专利检索 ap:("FLIPCHIP INTERNAT L L C") AND inv:"REDBURN RICHARD" 第 1 页

1.

发明公开
SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO MECHANICAL PERFORMANCE 审中-公开
标题翻译：焊料凸点改进机器和热机械动力

公开(公告)号：EP2140484A4

公开(公告)日：2011-11-16

申请号：EP08746580

申请日：2008-04-22

申请人： FLIPCHIP INTERNAT L L C

发明人： ALVARADO REYNANTE , LU YUAN , REDBURN RICHARD

IPC分类号： H01L23/485

CPC分类号： H01L24/05 , H01L23/3171 , H01L23/3192 , H01L24/02 , H01L24/03 , H01L24/13 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04042 , H01L2224/05022 , H01L2224/05073 , H01L2224/05124 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/05555 , H01L2224/05567 , H01L2224/05572 , H01L2224/0558 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/1148 , H01L2224/13006 , H01L2224/13007 , H01L2224/13021 , H01L2224/13022 , H01L2224/131 , H01L2224/45144 , H01L2224/45147 , H01L2224/48644 , H01L2224/48647 , H01L2224/48666 , H01L2224/48844 , H01L2224/48847 , H01L2224/48866 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/3011 , H01L2924/351 , H01L2924/00014 , H01L2924/00015 , H01L2224/13099 , H01L2924/00