-
1.发明授权LIGHT EMITTING DEVICE ENCAPSULATED WITH SILICONES AND CURABLE SILICONE COMPOSITIONS FOR PREPARING THE SILICONES 有权用硅发光二极管封装固化型有机硅组合物用于制造有机硅
公开(公告)号：EP1987084B1
公开(公告)日：2014-11-05
申请号：EP07749880.6
申请日：2007-02-01
发明人： CHENG, Tammy , HARKNESS, Brian , ENAMI, Hiroji , KATO, Tomoko , MORITA, Yoshitsugu , MURAKAMI, Masashi , TERADA, Masayoshi , YOSHITAKE, Makoto , CUMMINGS, Michelle , NORRIS, Ann, Walstrom , HOWELL, Malinda
IPC分类号： C08G77/52 , C08K5/5425 , C08L83/04 , H01L33/00 , C08L83/07
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
-
2.发明公开LIGHT EMITTING DEVICE ENCAPSULATED WITH SILICONES AND CURABLE SILICONE COMPOSITIONS FOR PREPARING THE SILICONES 有权用硅发光二极管封装固化型有机硅组合物用于制造有机硅
公开(公告)号：EP1987084A2
公开(公告)日：2008-11-05
申请号：EP07749880.6
申请日：2007-02-01
发明人： CHENG, Tammy , HARKNESS, Brian , ENAMI, Hiroji , KATO, Tomoko , MORITA, Yoshitsugu , MURAKAMI, Masashi , TERADA, Masayoshi , YOSHITAKE, Makoto , CUMMINGS, Michelle , NORRIS, Ann, Walstrom , HOWELL, Malinda
IPC分类号： C08G77/52 , C08K5/5425 , C08L83/04 , H01L33/00 , C08L83/07
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
-
3.发明公开ADDITION-CURABLE ORGANOPOLYSILOXANE RESIN COMPOSITION AND AN OPTICAL MATERIAL 有权另外的有机聚硅氧烷树脂组合物和光学材料
公开(公告)号：EP1699875A2
公开(公告)日：2006-09-13
申请号：EP04799945.3
申请日：2004-11-29
发明人： YOSHITAKE, Makoto; , NAKANISHI, Koji , NAKASHIMA, Hisataka , KOBAYASHI, Hideki , MURAKAMI, Masashi , TAKEUCHI, Kasumi
IPC分类号： C08L83/04
摘要： An addition-curable organopolysiloxane resin composition having, in a state of cued body, a hardness of 60 to 100 at 25 degree C and 40 to 100 at 150 degree C as measued in accordance with the provisions of ASTM D2240-86, said composition comprising: (A) 100 parts by weight of an organopolysiloxane resin comprised of at least alkenyl groups and phenyl groups; (B) 10 to 50 parts by weight of an organooligosiloxane comprised of at least alkeyl groups and phenyl groups; (C) 20 to 100 parts by weight of an organohydrogenoligosiloxane or organohydrogenpolysiloxane; and (D) an addition-reaction catalyst in a catalytic quantity; an optical material that is comprised of a cured body producted from aforementioned components (A), (B), and (C) and posseses the aforementioned characteristics.
-
4.发明授权ADDITION-CURABLE ORGANOPOLYSILOXANE RESIN COMPOSITION AND AN OPTICAL MATERIAL 有权另外的有机聚硅氧烷树脂组合物和光学材料
公开(公告)号：EP1699875B1
公开(公告)日：2010-01-27
申请号：EP04799945.3
申请日：2004-11-29
发明人： YOSHITAKE, Makoto; , NAKANISHI, Koji , NAKASHIMA, Hisataka , KOBAYASHI, Hideki , MURAKAMI, Masashi , TAKEUCHI, Kasumi
IPC分类号： C08L83/04
-
公开(公告)号：EP1695124B1
公开(公告)日：2009-09-09
申请号：EP04807824.0
申请日：2004-12-17
发明人： YOSHITAKE, Makoto Dow Corning Toray Co., Ltd. , NAKANISHI, Koji Dow Corning Toray Co., Ltd. , MURAKAMI, Masashi , TAKEUCHI, Kasumi
CPC分类号： G02B1/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/04 , C08L83/00
摘要： Addition-curable organopolysiloxane resin composition comprising an organopolysiloxane resin that contains at least alkenyl, hydroxyl, and phenyl directly bonded to silicon of which at least 30 mole% is phenyl; an organohydrogenoligosiloxane or organohydrogenpolysiloxane that contains at least phenyl directly bonded to silicon of which at least 20 mole% is phenyl; and an addition reaction-curing catalyst.
-
公开(公告)号：EP1695124A2
公开(公告)日：2006-08-30
申请号：EP04807824.0
申请日：2004-12-17
发明人： YOSHITAKE, Makoto Dow Corning Toray Co., Ltd. , NAKANISHI, Koji Dow Corning Toray Co., Ltd. , MURAKAMI, Masashi , TAKEUCHI, Kasumi
CPC分类号： G02B1/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/04 , C08L83/00
摘要： Addition-curable organopolysiloxane resin composition comprising an organopolysiloxane resin that contains at least alkenyl, hydroxyl, and phenyl directly bonded to silicon of which at least 30 mole% is phenyl; an organohydrogenoligosiloxane or organohydrogenpolysiloxane that contains at least phenyl directly bonded to silicon of which at least 20 mole% is phenyl; and an addition reaction-curing catalyst.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.014 秒)
