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1.发明授权LIGHT EMITTING DEVICE ENCAPSULATED WITH SILICONES AND CURABLE SILICONE COMPOSITIONS FOR PREPARING THE SILICONES 有权用硅发光二极管封装固化型有机硅组合物用于制造有机硅
公开(公告)号：EP1987084B1
公开(公告)日：2014-11-05
申请号：EP07749880.6
申请日：2007-02-01
发明人： CHENG, Tammy , HARKNESS, Brian , ENAMI, Hiroji , KATO, Tomoko , MORITA, Yoshitsugu , MURAKAMI, Masashi , TERADA, Masayoshi , YOSHITAKE, Makoto , CUMMINGS, Michelle , NORRIS, Ann, Walstrom , HOWELL, Malinda
IPC分类号： C08G77/52 , C08K5/5425 , C08L83/04 , H01L33/00 , C08L83/07
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
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2.发明公开LIGHT EMITTING DEVICE ENCAPSULATED WITH SILICONES AND CURABLE SILICONE COMPOSITIONS FOR PREPARING THE SILICONES 有权用硅发光二极管封装固化型有机硅组合物用于制造有机硅
公开(公告)号：EP1987084A2
公开(公告)日：2008-11-05
申请号：EP07749880.6
申请日：2007-02-01
发明人： CHENG, Tammy , HARKNESS, Brian , ENAMI, Hiroji , KATO, Tomoko , MORITA, Yoshitsugu , MURAKAMI, Masashi , TERADA, Masayoshi , YOSHITAKE, Makoto , CUMMINGS, Michelle , NORRIS, Ann, Walstrom , HOWELL, Malinda
IPC分类号： C08G77/52 , C08K5/5425 , C08L83/04 , H01L33/00 , C08L83/07
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
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公开(公告)号：EP3041903B1
公开(公告)日：2017-08-16
申请号：EP14780632.7
申请日：2014-08-29
发明人： ENAMI, Hiroji
CPC分类号： C08G77/44 , C08G77/12 , C08G77/20 , C08G77/398 , C08G77/58 , C08K3/16 , C08K3/24 , C08K5/56 , C08L83/00 , C08L83/04 , C08L83/14 , H01L23/296 , H01L33/56
摘要： A silicone gel composition comprising: (A) branched organopolysiloxane having, on average, at least two alkenyl groups bonded to silicon atoms in a molecule, and a viscosity ranging from 10 to 10,000 mPa·s at 25° C.; (B) organohydrogenpolysiloxane; (C) platinum-based addition reaction catalyst; and (D) a reaction product of (d1) alkali metal silanolate with (d2) at least one ceric salt selected from cerium chloride and a carboxylic acid salt of cerium.
摘要翻译： 一种有机硅凝胶组合物，其包含：（A）平均每个分子中具有至少两个与硅原子键合的烯基的支链有机聚硅氧烷，并且在25℃下的粘度范围为10至10,000mPa·s; （B）有机氢聚硅氧烷; （C）铂基加成反应催化剂; 和（D）（d1）碱金属硅烷醇化物与（d2）至少一种选自氯化铈和铈的羧酸盐的铈盐的反应产物。
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公开(公告)号：EP1945716B1
公开(公告)日：2011-02-16
申请号：EP06823403.8
申请日：2006-11-08
IPC分类号： C08L83/04
摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
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公开(公告)号：EP3099746A1
公开(公告)日：2016-12-07
申请号：EP15740359.3
申请日：2015-01-22
发明人： ENAMI, Hiroji
IPC分类号： C08L83/07 , C08K5/057 , C08K5/07 , C08K5/5415 , C08K5/5445 , C08L83/05 , C08L83/06 , H01L23/29 , H01L23/31
CPC分类号： C08G77/44 , C08G77/12 , C08G77/20 , C08K5/0091 , C08K5/06 , C08K5/5415 , C08K5/5425 , C08K5/5435 , C08K5/549 , C08K5/56 , C08L83/00 , C08L83/04 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： A silicone gel composition for use in sealing or filling of electrical or electronic parts comprising at least one adhesion promoter (Z), and by curing to form a silicone gel having, at 25° C. and a shear frequency of 0.1 Hz, a loss elastic modulus of from 5.0×103 to 1.0×105 dyne/cm2, a complex elastic modulus of from 5.0×104 to 1.0×106 dyne/cm2, and a loss tangent of 0.3 or less. The silicone gel composition is provided, which can suppress the occurrence of air bubbles or cracks in silicone gel that seals or fills an electrical or electronic part and has excellent bonding to the electrical or electronic part even when used under high-temperature conditions as in a power device; and a silicone gel is provided, which can suppress the occurrence of air bubbles or cracks when it seals or fills an electrical or electronic part.
摘要翻译： 一种用于密封或填充包含至少一种粘合促进剂（Z）的电气或电子部件的硅凝胶组合物，并通过固化形成在25℃和剪切频率为0.1Hz的硅胶，具有损失 弹性模量为5.0×10 3〜1.0×10 5达因/ cm 2，复数弹性模量为5.0×10 4〜1.0×10 6达因/ cm 2，损耗角正切为0.3以下。 提供了硅酮凝胶组合物，其可以抑制密封或填充电气或电子部件的硅凝胶中的气泡或裂纹的发生，并且即使在高温条件下使用时也具有与电气或电子部件的良好结合，如 动力装置 并且提供硅胶，其可以在密封或填充电气或电子部件时抑制气泡或裂纹的发生。
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公开(公告)号：EP3041903A1
公开(公告)日：2016-07-13
申请号：EP14780632.7
申请日：2014-08-29
发明人： ENAMI, Hiroji
CPC分类号： C08G77/44 , C08G77/12 , C08G77/20 , C08G77/398 , C08G77/58 , C08K3/16 , C08K3/24 , C08K5/56 , C08L83/00 , C08L83/04 , C08L83/14 , H01L23/296 , H01L33/56
摘要： A silicone gel composition comprising: (A) branched organopolysiloxane having, on average, at least two alkenyl groups bonded to silicon atoms in a molecule, and a viscosity ranging from 10 to 10,000 mPa·s at 25° C.; (B) organohydrogenpolysiloxane; (C) platinum-based addition reaction catalyst; and (D) a reaction product of (d1) alkali metal silanolate with (d2) at least one ceric salt selected from cerium chloride and a carboxylic acid salt of cerium.
摘要翻译： 一种硅凝胶组合物，其包含：（A）平均具有至少两个与分子中的硅原子键合的烯基的支链有机聚硅氧烷，在25℃下的粘度为10〜10,000mPa·s。 （B）有机氢聚硅氧烷; （C）铂系加成反应催化剂; 和（D）（d1）碱金属硅烷醇化物与（d2）至少一种选自氯化铈和铈的羧酸盐的至少一种铈盐的反应产物。
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公开(公告)号：EP1945716A1
公开(公告)日：2008-07-23
申请号：EP06823403.8
申请日：2006-11-08
IPC分类号： C08L83/04
摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
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8.发明授权CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE 有权固化聚有机硅氧烷密封胶的光学半导体元件和光学半导体器件
公开(公告)号：EP2324079B9
公开(公告)日：2013-10-16
申请号：EP09740543.5
申请日：2009-09-04
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , H01L2924/00
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9.发明授权CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE 有权固化聚有机硅氧烷密封胶的光学半导体元件和光学半导体器件
公开(公告)号：EP2324079B1
公开(公告)日：2012-10-24
申请号：EP09740543.5
申请日：2009-09-04
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , H01L2924/00
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10.发明公开CURABLE ORGANOPOLYSILOXANE COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT SEALANT, AND OPTICAL SEMICONDUCTOR DEVICE 有权固化聚有机硅氧烷密封胶的光学半导体元件和光学半导体器件
公开(公告)号：EP2324079A1
公开(公告)日：2011-05-25
申请号：EP09740543.5
申请日：2009-09-04
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole% of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight%, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole% of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.
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