公开(公告)号：EP1781421A1

公开(公告)日：2007-05-09

申请号：EP05713971.9

申请日：2005-02-23

申请人： ENTHONE, INCORPORATED

发明人： YAU, Yung-Herng, c/o Enthone, Inc. ,  RICHARDSON, Thomas B., c/o Enthone, Inc. ,  ABYS, Joseph A., c/o Enthone, Inc. ,  WENGENROTH, Karl F., c/o Enthone, Inc. ,  FIORE, Anthony, c/o Enthone, Inc. ,  XU, Chen ,  FAN, Chonglun ,  FUDALA, John, c/o Enthone, Inc.

IPC分类号： B05D3/10 ,  B05D1/18 ,  B05D5/12 ,  B32B15/20 ,  C09D5/00 ,  C09D5/24 ,  C25D5/22 ,  C25D5/02 ,  C25D3/46

CPC分类号： H05K1/09 ,  C09D1/00 ,  C23C18/16 ,  C23C18/1614 ,  C23C18/1616 ,  C23C18/1633 ,  C23C18/1683 ,  C23C18/1687 ,  C23C18/42 ,  C23C18/44 ,  C23C18/54 ,  C23C22/06 ,  C23C22/58 ,  C25D3/46 ,  C25D3/56 ,  C25D3/64 ,  H05K3/244 ,  H05K3/422 ,  H05K2203/0257 ,  H05K2203/073 ,  Y10S205/916

摘要： Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.