reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

    摘要翻译： 本公开提供了一种用于为芯片（22,62,102）提供电力的组装结构和使用其的电子设备。 组装结构包括：电路板（21,61,101），被配置为提供第一电源; 芯片（22,62,102）; 和配置成电连接所述电路板（21,61,101）和所述芯片（22,62,102）的第一电力转换模块（23,63,103,69'）将所述第一电源转换为第二电源 电源，并将第二电源供应到芯片（22,62,102），其中电路板（21,61,101），芯片（22,62,102）和第一电力转换模块（23） 63,103,69'）堆叠以形成组装结构。 本公开以堆叠方式与电路板（21,61,101）和芯片（22,62,102）组装电力转换模块（23,63,103），这可以缩短电力之间的电流路径 转换模块（23,63,103）和芯片（22,62,102），减少电流传输损耗，提高系统效率，减少占用空间并节省系统资源。