摘要:
Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (e.g., polyethylene and polypropylene), optional tackifier resins and optional fillers that provide very strong, tight hermetic heat seals yet are easily peelable. These compositions are useful as an adhesive layer in multilayer structures that are useful as packaging lidding films. Also disclosed are packages that comprise these multilayer structures.
摘要:
Disclosed is a profile-extruded multilayer structure comprising a polyester composition comprising from about 0.001 to about 7 mole % of a sulfonic acid comonomer or a salt thereof such as structures comprising at least one polyamide layer and at least one layer of a sulfonic acid-derived copolymer; structures comprising at least one polyester layer and at least one layer of a sulfonic acid-derived copolymer; structures comprising at least one polyamide layer, at least one layer of a sulfonic acid-derived copolymer and at least one polyester or polycarbonate layer. Also disclosed are shaped articles comprising these multilayer structures, commonly referred to as profiles. Such profiles are useful, for example, as tubing.
摘要:
Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (for example, polyethylene and polypropylene), tackifier resins and optional fillers that provide strong hermetic adhesion to fluoropolymers such as PCTFE. These compositions can be useful as an adhesive layer in multilayer structures prepared by extrusion lamination. Also disclosed are packages, such as thermoformed blister packs, rigid containers and pouches that comprise these multilayer structures.
摘要:
Disclosed are compositions comprising ethylene/vinyl acetate copolymers, tackifying resins and optionally polyolefins (for example, polyethylene and polypropylene) that provide strong, tight hermetic heat seals with an easily peelable opening feature to fluoropolymers such as polychlorotrifluoroethylene. Also disclosed are multilayer structures and packages comprising these compositions.
摘要:
Disclosed are compositions comprising ethylene/vinyl acetate copolymers, tackifying resins and optionally polyolefins (for example, polyethylene and polypropylene) that provide strong, tight hermetic heat seals with an easily peelable opening feature to fluoropolymers such as polychlorotrifluoroethylene. Also disclosed are multilayer structures and packages comprising these compositions.
摘要:
Disclosed is the use of compositions of ethylene copolymers, polyolefins (for example, polyethylene and polypropylene), tackifiers and optional fillers that provide strong hermetic adhesion to impact-modified acrylonitrile-methylacrylate copolymers. These compositions are useful as an adhesive layer in multilayer structures prepared by coextrusion, extrusion coating and extrusion lamination. Also disclosed are packages, such as thermoformed blister packs, rigid containers and pouches that comprise these multilayer structures.
摘要:
Disclosed is the use of compositions of ethylene copolymers, polyolefins (for example, polyethylene and polypropylene), tackifiers and optional fillers that provide strong hermetic adhesion to impact-modified acrylonitrile-methylacrylate copolymers. These compositions are useful as an adhesive layer in multilayer structures prepared by coextrusion, extrusion coating and extrusion lamination. Also disclosed are packages, such as thermoformed blister packs, rigid containers and pouches that comprise these multilayer structures.
摘要:
Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (e.g., polyethylene and polypropylene), optional tackifier resins and optional fillers that provide very strong, tight hermetic heat seals yet are easily peelable. These compositions are useful as an adhesive layer in multilayer structures that are useful as packaging lidding films. Also disclosed are packages that comprise these multilayer structures.