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    Improved large area photovoltaic cell and method for producing same
    2.
    发明公开
    Improved large area photovoltaic cell and method for producing same 失效
    改进的大面积光伏电池及其生产方法

    公开(公告)号：EP0153041A3

    公开(公告)日：1985-11-13

    申请号：EP85300584

    申请日：1985-01-29

    申请人： ENERGY CONVERSION DEVICES, INC.

    发明人： Hanak, Joseph J.

    IPC分类号： H01L27/14 ,  H01L31/00 ,  H01L31/02 ,  H01L31/18

    CPC分类号： H01L31/046 ,  H01L31/03921 ,  H01L31/048 ,  H01L31/0504 ,  Y02E10/50

    摘要： A large-area photovoltaic cell tolerant of puncture damage to its small-area segments and exhibiting only a proportional loss of electrical output from low resistance current paths formed through those small-area segments. The small-area segments are electrically connected in series in rows that are electrically connected in parallel. Columns of the small-area segments are connected by bridges of semiconductor material simplifying manufacture. The lateral resistance of the semiconducting material electrically isolates the columns from each other. The large-area cell also includes a pressurized sealant that is released when the cell is pierced. The sealant flows through the damaged portion and protects the edges of the puncture from degradation by ambient conditions.

    摘要翻译： 大面积光伏电池容忍对其小面积段的穿刺损伤，并且仅通过这些小区域段形成的低电阻电流路径仅显示出电气输出的比例损失。 小面积的片段串联电连接成并行电连接。 小区段的柱通过半导体材料桥连接，从而简化制造。 半导体材料的横向电阻将柱彼此电隔离。 大面积电池还包括当电池被穿孔时释放的加压密封剂。 密封剂流经受损部分，并保护穿刺部分的边缘不受环境条件的影响。

    Electroplated substrate
    4.
    发明公开
    Electroplated substrate 失效
    电镀基板

    公开(公告)号：EP0154555A3

    公开(公告)日：1987-02-04

    申请号：EP85301574

    申请日：1985-03-07

    申请人： ENERGY CONVERSION DEVICES, INC.

    发明人： Hanak, Joseph J. ,  Izu, Masatsugu ,  Nath, Prem. ,  Young, James

    IPC分类号： H01L31/18 ,  H01L31/02 ,  H01L31/06 ,  H01L27/14

    CPC分类号： C25D1/04 ,  H01L21/2885 ,  H01L31/03921 ,  H01L31/046 ,  H01L31/0463 ,  H01L31/0547 ,  Y02E10/52

    摘要： @ A lightweight, photosensitive structure is formed on a electroplated substrate, characterized by a substantially reduced number of surface defects. The substrate is prepared in an electroforming process by electroplating it on and removing it from the surface of a specifically prepared, substantially defect-free mandrel. The substrate may be provided with a preselected surface finished by either texturing the mandrel or controlling the parameters of the electroplating process to determine the morphology of the deposit. The substrate is especially useful for the fabrication of thin film photoresponsive devices that incorporate specular or diffuse back reflectors, since the substrate surface texture may be controlled to provide for the appropriate type of reflectivity. Large-area, thin film semiconductor devices incorporating the electroplated substrate are readily scribed to form electrically isolated small-area segments for the fabrication of modules, arrays and the like.

    Extremely lightweight, flexible semiconductor device arrays and method of making same
    7.
    发明公开
    Extremely lightweight, flexible semiconductor device arrays and method of making same 失效
    极光，柔性半导体器件阵列及其制造方法

    公开(公告)号：EP0189976A3

    公开(公告)日：1987-12-02

    申请号：EP86300129

    申请日：1986-01-09

    申请人： ENERGY CONVERSION DEVICES, INC.

    发明人： Hanak, Joseph J.

    IPC分类号： H01L31/18 ,  H01L31/02 ,  H01L27/14

    CPC分类号： H01L31/206 ,  H01L31/03921 ,  H01L31/046 ,  H01L31/0465 ,  Y02E10/50 ,  Y02P70/521

    摘要： An extremely lightweight, interconnected array of semiconductor devices, such as solar cells, is formed from a large continuous area of semiconductor material (3, 23, 43, 83, 123) disposed on an unconventonally thin, electrically conducting stubstrate (1, 21, 41, 81, 121). The interconnections are formed by removing portions of the substrate to form substrate islands (13, 35, 55, 95, 141, 163, 183) underlying a layer of semiconductor material which underlies a transparent conductive oxide (5, 25, 45, 83,125, 179). The oxide layer may likewise be formed into mutually isolated islands (7, 29, 47,89,131,181) that overlay the areas between the substrate islands. Individual units or cells so formed may be interconnected by depositing a conducting material on, alongside and at least partially between islands of oxide and/or semiconductor, by depositing a metal grid (27) on the oxide layer and burning conducting paths (31) to the substrate islands, or by piercing the layers and disposing a conducting material in the holes (133) pierced. The unconventionally thin substrate may be a sheet of electroformel nickel or other thin metal or may be an initially thick substrate that is thinned by chemical etching after other array processing steps are completed. To maximize the output power-to-weight ratio of a solar cell array, the conventional substrate (159, 171) may be removed entirely. In that process, a dissimilar layer (161, 173), such as a back reflector, is deposited on a support, such as a conventional substrate, before the semiconductor material (23, 177) is deposited. After all other processing, the support (159, 171) is removed by chemical etching to produce a substrateless array of devices. Typically, the array is encapsulated by a protective glass or polymer film. An encapsulant (33) is preferably applied to the exposed surface of the semiconductor material to protect it while the substrate is being thinned or removed. Subsequently, an encapsulant (37) is applied to the rear of substrate side of the array. An insulating layer (173) may be interposed between the support (171) and semiconductor layer (177) and act to encapsulate the rear of a substrateless array when the support is etched away to produce an ultimate power-to-weight ratio array.

    摘要翻译： 一种非常轻便的，相互连接的半导体器件阵列，如太阳能电池，由设置在非透明薄的导电基底（1，21，21）上的半导体材料（3,23,43,83,123）的大连续区域形成， 41，81，121）。 通过去除衬底的部分来形成互连，以形成位于透明导电氧化物（5,25,45,33,38）下面的半导体材料层下面的衬底岛（13,35,55,95,141,163,183） 125,179）。 氧化物层同样可以形成为覆盖衬底岛之间的区域的相互隔离的岛（7,29,47,89,131,181）。 通过在氧化物层上沉积金属网格（27）并且将导电路径（31）烧结到（例如）上，通过在氧化物和/或半导体岛之间并且至少部分地在氧化物和/或半导体岛之间沉积导电材料 衬底岛，或通过刺穿这些层并且在穿孔的孔133中设置导电材料。 非常规薄的衬底可以是电镀镍或其他薄金属片，或者可以是在其它阵列处理步骤完成之后通过化学蚀刻而减薄的初始厚的衬底。 为了最大化太阳能电池阵列的输出功率重量比，可以完全去除传统的基板（159,171）。 在该过程中，在沉积半导体材料（23,177）之前，将不相似的层（例如背反射体）沉积在诸如常规衬底的支撑体上。 在所有其它处理之后，通过化学蚀刻去除支撑件（159,171）以产生无基体的器件阵列。 通常，阵列被保护性玻璃或聚合物膜包封。 优选地，在半导体材料的暴露表面上施加密封剂（33）以在衬底被减薄或移除的同时对其进行保护。 随后，将密封剂（37）施加到阵列的衬底侧的后部。 绝缘层（173）可以插入在支撑体（171）和半导体层（177）之间，并且当支撑被蚀刻掉时产生无基体阵列的后部以产生最终的功率重量比阵列。

    Extremely lightweight, flexible semiconductor device arrays and method of making same
    10.
    发明公开
    Extremely lightweight, flexible semiconductor device arrays and method of making same 失效
    Extrem leichter und biegsamer Halbleiter-Modul und Herstellungsverfahren。

    公开(公告)号：EP0189976A2

    公开(公告)日：1986-08-06

    申请号：EP86300129.3

    申请日：1986-01-09

    申请人： ENERGY CONVERSION DEVICES, INC.

    发明人： Hanak, Joseph J.

    IPC分类号： H01L31/18 ,  H01L31/02 ,  H01L27/14

    CPC分类号： H01L31/206 ,  H01L31/03921 ,  H01L31/046 ,  H01L31/0465 ,  Y02E10/50 ,  Y02P70/521

    摘要： An extremely lightweight, interconnected array of semiconductor devices, such as solar cells, is formed from a large continuous area of semiconductor material (3, 23, 43, 83, 123) disposed on an unconventonally thin, electrically conducting stubstrate (1, 21, 41, 81, 121). The interconnections are formed by removing portions of the substrate to form substrate islands (13, 35, 55, 95, 141, 163, 183) underlying a layer of semiconductor material which underlies a transparent conductive oxide (5, 25, 45, 83,125, 179). The oxide layer may likewise be formed into mutually isolated islands (7, 29, 47,89,131,181) that overlay the areas between the substrate islands. Individual units or cells so formed may be interconnected by depositing a conducting material on, alongside and at least partially between islands of oxide and/or semiconductor, by depositing a metal grid (27) on the oxide layer and burning conducting paths (31) to the substrate islands, or by piercing the layers and disposing a conducting material in the holes (133) pierced.
    The unconventionally thin substrate may be a sheet of electroformel nickel or other thin metal or may be an initially thick substrate that is thinned by chemical etching after other array processing steps are completed. To maximize the output power-to-weight ratio of a solar cell array, the conventional substrate (159, 171) may be removed entirely. In that process, a dissimilar layer (161, 173), such as a back reflector, is deposited on a support, such as a conventional substrate, before the semiconductor material (23, 177) is deposited. After all other processing, the support (159, 171) is removed by chemical etching to produce a substrateless array of devices. Typically, the array is encapsulated by a protective glass or polymer film. An encapsulant (33) is preferably applied to the exposed surface of the semiconductor material to protect it while the substrate is being thinned or removed. Subsequently, an encapsulant (37) is applied to the rear of substrate side of the array. An insulating layer (173) may be interposed between the support (171) and semiconductor layer (177) and act to encapsulate the rear of a substrateless array when the support is etched away to produce an ultimate power-to-weight ratio array.

    摘要翻译： 一种非常轻便的，相互连接的半导体器件阵列，如太阳能电池，由设置在非透明薄的导电基底（1，21，21）上的半导体材料（3,23,43,83,123）的大连续区域形成， 41，81，121）。 通过去除衬底的部分来形成互连，以形成位于透明导电氧化物（5,25,45,33,38）下面的半导体材料层下面的衬底岛（13,35,55,95,141,163,183） 125,179）。 氧化物层同样可以形成为覆盖衬底岛之间的区域的相互隔离的岛（7,29,47,89,131,181）。 通过在氧化物层上沉积金属网格（27）并且将导电路径（31）烧结到（例如）上，通过在氧化物和/或半导体岛之间并且至少部分地在氧化物和/或半导体岛之间沉积导电材料 衬底岛，或通过刺穿这些层并且在穿孔的孔133中设置导电材料。 非常规薄的衬底可以是电镀镍或其他薄金属片，或者可以是在其它阵列处理步骤完成之后通过化学蚀刻而减薄的初始厚的衬底。 为了最大化太阳能电池阵列的输出功率重量比，可以完全去除传统的基板（159,171）。 在该过程中，在沉积半导体材料（23,177）之前，将不相似的层（例如背反射体）沉积在诸如常规衬底的支撑体上。 在所有其它处理之后，通过化学蚀刻去除支撑件（159,171）以产生无基体的器件阵列。 通常，阵列被保护性玻璃或聚合物膜包封。 优选地，在半导体材料的暴露表面上施加密封剂（33）以在衬底被减薄或移除的同时对其进行保护。 随后，将密封剂（37）施加到阵列的衬底侧的后部。 绝缘层（173）可以插入在支撑体（171）和半导体层（177）之间，并且当支撑被蚀刻掉时产生无基体阵列的后部以产生最终的功率重量比阵列。