Abstract:
Disclosed is an electric multilayer component comprising a base (10) with dielectric layers and inner electrodes (1, 1', 2, 2') that are disposed therebetween. The inner electrodes (1, 2) are electrically interconnected via outer electrodes (11, 12) located on lateral faces of the base (10). At least one of the inner electrodes (1, 1', 2, 2') is in contact with a contact area (21, 22) of the component by means of a through-contact (31, 32).
Abstract:
The invention relates to a duplexer/diplexer comprised of at least one transmitting branch (1) and of at least one receiving branch (2). The transmitting branch (1) and the receiving branch (2) are modularly connected by a shielding (3) and are arranged such that both branches, in the passband thereof, are adjusted to an identical value of resistance (50 Ohms) and are highly resistive, with regard to broad-band, in the stop band of the band adjacent to each passband. As a result, all three ports of the duplexer/diplexer are adjusted to the same value of resistance when both branches (1, 2) are connected in parallel.
Abstract:
The invention relates to an electric component comprising a base body (1), which has a top side and a bottom side and which is at least partially comprised of a dielectric. On said top side, a raised or recessed delimiting structure (2) delimits a top contact surface (3) that is covered by a top contact layer (4). Said bottom side comprises two bottom contact surfaces (5, 6), which are insulated from one another and which are each covered by a bottom contact layer (7, 8). One of the bottom contact layers (5, 6) is connected in an electrically conductive manner to the top contact layer (4) via a connecting element (9) extending inside the base body (1). The invention also relates to a method for producing said component and to the use thereof. The inventive component is advantageous in that the top contact surface (3) can be easily applied with a defined size by using screen printing or vapor deposition. This enables the easy production of antennas with defined characteristics such as frequency position and input impedance.
Abstract:
The invention relates to a method for adjusting the filter characteristic of a microwave ceramic filter comprising coupled ceramic resonators, said resonators being configured in a ceramic body (1), by varying the distance (d) between input/output connections (4) and grounding connections (3).
Abstract:
The invention relates to a circuit arrangement comprising a terminal (1) for a high frequency signal, at least two additional signal lines (21a, 21b, 21c, 22a, 22b), a switching unit (3) for connecting the terminal (1) to a signal line (21a, 21b, 21c, 22a, 22b) and a primary protection device (41) against electrostatic discharges, which is connected between the terminal (1) and the switching unit (3). The protection device (41) comprises a first voltage limitation element (51), which diverts voltage pulses that exceed a switching voltage of 200 V towards a reference potential (7). The use of a gallium arsenide double diode permits a low insertion loss coupled with a low switching voltage to be achieved.
Abstract:
The invention relates to an electric circuit module comprising a voltage-controlled switch (1) that is provided with a transmitter input (2) and a receiver input (3) as well as with an output (4), and that optionally links one of the inputs (2, 3) with the output (4) in an electrically conductive manner. The circuit module further comprises passive components that form a low-pass filter (5, 6) that is linked with a transmitter input (2) of the switch in an electrically conductive manner. The passive components form a part of the multi-layer ceramic passive module that comprises a base (7) from superimposed dielectric layers (8) and electroconductive layers (9), the switch (1) being disposed on the top or bottom side of the base (7). The invention further relates to a circuit module arrangement and to the use of the circuit module and the circuit module arrangement. The use of the voltage-controlled switch (1) allows for the production of a circuit module that has a very low power consumption.
Abstract:
The invention relates to an electric multi-layered component comprising ceramic dielectric layers which are stacked on top of each other between which component structures are arranged. The aim of the invention is to increase the mechanical stability, in particular soldering contact, on the component. As a result, an improved transversal form for transversal contacts is provided. Said transversal contacts have a transversal cross section which expands towards the top, at least partially, from the soldering contact to the lower side of the component.
Abstract:
The invention relates to an electric circuit module comprising a voltage-controlled switch (1) that is provided with a transmitter input (2) and a receiver input (3) as well as with an output (4), and that optionally links one of the inputs (2, 3) with the output (4) in an electrically conductive manner. The circuit module further comprises passive components that form a low-pass filter (5, 6) that is linked with a transmitter input (2) of the switch in an electrically conductive manner. The passive components form a part of the multi-layer ceramic passive module that comprises a base (7) from superimposed dielectric layers (8) and electroconductive layers (9), the switch (1) being disposed on the top or bottom side of the base (7). The invention further relates to a circuit module arrangement and to the use of the circuit module and the circuit module arrangement. The use of the voltage-controlled switch (1) allows for the production of a circuit module that has a very low power consumption.
Abstract:
The invention relates to a component arrangement in which an electrical component (5) is sunk into a recess (4) of a printed circuit board (1), said electrical component (5) being fixed to an auxiliary printed circuit board (6) which, in turn, is connected to the printed circuit board (1). By sinking the electrical component (5) into the recess (4) of the printed circuit board (4), the amount by which the component projects (U) is advantageously reduced.