公开(公告)号：EP0154555A3

公开(公告)日：1987-02-04

申请号：EP85301574

申请日：1985-03-07

申请人： ENERGY CONVERSION DEVICES, INC.

发明人： Hanak, Joseph J. ,  Izu, Masatsugu ,  Nath, Prem. ,  Young, James

IPC分类号： H01L31/18 ,  H01L31/02 ,  H01L31/06 ,  H01L27/14

CPC分类号： C25D1/04 ,  H01L21/2885 ,  H01L31/03921 ,  H01L31/046 ,  H01L31/0463 ,  H01L31/0547 ,  Y02E10/52

摘要： @ A lightweight, photosensitive structure is formed on a electroplated substrate, characterized by a substantially reduced number of surface defects. The substrate is prepared in an electroforming process by electroplating it on and removing it from the surface of a specifically prepared, substantially defect-free mandrel. The substrate may be provided with a preselected surface finished by either texturing the mandrel or controlling the parameters of the electroplating process to determine the morphology of the deposit. The substrate is especially useful for the fabrication of thin film photoresponsive devices that incorporate specular or diffuse back reflectors, since the substrate surface texture may be controlled to provide for the appropriate type of reflectivity. Large-area, thin film semiconductor devices incorporating the electroplated substrate are readily scribed to form electrically isolated small-area segments for the fabrication of modules, arrays and the like.

公开(公告)号：EP0155125A3

公开(公告)日：1986-09-17

申请号：EP85301402

申请日：1985-02-28

申请人： ENERGY CONVERSION DEVICES, INC.

发明人： Nath, Prem ,  Izu, Masatsugu ,  Ovshinsky, Herbert C. ,  Tennenhouse, Clifford ,  Young, James

IPC分类号： H01L31/02 ,  H01L21/20

CPC分类号： H01L31/03921 ,  H01L21/02425 ,  H01L21/02491 ,  H01L21/02532 ,  Y02E10/50

摘要： An improved semiconductor device includes a substrate (11) having a deposition surface, including at least one defect region (30, 32) capable of providing a low resistance shunt path or a nucleation centre, a relatively thick, continuous, electrically conductive leveling layer (26) electroplated on the deposition surface to provide a substantially defect-free surface, and a semiconductor body (27) deposited on the leveling layer. The substrate (11) is formed of aluminium or stainless steel while the leveling layer is preferably formed of nickel or silver.

公开(公告)号：EP0155125A2

公开(公告)日：1985-09-18

申请号：EP85301402.5

申请日：1985-02-28

申请人： ENERGY CONVERSION DEVICES, INC.

发明人： Nath, Prem ,  Izu, Masatsugu ,  Ovshinsky, Herbert C. ,  Tennenhouse, Clifford ,  Young, James

IPC分类号： H01L31/02 ,  H01L21/20

CPC分类号： H01L31/03921 ,  H01L21/02425 ,  H01L21/02491 ,  H01L21/02532 ,  Y02E10/50

摘要： An improved semiconductor device includes a substrate (11) having a deposition surface, including at least one defect region (30, 32) capable of providing a low resistance shunt path or a nucleation centre, a relatively thick, continuous, electrically conductive leveling layer (26) electroplated on the deposition surface to provide a substantially defect-free surface, and a semiconductor body (27) deposited on the leveling layer. The substrate (11) is formed of aluminium or stainless steel while the leveling layer is preferably formed of nickel or silver.

摘要翻译： 改进的半导体器件包括具有沉积表面的衬底（11），其包括能够提供低电阻分流路径或成核中心的至少一个缺陷区域（30,32），相对厚的连续的导电校平层 电镀在沉积表面上以提供基本上无缺陷的表面，以及沉积在流平层上的半导体本体（27）。 基板（11）由铝或不锈钢形成，而流平层优选由镍或银形成。

公开(公告)号：EP0154555A2

公开(公告)日：1985-09-11

申请号：EP85301574.1

申请日：1985-03-07

申请人： ENERGY CONVERSION DEVICES, INC.

发明人： Hanak, Joseph J. ,  Izu, Masatsugu ,  Nath, Prem. ,  Young, James

IPC分类号： H01L31/18 ,  H01L31/02 ,  H01L31/06 ,  H01L27/14

CPC分类号： C25D1/04 ,  H01L21/2885 ,  H01L31/03921 ,  H01L31/046 ,  H01L31/0463 ,  H01L31/0547 ,  Y02E10/52

摘要： @ A lightweight, photosensitive structure is formed on a electroplated substrate, characterized by a substantially reduced number of surface defects. The substrate is prepared in an electroforming process by electroplating it on and removing it from the surface of a specifically prepared, substantially defect-free mandrel. The substrate may be provided with a preselected surface finished by either texturing the mandrel or controlling the parameters of the electroplating process to determine the morphology of the deposit. The substrate is especially useful for the fabrication of thin film photoresponsive devices that incorporate specular or diffuse back reflectors, since the substrate surface texture may be controlled to provide for the appropriate type of reflectivity. Large-area, thin film semiconductor devices incorporating the electroplated substrate are readily scribed to form electrically isolated small-area segments for the fabrication of modules, arrays and the like.

摘要翻译： 在电镀基板上形成轻质的感光结构，其特征在于基本上减少了表面缺陷的数量。 基板通过电铸并通过特定制备的基本上无缺陷的芯棒的表面将其去除而在电铸工艺中制备。 衬底可以被设置有通过纹理化心轴或控制电镀工艺的参数来确定沉积物的形态来完成的预选表面。 衬底对于制造包含镜面或漫反射反射器的薄膜光响应器件特别有用，因为可以控制衬底表面纹理以提供适当类型的反射率。 包含电镀基板的大面积薄膜半导体器件易于划刻以形成用于制造模块，阵列等的电隔离的小区域段。