-
1.发明公开
公开(公告)号：EP3219831A4
公开(公告)日：2018-07-25
申请号：EP14906132
申请日：2014-11-14
申请人： YKK CORP
发明人： HASEGAWA KENJI
IPC分类号： C25D5/00 , B24B1/00 , B24B31/112 , B24B31/14 , C25D5/02 , C25D5/18 , C25D5/22 , C25D7/00 , C25D7/02 , C25D17/00 , C25D17/12 , C25D17/22 , C25D21/10 , C25F3/02 , C25F3/20 , C25F3/24 , C25F7/00
CPC分类号： C25D5/022 , B24B1/002 , B24B1/005 , B24B31/112 , B24B31/14 , C25D5/00 , C25D5/026 , C25D5/18 , C25D5/22 , C25D7/00 , C25D7/02 , C25D17/00 , C25D17/12 , C25D17/22 , C25D21/10 , C25F3/02 , C25F3/20 , C25F3/24 , C25F7/00
摘要： There is provided a method for subjecting garment accessories to a surface electrolytic treatment, which can advantageously provide various metallic colors to metallic garment accessories in a cost effective manner. The method can provide a first metallic color on one side of outer surface of the garment accessory while at the same time providing a second metallic color on the other side of the outer surface, by placing one or more metallic garment accessories in an electrolytic solution in a non-contact state with an anode and a cathode for passing electric current through the electrolytic solution, passing electric current through the electrolytic solution and generating a bipolar phenomenon on the garment accessory. The method may further comprise the step of controlling the posture of the garment accessory such that the one side of the outer surface of the garment accessory faces the anode and the other side faces the cathode during passing electric current through the electrolytic solution. The method may further comprise the step of polishing at least a part of the outer surface of the garment accessory during passing electric current through the electrolytic solution.
-
公开(公告)号：EP3300808A1
公开(公告)日：2018-04-04
申请号：EP17172987.4
申请日：2005-02-23
发明人： Yau, Yung-Herng , Richardson, Thomas B. , Abys, Joseph A. , Wengenroth, Karl F. , Fiore, Anthony , Xu, Chen , Fan, Chonglun , Fudala, John
IPC分类号： B05D3/10 , B05D1/18 , B05D5/12 , B32B15/20 , C09D5/00 , C09D5/24 , C25D5/22 , C25D5/02 , C25D3/46
CPC分类号： H05K1/09 , C09D1/00 , C23C18/16 , C23C18/1614 , C23C18/1616 , C23C18/1633 , C23C18/1683 , C23C18/1687 , C23C18/42 , C23C18/44 , C23C18/54 , C23C22/06 , C23C22/58 , C25D3/46 , C25D3/56 , C25D3/64 , H05K3/244 , H05K3/422 , H05K2203/0257 , H05K2203/073 , Y10S205/916
摘要： Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
摘要翻译： 用于在电子制造中的金属表面（例如PWB）上镀银以产生大于80原子％银的银镀层，耐晦暗且具有良好可焊性的组合物和方法。
-
3.发明公开
公开(公告)号：EP3235927A3
公开(公告)日：2018-01-24
申请号：EP17000876.7
申请日：2014-11-14
申请人： YKK Corporation
发明人： Hasegawa, Kenji
IPC分类号： C25D5/00 , C25D5/22 , C25D7/00 , C25D7/02 , C25D17/12 , C25D21/10 , C25F3/16 , C25D17/22 , B24B31/14 , B24B1/00 , C25D17/00 , C25D5/18
CPC分类号： C25D5/022 , B24B1/002 , B24B1/005 , B24B31/112 , B24B31/14 , C25D5/00 , C25D5/026 , C25D5/18 , C25D5/22 , C25D7/00 , C25D7/02 , C25D17/00 , C25D17/12 , C25D17/22 , C25D21/10 , C25F3/02 , C25F3/20 , C25F3/24 , C25F7/00
摘要： There is provided a method for subjecting garment accessories to a surface electrolytic treatment, which can advantageously provide various metallic colors to metallic garment accessories in a cost effective manner. The method can provide a first metallic color on one side of outer surface of the garment accessory while at the same time providing a second metallic color on the other side of the outer surface, by placing one or more metallic garment accessories in an electrolytic solution in a non-contact state with an anode and a cathode for passing electric current through the electrolytic solution, passing electric current through the electrolytic solution and generating a bipolar phenomenon on the garment accessory. The method may further comprise the step of controlling the posture of the garment accessory such that the one side of the outer surface of the garment accessory faces the anode and the other side faces the cathode during passing electric current through the electrolytic solution. The method may further comprise the step of polishing at least a part of the outer surface of the garment accessory during passing electric current through the electrolytic solution.
摘要翻译： 提供了一种使服装附件经受表面电解处理的方法，该方法可以有利地以成本有效的方式向金属服装附件提供各种金属颜色。 该方法可以在服装附件的外表面的一侧上提供第一金属颜色，同时通过将一个或多个金属服装附件放置在外表面的另一侧上的电解溶液中而在外表面的另一侧上提供第二金属颜色 具有阳极和阴极的非接触状态，用于使电流流过电解溶液，使电流流过电解溶液并在服装附件上产生双极现象。 该方法可以进一步包括控制服装附件的姿势的步骤，使得在电流通过电解溶液的过程中，服装附件的外表面的一侧面向阳极并且另一侧面向阴极。 该方法还可以包括在电流通过电解溶液的过程中抛光服装辅助设备的外表面的至少一部分的步骤。
-
公开(公告)号：EP2220270A1
公开(公告)日：2010-08-25
申请号：EP08800385.0
申请日：2008-09-25
发明人： TOMANTSCHGER, Klaus , HIBBARD, Glenn , PALUMBO, Gino , BROOKS, Iain , MCCREA, Johnathan , SMITH, Fred
CPC分类号： C25D15/02 , C23C14/3414 , C25D1/00 , C25D1/02 , C25D1/04 , C25D5/00 , C25D5/022 , C25D5/08 , C25D5/10 , C25D5/14 , C25D5/16 , C25D5/18 , C25D7/00 , C25D15/00 , C25D17/008 , C25D21/10 , C25D21/12 , C25D21/14 , Y10T428/24612
摘要： Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.
-
5.发明公开Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer 审中-公开Ein Verfahren und eine Vorrichtung umWaferoberflächenzu behandeln
公开(公告)号：EP1583138A1
公开(公告)日：2005-10-05
申请号：EP05251948.5
申请日：2005-03-30
发明人： Smith, Michael G.R. , Ravkin, Michael , de Larios, John M. , Redeker, Fritz , Korolik, Mikhail , Dipietro, Christian
CPC分类号： H01L21/67051 , C25D5/08 , C25D17/00 , C25D17/001 , H01L21/67023 , H01L21/67028 , H01L21/67034 , H01L21/6704 , H01L21/67063 , Y10S134/902
摘要： Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.
摘要翻译： 在许多实施例中，在一个实施例中，处理衬底的方法被丢弃，其包括在衬底的表面上产生流体层，流体层限定流体弯液面。 该产生包括使头部靠近表面移动，将头部的流体从头部施加到表面，同时头部靠近基底的表面以限定流体层，并且通过邻近头部从表面移除流体 通过真空。 流体沿着头部和基底之间的流体层以随着头部更接近表面而增加的速度行进。
-
公开(公告)号：EP1129237A2
公开(公告)日：2001-09-05
申请号：EP99971474.4
申请日：1999-11-02
申请人： Nutool, Inc.
发明人： TALIEH, Homayoun
CPC分类号： B24B37/26 , B23H5/08 , C25D5/02 , C25D5/06 , C25D5/22 , H01L21/2885 , H01L21/3212
摘要： The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermined area by mechanically polishing the other areas while the conductive material is being applied.
-
7.发明公开
公开(公告)号：EP0886894A4
公开(公告)日：1999-06-16
申请号：EP96926049
申请日：1996-05-24
申请人： FORMFACTOR INC
IPC分类号： B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L21/68 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H01R33/76 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/40 , H01R43/20 , G01R31/00 , G01R31/316 , H01R9/28
CPC分类号： B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/13099 , H01L2224/131 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/4015 , H01L2924/00
摘要： A plurality of contact elements, such as contact bumps or free-standing spring contacts (710) including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates (702) which, in turn, are mounted and connected to a relatively large electronic component substrate (706), thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer component of a probe card assembly. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level bum-in, and the like. Solder balls, z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed x-y and z-axis alignment of the tiles to the relatively large substrate are disclosed.
-
公开(公告)号：EP0915182A1
公开(公告)日：1999-05-12
申请号：EP98107707.6
申请日：1998-04-28
发明人： Omasa, Ryushin
CPC分类号： C25D5/22 , C23C18/1653 , C23C18/1669 , C25D5/003 , C25D5/20 , C25D17/06 , C25D21/10 , H05K3/0088 , H05K2203/0292 , H05K2203/081 , H05K2203/1518 , Y10S205/92
摘要： In a plating method for successively treating a plating target from a pre-treatment step until a plating treatment, (A) a vibrationally stirring apparatus for a treatment bath, (B) an aeration apparatus for the treatment bath, (C) an apparatus for swinging an electrode bar for suspending the plating target thereon, and (D) an apparatus for applying vibration to the electrode bar, are operated in a cleaning tank and at least one of an electroless plating tank and an electroplating tank used as a treatment tank in the pre-treatment step and the plating step.
摘要翻译： 在用于从预处理步骤直到电镀处理连续处理电镀靶的电镀方法中，（A）用于处理浴的振动搅拌装置，（B）用于处理浴的曝气装置，（C） 摆放用于将电镀靶悬挂在其上的电极棒，以及（D）用于向电极棒施加振动的装置在清洗槽中操作，并且将化学镀槽和电镀槽中的至少一个用作处理槽 预处理步骤和电镀步骤。
-
9.发明公开
公开(公告)号：EP0792517A4
公开(公告)日：1998-06-24
申请号：EP95941408
申请日：1995-11-13
申请人： FORMFACTOR INC
IPC分类号： G01R1/073 , B23K1/00 , B23K20/00 , B23K31/02 , C23C18/16 , C25D5/08 , C25D5/16 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/06 , G01R1/067 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/58 , H01L21/60 , H01L21/603 , H01L21/607 , H01L21/66 , H01L21/68 , H01L23/02 , H01L23/12 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R9/00 , H01R12/71 , H01R13/05 , H01R13/24 , H01R29/00 , H01R33/74 , H01R33/76 , H01R107/00 , H05H1/18 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/24 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.
摘要翻译： 探针卡组件（500）包括探针卡（502）和具有安装到其表面上的端子（522）并且在其表面上从端子（522）延伸的弹性接触结构（524）的空间变换器（506）。 插入器（504）设置在空间变换器和探针卡之间。 空间变压器和插入器堆叠在探针卡上，并且可以布置弹性接触结构以优化整个晶片的探测。
-
公开(公告)号：EP3300808B1
公开(公告)日：2019-04-10
申请号：EP17172987.4
申请日：2005-02-23
-
-
-
-
-
-
-
-
-
搜索结果
55 条记录 (耗时 0.026 秒)
