公开(公告)号：EP3228162A1

公开(公告)日：2017-10-11

申请号：EP16706737.0

申请日：2016-02-18

Applicant: Verily Life Sciences LLC

Inventor： PEPIN, Brian, Marc ,  PISHEH, Hojr, Sedaghat ,  PHUNG, Dat ,  ETZKORN, James

IPC: H05K3/32 ,  H05K3/30 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01M10/0436 ,  H01M2/22 ,  H01M10/052 ,  H01M2220/30 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10477

Abstract: An example device includes a lithium-based battery having conductive battery contacts protruding from a surface of the battery, where a non-conductive potion of the surface of the battery separates the conductive battery contacts. The battery is a type that undergoes an expansion during charging in which the expansion of the lithium-based battery includes an outward bulging of the non-conductive portion of the battery surface. The device includes a substrate having conductive substrate contacts. The conductive battery contacts are electrically connected to the respective conductive substrate contact via a flexible electrically-conductive adhesive that physically separates the conductive battery contacts from the respective conductive substrate contacts and allows for relative movement therebetween caused by the expansion of the lithium-based battery.

Abstract translation: 示例装置包括具有从电池表面202突出的导电电池触点206,208的锂基电池100，其中电池表面的非导电部分210分隔导电电池触点。 电池是在充电期间经历膨胀的类型，其中锂基电池的膨胀包括电池表面的非导电部分的向外隆起。 该装置包括具有导电衬底触点214,216的衬底200.导电电池触点经由柔性导电粘合剂600,602电连接到相应的导电衬底触点，该导电粘合剂600,602将导电电池触点从相应的导电衬底触点 并且允许由锂基电池的膨胀引起的它们之间的相对运动。

公开(公告)号：EP2624668A1

公开(公告)日：2013-08-07

申请号：EP12185847.6

申请日：2012-09-25

Applicant: Huawei Device Co., Ltd.

Inventor： Ding, Haixing ,  Xie, Guifu

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0268 ,  H05K1/0295 ,  H05K1/113 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09954 ,  H05K2201/10477 ,  H05K2203/162

Abstract: Embodiments of the present invention provide an integrated module. The integrated module includes a printed circuit board PCB and a modular device, where the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; and a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB. Positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.

Abstract translation: 本发明的实施例提供一种集成模块。 集成模块包括印刷电路板PCB和模块化设备，其中模块化设备安装在PCB上; 一组前销焊盘设置在PCB的前表面的四个边缘处，并且前引脚焊盘位于模块化设备的安装位置周围; 并且一组底部销焊盘设置在PCB的底表面的四个边缘处。 设置前销销钉的位置与设置底部销钉的位置对称; 并且前引脚焊盘和底部引脚焊盘的网络属性相同。

公开(公告)号：EP1537767B1

公开(公告)日：2008-12-03

申请号：EP04741946.0

申请日：2004-07-02

Applicant: Siemens Home and Office Communications Devices GmbH & Co. KG

Inventor： LUNGWITZ, Matthias

IPC: H05K9/00 ,  H05K1/14

CPC classification number: H05K1/141 ,  H05K1/0218 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10477

Abstract: The aim of the invention is to provide shielding for EMI-endangered electronic components and/or circuits (20) of electronic devices, especially for radio transmitting devices and/or radio receiving devices of telecommunication terminals for contactless telecommunication, such as cordless telephones and mobile telephones and similar, which can be constructed without using expensive manufacturing and assembly steps without any extra space requirement. The EMI-endangered electronic components and/or circuits (20) are arranged on a separate, at least double-layered printed circuit board (2) and are embodied as a printed circuit board module. Said printed circuit board and another separate, at least two-layered printed circuit board which comprises a recess (11) for the EMI-endangered electronic components and/or circuits (10) and which is embodied in the form of a base printed circuit board (1), are joined together by soldering, preferably in the region of contact areas (12, 14, 22, 23), to form a unit such that a cage (3) is formed by the recess (11) which is disposed between two metal surfaces (13, 21) being respectively connected to the shielding surfaces (12, 22) by means of continuous, highly adjacent contacts (14, 23). The cage shields the EMI-endangered electronic components and/or circuits (20) on all sides.

公开(公告)号：EP1739733A3

公开(公告)日：2008-04-16

申请号：EP06013513.4

申请日：2006-06-29

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Sugahara, Hiroto, Brother Kogyo K. K.

IPC: H01L21/60

CPC classification number: H05K3/361 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/81 ,  H01L24/82 ,  H01L2224/1624 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/811 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H05K3/0032 ,  H05K3/363 ,  H05K2201/10477 ,  H05K2203/013 ,  H01L2924/00

Abstract: For electrically connecting a wiring formed on one surface of an insulating substrate such as an FPC to an individual electrode arranged facing the other surface of the substrate, firstly, a through hole and a notch are formed by irradiating a laser beam from above onto the FPC. Next, the FPC is arranged to be positioned such that the individual electrode, the through hole and the notch are overlapped in a plan view. Next, an electroconductive liquid droplet having a diameter greater than a width of the notch is jetted, toward an area formed with the notch, from the one surface side of the FPC. The landed electroconductive liquid droplet flows along the notch in a thickness direction of the substrate due to an action of a capillary force and reaches assuredly to the individual electrode, thereby electrically connecting the wiring and electrode arranged sandwiching the insulating substrate assuredly.

公开(公告)号：EP1843391A1

公开(公告)日：2007-10-10

申请号：EP06811611.0

申请日：2006-10-11

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： KIMURA, Masahiro ,  SAITO, Yoshifumi

IPC: H01L23/12 ,  H01L25/00 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/46

CPC classification number: H05K1/141 ,  H01L23/15 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/284 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/10477 ,  H05K2203/308 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a state in which a multilayer electronic component including a resin layer disposed on a mounting board side is mounted on a mounting board, even when deformation, such as deflection and strain, occurs, a stress on the multilayer electronic component is relieved by this structure.
In a multilayer electronic component (1), ends (12, 13) of columnar conductors (8, 9) protrude from a main surface (14) of a resin layer (6) facing the outside. The multilayer electronic component (1) is mounted on a mounting board (2), and the ends (12, 13) of the columnar conductors (8, 9) are electrically connecting to conductive lands (26). In this case, a predetermined gap (31) is formed between the multilayer electronic component (1) and the mounting board (2).

Abstract translation: 在其中的状态的多层电子元件，包括设置在安装基板上侧的树脂层被安装在安装基板上，即使当变形，求作为偏转和应变的发生时，所述多层电子元件上的应力通过这种结构缓解 ， 在柱状导体的多层电子元件（1），端部（12，13）（8,9）从（6）的面向外侧的树脂层的一个主表面（14）突出。 层叠型电子元器件（1）被安装在安装板（2），和柱状导体的端部（12，13）（8,9）是导电的连接到焊盘（26）。 在这种情况下，一个预定的间隙（31）的层叠型电子元器件（1）和安装基板（2）之间形成的。

公开(公告)号：EP0933816B1

公开(公告)日：2007-03-28

申请号：EP99101533.0

申请日：1999-01-29

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Suzuki, Kazutaka ,  Narita, Naoto ,  Watanabe, Tohru ,  Kamiyama, Yoshiaki ,  Yagi, Kazuki

IPC: H01L25/07 ,  H01L23/34 ,  H01L25/16 ,  H01L23/13

CPC classification number: H05K1/141 ,  H01L23/36 ,  H01L23/49805 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/183 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2201/10674

公开(公告)号：EP0959648B1

公开(公告)日：2007-03-14

申请号：EP98900160.7

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： ISHIDA, Naoto ,  ASANO, Kouji

IPC: H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board comprising a circuit board (6) having a conductor circuit (5) and a through-hole (60), and a junction pin (1) inserted in the through-hole. The junction pin is made of a material which does not melt at a heating temperature in joining the junction pin to a counterpart pad (81). The junction pin includes a junction top portion (11) which is greater than the aperture diameter of the through-hole and becomes a junction part with the counterpart pad, and a leg portion (12) of a size enabling insertion into the through-hole. The leg portion is inserted in the through-hole and joined with the through-hole by a conductive material such as a solder material (20). In place of the junction pin, a junction ball of a substantially spherical shape may be joined by the conductive material.

公开(公告)号：EP1269505B1

公开(公告)日：2005-10-26

申请号：EP01935293.9

申请日：2001-05-10

Applicant: KEARNEY-NATIONAL, INC.

Inventor： MARTICH, Mark, E.

IPC: H01H51/00 ,  H01H1/66 ,  H01H51/28

CPC classification number: H05K1/141 ,  H01H1/5805 ,  H01H51/281 ,  H01H2001/5888 ,  H05K1/0219 ,  H05K1/182 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10083 ,  H05K2201/10477

Abstract: A new board mounted electromechanical device (103) is provided that mounts to a relay substrate (122) to form a low profile reed relay (100). The reed relay (103) is electrically connected to the electrical contacts (128) via a signal traces (130) and additional electrical traces (130) located on the same side of the relay substrate (122) which connect to the relay"s signal and shielding. Additional traces (130) on both sides of the signal traces of the reed relay (103) provide a co-planar waveguide to maintain the desired impedance of the signal path. The reed relay (103) is mounted in an inverted manner into a cut-out (134) in the main circuit board (132) so that the other portion of the need relay (103) itself is sits within the cut-out (134) in the main circuit board (132). As a result, the need relay component (103) is recessed below the surface of the main circuit board (132) resulting in an overall low profile circuit board.

公开(公告)号：EP1459355A2

公开(公告)日：2004-09-22

申请号：EP02784352.3

申请日：2002-10-31

Applicant: Virtium Technology, Inc.

Inventor： NGUYEN, Chinh ,  HOANG, Phu ,  HOANG, Phan ,  LE, Andy

IPC: H01L21/00

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/144 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/0367 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10992 ,  H05K2203/043 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

Abstract: In one embodiment of the invention, a stacking element (120k) includes a printed circuit board (PCB) (210) and a plurality of solder bumps (242, 244). The PCB (210) has a top side (213) and a bottom side (215). The top side (213) is attached to first pins of a first device (110k). The plurality of solder bumps (242, 244) are on the bottom side (215) and attached to upper areas of second pins (272, 274) of a second device (110k+1) to provide electrical connections between the first pins and the second pins (272, 274).

公开(公告)号：EP1421834A1

公开(公告)日：2004-05-26

申请号：EP02769870.3

申请日：2002-08-13

Applicant: EPCOS AG

Inventor： BLOCK, Christian ,  FAISTAUER, Christian ,  REICHEL, Bernhard

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K1/147 ,  H05K1/182 ,  H05K1/189 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477

Abstract: The invention relates to a component arrangement in which an electrical component (5) is sunk into a recess (4) of a printed circuit board (1), said electrical component (5) being fixed to an auxiliary printed circuit board (6) which, in turn, is connected to the printed circuit board (1). By sinking the electrical component (5) into the recess (4) of the printed circuit board (4), the amount by which the component projects (U) is advantageously reduced.