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1.发明授权
公开(公告)号：EP2588539B1
公开(公告)日：2014-05-14
申请号：EP11738059.2
申请日：2011-06-28
发明人： YOSHITAKE, Makoto , YAMAKAWA, Mieko
CPC分类号： H01L33/56 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/70 , C08K5/56 , C08L83/00 , C08L83/04 , H01L23/296 , H01L24/29 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.
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公开(公告)号：EP2588539A1
公开(公告)日：2013-05-08
申请号：EP11738059.2
申请日：2011-06-28
发明人： YOSHITAKE, Makoto , YAMAKAWA, Mieko
CPC分类号： H01L33/56 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/70 , C08K5/56 , C08L83/00 , C08L83/04 , H01L23/296 , H01L24/29 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.
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公开(公告)号：EP2588538B1
公开(公告)日：2014-04-30
申请号：EP11738058.4
申请日：2011-06-28
发明人： YOSHITAKE, Makoto , YAMAKAWA, Mieko
CPC分类号： C08G77/20 , C08G77/12 , C08G77/16 , C08L83/04 , H01L23/296 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , C08L83/00 , H01L2924/00014
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4.发明公开
公开(公告)号：EP2588538A1
公开(公告)日：2013-05-08
申请号：EP11738058.4
申请日：2011-06-28
发明人： YOSHITAKE, Makoto , YAMAKAWA, Mieko
CPC分类号： C08G77/20 , C08G77/12 , C08G77/16 , C08L83/04 , H01L23/296 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , C08L83/00 , H01L2924/00014
摘要： A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt.% of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.
摘要翻译： 一种可用作光学半导体元件的密封剂或粘合剂的可固化的有机基聚硅氧烷组合物，其至少包含以下组分：（A）含烯基的有机聚硅氧烷，其包含平均组成式（A-1）和组分 （A-2）的平均组成式; （B）含有与硅键合的氢原子并包含含有至少0.5重量％的与硅键合的氢原子并由平均分子式表示的组分（B-1）的组分（B-2），所述组分（B-2）含有 至少0.5重量％的与硅键合的氢原子并由平均组成式表示，并且如果需要，表示平均分子式的组分（B-3）; 和（C）氢化硅烷化反应催化剂。 该组合物可以形成具有透光性和粘合性的持久性以及相对高的硬度的固化体。
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