公开(公告)号：EP1816905B1

公开(公告)日：2010-10-06

申请号：EP07075316.5

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka, c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki, c/o Ibiden Co., Ltd. ,  Minoura, Hisashi, c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu, c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro, c/o Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

公开(公告)号：EP0969707B1

公开(公告)日：2006-12-13

申请号：EP99201699.8

申请日：1999-05-28

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： Yoshioka, Hirokazu ,  Yoshida, Norio ,  Tanaka, Kenichiro

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K3/4652 ,  H05K1/116 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/0055 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0969 ,  H05K2201/098 ,  H05K2201/09863 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165

公开(公告)号：EP0971570A4

公开(公告)日：2006-01-04

申请号：EP98901002

申请日：1998-01-23

Applicant: IBIDEN CO LTD

Inventor： TAKADA MASARU ,  TSUKADA KIYOTAKA ,  KOBAYASHI HIROYUKI ,  MINOURA HISASHI ,  UKAI YOSHIKAZU ,  KONDO MITSUHIRO

IPC: B23K26/00 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: When a printed wiring board which has inner layer conductor circuits (161 and 131) between insulating layers (101 - 103) and blind via-holes (141 and 142) made from the top surface of the insulating layer to the inner layer conductor circuits is manufactured, a hole (160) is provided beforehand in the center part of the inner layer conductor circuits (161) at the bottom of the blind via-hole (141), and a laser beam is applied from the top surface side of the insulating layer to form the blind via-holes (141 and 142). After that, metal plating films are formed on the surfaces of the inner layer conductor circuits (131 and 161) and the blind via-holes (141 and 142).

Abstract translation: 一种制造印刷电路板（210）的方法，包括由合成树脂制成的至少两个绝缘层（211,212,213），布置在绝缘层之间的内层导体电路（221-225）和多个盲孔（ 3A-3E），其由最外表面朝向内层导体电路（221-225）形成，并且通过在形成盲通孔（3A-3E）的每一部分上依次照射激光束而具有不同的深度，其特征在于，最浅盲 通过使用具有形成标准孔所需的能量强度的标准激光束（242）将通孔（3A-3E）形成为标准孔，并且将标准激光束（242）多次照射 形成具有更深深度的盲孔（3B，3D，3E）。

公开(公告)号：EP1484952A1

公开(公告)日：2004-12-08

申请号：EP03703355.2

申请日：2003-02-21

Applicant: Fujikura Ltd.

Inventor： ITO, Shouji, FUJIKURA LTD. SAKURA WORKS ,  NAKAO, Osamu, FUJIKURA LTD. SAKURA WORKS ,  HIGUCHI, Reiji, FUJIKURA LTD. SAKURA WORKS ,  OKAMOTO, Masahiro, FUJIKURA LTD. SAKURA WORKS

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

Abstract: A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.

Abstract translation: 一种多层电路板的安装部件包括：绝缘基片部件（在绝缘树脂层111）; 一导电层112上形成的电极图案的形成所述绝缘基板组件111的一个表面上; 形成在所述绝缘基板组件111的另一表面上的粘合层113; 和导电性树脂组合物115与所有其填充穿过所述绝缘基板组件111的通孔，所述粘合层和所述，为了使层间互连导电层。 贯通孔114的导电层部114b的孔直径大于所述绝缘树脂层的部分的孔直径和粘结层部分114A以建立由所述罕见的导电性树脂组合物115和导电层112之间的电连接更小的 导电层112 的面112a

公开(公告)号：EP1220591A2

公开(公告)日：2002-07-03

申请号：EP01130722.0

申请日：2001-12-21

Applicant: Denso Corporation

Inventor： Yazaki, Yoshitaro ,  Shiraishi, Yoshihiko ,  Kondo, Koji ,  Harada, Toshikazu ,  Yokochi, Tomohiro

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T428/24917

Abstract: A heated and pressed printed wiring board (100) is made by filling via-holes formed in layers of insulating film of the wiring board (100) with an interlayer conducting material. The insulating film is stacked with conductor patterns (22), and each conductor pattern (22) closes a via hole (24). The interlayer conducting material forms a solid conducting material (51, 52) in the via holes (24) after a heating a pressing procedure. The solid conducting material (51, 52) includes two types of conducting materials. The first type of conducting material (51) includes a metal, and the second type of conductive material (52) includes an alloy formed by the metal and conductor metal of the conductor patterns (22). The conductor patterns (22) are electrically connected reliably without relying on mere mechanical contact.

Abstract translation: 通过用层间导电材料填充布线板（100）的绝缘膜形成的通孔来制造加热压制印刷线路板（100）。 绝缘膜与导体图案（22）堆叠，并且每个导体图案（22）封闭通孔（24）。 层压导电材料在加压压制程序之后在通孔（24）中形成固体导电材料（51,52）。 固体导电材料（51,52）包括两种类型的导电材料。 第一类导电材料（51）包括金属，第二类导电材料（52）包括由导体图案（22）的金属和导体金属形成的合金。 导体图案（22）可靠地电连接，而不依赖于机械接触。

公开(公告)号：EP0804865A1

公开(公告)日：1997-11-05

申请号：EP96900386.0

申请日：1996-01-18

Applicant: Coates Brothers PLC

Inventor： COCKETT, Michael, Anthony ,  THATCHER, Wrenford, John ,  COURTNEY, Robert, William

IPC: H05K3 ,  H05K1

CPC classification number: H05K3/386 ,  H05K1/095 ,  H05K3/0023 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0272 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/0568

Abstract: A method of forming a conductive path (11) of an electrical circuit board (1) comprises applying an adhesive (7) to a substrate (3) and applying a conductive ink (25) over the adhesive (7) in a pattern corresponding to the desired conductive path (11). A photoimageable layer (9) can be applied over the adhesive (7) or substrate and subjected to a photoimaging and developing process. This forms a track (13) in the photoimageable layer (9), corresponding to the desired conductive path (11). The conductive ink (25) is introduced into the track (13) prior to heating. The heating affects curing of the adhesive (7) and bonding of the conductive ink (25) to the adhesive layer (7) simultaneously with reflow or sintering of a metallic component (27) of the ink. The ink (25) comprises a metallic component (27) and a flux but is substantially free of any resin or any reactive monomer or polymer.

公开(公告)号：EP1858308B1

公开(公告)日：2012-04-18

申请号：EP06781090.3

申请日：2006-07-07

Applicant: Ibiden Co., Ltd.

Inventor： TAKAHASHI, Michimasa, c/o IBIDEN CO., LTD. ,  MIKADO, Yukinobu, c/o IBIDEN CO., LTD. ,  NAKAMURA, Takenobu, c/o IBIDEN CO., LTD. ,  AOYAMA, Masakazu, c/o IBIDEN CO., LTD.

IPC: H05K3/46

CPC classification number: H05K3/421 ,  H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09863 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/31511

Abstract: In a multilayer printed wiring board, insulating layers and conductor layers are alternately stacked, and the conductor layers are electrically connected through via holes arranged on the insulating layers. The via hole is formed to have a swell at least on a part of it, in a substantially vertical direction to a thickness direction of the insulating layer. External stresses, such as a force of impact when dropped, are suppressed to have an insulating substrate not to easily warp, and cracks, disconnection, and the like of the conductor circuit are prevented. Thus, deterioration of reliability and drop impact resistance of a mounting substrate can be reduced.

Abstract translation: 在多层印刷线路板中，绝缘层和导体层交替堆叠，并且导体层通过设置在绝缘层上的通孔电连接。 通孔形成为在与绝缘层的厚度方向大致垂直的方向上至少在其一部分上具有隆起。 外部应力如下降时的冲击力被抑制，以使绝缘基板不易翘曲，并且防止导体电路的裂纹，断开等。 因此，可以降低安装基板的可靠性和耐跌落冲击性的劣化。

公开(公告)号：EP1484952A4

公开(公告)日：2008-04-23

申请号：EP03703355

申请日：2003-02-21

Applicant: FUJIKURA LTD

Inventor： ITO SHOUJI ,  NAKAO OSAMU ,  HIGUCHI REIJI ,  OKAMOTO MASAHIRO

IPC: H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

Abstract: A base for multilayer wiring boards in which a conductive layer (112) forming a wiring pattern is provided on one side of an insulating base (insulating resin layer (111)), and an adhesive layer (113) for interlayer adhesion is provided on the other side, and a through hole (114) extending through the conductive layer, the insulating base, and the adhesive layer is filled with a conductive resin composition (115) for interlayer electrical connection. The diameter of the conductive layer portion (114b) of the through hole is smaller than those of the insulating base portion and the adhesive layer portion (114a). The electrical connection between the conductive resin composition and the conductive layer is ensured through the back (112a) of the conductive layer.

公开(公告)号：EP1843650A3

公开(公告)日：2007-11-07

申请号：EP07013524.9

申请日：1999-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Hirose, Naohiro ,  Noda, Kouta ,  Segawa, Hiroshi ,  En, Honjin ,  Tsukada, Kiyotaka ,  Ishida, Naoto ,  Asano, Kouji ,  Shouda, Atsushi

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A multilayered printed circuit board comprising: a substrate (330) on which a conductive circuit (334) is formed; an interlayer insulating resin layer (350) formed on the conductive circuit (334); an opening (348) for forming a via hole (360) formed in the interlayer insulating resin layer (350); and another conductive circuit (358) including a via hole (360) and formed on the interlayer insulating resin layer (350), wherein
the surface of the conductive circuit (334) is subjected to a coarsening process using etching solution containing cupric complex and organic acid, and
stripe pits and projections are formed on the inner wall of the opening (348) for forming the via hole (360).

Abstract translation: 一种多层印刷电路板，包括：衬底（330），其上形成有导电电路（334）; 形成在导电电路（334）上的层间绝缘树脂层（350）; 用于形成层间绝缘树脂层（350）中形成的通路孔（360）的开口（348）; 以及形成在层间绝缘树脂层（350）上的包括通路孔（360）的另一导电电路（358），其中导电电路（334）的表面经受使用包含铜络合物和有机化合物的蚀刻溶液的粗化处理 酸，并且在用于形成通孔（360）的开口（348）的内壁上形成条纹凹凸。

公开(公告)号：EP1827065A2

公开(公告)日：2007-08-29

申请号：EP07075318.1

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. ,  Minoura, Hisashi c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro c/o Ibiden Co., Ltd.

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A method of producing a printed wiring board (3) comprising a mounting recess portion (1) for mounting an electronic part, a conductor pattern (7), and a heat-sink plate (6) arranged at the bottom of the mounting recess portion (1), characterized in that a conductor pattern (7) is formed on an insulating substrate (5);
a heat-sink plate (6) is adhered to a lower face of a portion of the insulating substrate (5) forming the mounting recess portion; and
a laser beam (2) is irradiated to an upper face of the portion (10) forming the mounting recess portion to form a mounting recess portion (1).

Abstract translation: 一种印刷电路板（3）的制造方法，其特征在于，具备安装电子部件的安装凹部（1），导体图案（7），以及配置在安装凹部的底部的散热板 （1），其特征在于，在绝缘基板（5）上形成导体图案（7）。 散热板（6）粘附到形成安装凹部的绝缘基板（5）的一部分的下表面; 并且激光束（2）照射到形成安装凹部的部分（10）的上表面以形成安装凹部（1）。