摘要:
Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (for example, polyethylene and polypropylene), tackifier resins and optional fillers that provide strong hermetic adhesion to fluoropolymers such as PCTFE. These compositions can be useful as an adhesive layer in multilayer structures prepared by extrusion lamination. Also disclosed are packages, such as thermoformed blister packs, rigid containers and pouches that comprise these multilayer structures.
摘要:
Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (e.g., polyethylene and polypropylene), optional tackifier resins and optional fillers that provide very strong, tight hermetic heat seals yet are easily peelable. These compositions are useful as an adhesive layer in multilayer structures that are useful as packaging lidding films. Also disclosed are packages that comprise these multilayer structures.
摘要:
Disclosed is a multi-compartment package made from flexible polymeric material heat sealed at the peripheral edges for filling with products that are to be stored separately from each other and then combined after heating. Temperature dependent frangible seals between the sheets of polymeric packaging material form the compartments of the package. Also disclosed are films suitable for use in these packages. Also disclosed are convenience meals comprising these packages.
摘要:
Disclosed is a thermoformable film laminate that can be useful for packaging comprising or produced from (a) a thermoformable film layer comprising or produced from a polymer composition having at least 80 % by weight polyethylene terephthalate polymer, said film having an outer surface and an inner surface; (b) a film layer having a heat shrinkage of at least about 5% less than (a); (c) a heat sealable layer; and optionally, (d) an additional barrier layer.
摘要:
Disclosed are compositions comprising ethylene/vinyl acetate copolymers, tackifying resins and optionally polyolefins (for example, polyethylene and polypropylene) that provide strong, tight hermetic heat seals with an easily peelable opening feature to fluoropolymers such as polychlorotrifluoroethylene. Also disclosed are multilayer structures and packages comprising these compositions.
摘要:
Disclosed are compositions comprising ethylene/vinyl acetate copolymers, tackifying resins and optionally polyolefins (for example, polyethylene and polypropylene) that provide strong, tight hermetic heat seals with an easily peelable opening feature to fluoropolymers such as polychlorotrifluoroethylene. Also disclosed are multilayer structures and packages comprising these compositions.
摘要:
Disclosed is the use of compositions of ethylene copolymers, polyolefins (for example, polyethylene and polypropylene), tackifiers and optional fillers that provide strong hermetic adhesion to impact-modified acrylonitrile-methylacrylate copolymers. These compositions are useful as an adhesive layer in multilayer structures prepared by coextrusion, extrusion coating and extrusion lamination. Also disclosed are packages, such as thermoformed blister packs, rigid containers and pouches that comprise these multilayer structures.
摘要:
Disclosed is the use of compositions of ethylene copolymers, polyolefins (for example, polyethylene and polypropylene), tackifiers and optional fillers that provide strong hermetic adhesion to impact-modified acrylonitrile-methylacrylate copolymers. These compositions are useful as an adhesive layer in multilayer structures prepared by coextrusion, extrusion coating and extrusion lamination. Also disclosed are packages, such as thermoformed blister packs, rigid containers and pouches that comprise these multilayer structures.
摘要:
Disclosed are compositions of ethylene/(meth)acrylate copolymers, polyolefins (e.g., polyethylene and polypropylene), optional tackifier resins and optional fillers that provide very strong, tight hermetic heat seals yet are easily peelable. These compositions are useful as an adhesive layer in multilayer structures that are useful as packaging lidding films. Also disclosed are packages that comprise these multilayer structures.