公开(公告)号：EP0144071A3

公开(公告)日：1985-09-25

申请号：EP84114439

申请日：1984-11-29

申请人： FUJITSU LIMITED

发明人： Saito, Toshiyuki ,  Okubo, Naofumi Raionzu Manshon Miyamaedaira ,  Kaneko, Yoshiaki Fujitsu Dai 1 Fujigaoka-ryo 416 ,  Tokumitsu, Yasuyuki

IPC分类号： H01L23/42

CPC分类号： H01L23/445 ,  H01L23/427 ,  H01L23/66 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/45099

摘要： A liquid cooling type high frequency solid state device arrangement comprising: a solid state chip (8); at least one matching circuit (6) connected to the solid state chip (8); a carrier (7) for mounting the solid state chip (8) and the matching circuit (6), constituting a solid state device (24) to be cooled; a coolant vessel (1) for containing a liquid coolant (2), a space for coolant vapor remaining at the top thereof; and a means for condensing the coolant vapor contained in the top space of the vessel (1). At least a part of the solid state device (24) contacts the liquid coolant (2) for boiling and evaporating the coolant. The arrangement is such as to prevent amplitude modulation of the solid state device (24) due to the boiling of the coolant (2).