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    Printed wiring board and method for manufacturing printed wiring board
    1.
    发明公开
    Printed wiring board and method for manufacturing printed wiring board 有权
    印刷电路板和制造印刷电路板的方法

    公开(公告)号：EP1220589A3

    公开(公告)日：2004-07-21

    申请号：EP01130820.2

    申请日：2001-12-24

    申请人： Denso Corporation

    发明人： Yazaki, Yoshitarou ,  Yokochi, Tomohiro ,  Kondo, Koji ,  Harada, Toshikazu ,  Shiraishi, Yoshihiko

    IPC分类号： H05K3/40 ,  H05K3/46

    CPC分类号： H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T428/24917

    摘要： Conductive paste (50) containing tin particles (61) and silver particles (62) is packed in a substantially cylindrical via hole (24) formed in a thermoplastic resin film (23) that interposes between conductor patterns (22) and is hot-pressed from both sides. When the metal particles contained in the conductive paste (50) are sintered to form a unified conductive compound (51), the volume of the conductive paste (50) shrinks. Synchronously, the resin film (23) around the via-hole (24) protrudes into the via-hole (24). Therefore, the shape of the side wall on the cross-section of the conductive compound (51) provides an arch shape, and a side wall (51a) adjacent to a junction part (51b) of the conductive compound (51), which contacts the conductor pattern (22), is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

    摘要翻译： 导电浆料（50）含锡颗粒（61）和银颗粒（62）被装在一个通过在一个热塑性树脂膜（23）形成的孔（24）基本上为圆柱形的那样（22）的导体图案之间介于并进行热压 从bothsides。 当包含在导电膏（50）的金属颗粒烧结，以形成一个统一的导电性化合物（51），导电浆料的体积（50）收缩。 同步，所述树脂薄膜 - （23）围绕所述通孔（24）突出到所述通孔（24）。 因此，在导电化合物的横截面侧壁的形状（51）提供了一个拱形状，并且侧壁（51A）邻近于接合部分（51b）上的导电性化合物的（51）接触哪 导体图案（22）的倾斜，形成与。 因此，能够防止应力集中，由于板的变形。