POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION
    7.
    发明公开
    POLYAMIDE COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION 审中-公开
    聚酰胺复合结构及其制备方法

    公开(公告)号:EP2632709A1

    公开(公告)日:2013-09-04

    申请号:EP11781919.3

    申请日:2011-10-27

    摘要: Disclosed herein are overmolded polyamide composites structures and processes for their preparation. The disclosed overmolded composite structures comprise i) a first component having a surface, at least a portion of which is made of a surface resin composition, selected from polyamide compositions comprising a blend of two or more fully aliphatic polyamides having a melting point of at least 250° C., and comprising a fibrous material being impregnated with a matrix resin composition, ii) a second component comprising an overmolding resin composition, adhered to said first component over at least a portion of the surface of said first component, and wherein the matrix resin composition is selected from polyamide compositions comprising a one or more fully aliphatic polyamides having a melting point of at least 250° C.

    摘要翻译: 本发明涉及复合结构及其制备方法领域,尤其涉及聚酰胺复合结构领域。 所公开的复合结构包括表面,该表面具有由表面树脂组合物制成的至少一部分,并且包括选自非织造结构,织物,纤维絮垫及其组合的纤维材料,所述纤维材料用基质 树脂组合物,其中所述表面树脂组合物选自包含两种或更多种熔点为至少250℃的全脂族聚酰胺的共混物的聚酰胺组合物,并且其中所述基体树脂组合物选自包含一种或多种完全 熔点至少为250℃的脂族聚酰胺。