公开(公告)号：EP3111453A4

公开(公告)日：2017-11-29

申请号：EP14883893

申请日：2014-10-03

申请人： POURRAHIMI SHAHIN

发明人： POURRAHIMI SHAHIN

IPC分类号： H01F6/04 ,  G01R33/38

CPC分类号： H01F6/003 ,  G01R33/3804 ,  G01R33/3815 ,  G01R33/46 ,  G01R33/48 ,  H01F6/04 ,  H01F6/06 ,  H01L23/445 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems are disclosed for saving energy while a superconducting magnet system is not being used and for reducing the time required for the re-establishment of the operating conditions of the system. Traditionally, during an inactive time interval, the temperature of the magnet coils is not allowed to rise, and the system is kept ON, in operating conditions. This results in wasting a large amount of energy for keeping the magnet coils at cryogenic temperatures. Turning the system OFF has never been an option since re-establishment of the operating conditions is very time consuming and costly. The present disclosure offers methods and systems that allow idling of a system in temperatures higher than the magnet coils' intended operating temperature, which results in noticeable savings.

公开(公告)号：EP0883178A3

公开(公告)日：2000-07-26

申请号：EP98304384.5

申请日：1998-06-03

申请人： GEC-MARCONI LIMITED

发明人： Rosenthal, Keith Ronald ,  Mistry, Ramanlal Chhiba ,  Greed, Robert Brian

IPC分类号： H01L23/44 ,  H05K1/02 ,  F25D19/00

CPC分类号： H01P1/30 ,  H01L23/445 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A number of electronic modules 82, 82', 83, 83' are mounted on a cold finger 100 disposed within a sealed housing 104, 110, the interior 210 of which is evacuated. To minimise heat transfer by conduction, gaps are provided in the dielectric substrates carrying the input and output transmission lines providing signal paths between the modules and electrical connectors on the exterior sidewalls 106, 108 of the housing. The gaps are bridged by thin conductive wires, thereby providing low electrical, but high thermal, impedance at the gaps. A number of module assemblies may be stacked on a single cold finger. To allow modules to be adjusted under actual operating conditions, a cover having a number of spring-loaded screwdrivers extending through vacuum tight seals and aligned with adjustable components of the modules, may be temporarily substituted for the enclosure lid 110. The springs urge the screwdrivers out of engagement when no adjustment is being made to minimise heat transfer.

公开(公告)号：EP0482546B1

公开(公告)日：1996-03-13

申请号：EP91117912.5

申请日：1991-10-21

申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

发明人： Riedel, Wolfgang Julius ,  Knothe, Manfred

IPC分类号： H01S3/043 ,  H01L33/00 ,  H01L23/44 ,  F25D19/00

CPC分类号： H01L33/648 ,  F25D3/10 ,  H01L23/445 ,  H01L2924/0002 ,  H01S5/02423 ,  H01L2924/00

公开(公告)号：EP0367630B1

公开(公告)日：1996-03-13

申请号：EP89311436.3

申请日：1989-11-02

申请人： FUJITSU LIMITED ,  SHINKO ELECTRIC INDUSTRIES CO. LTD.

发明人： Kotani, Seigo ,  Sakai, Hiroyuki ,  Takenouchi, Toshikazu ,  Miyagawa, Fumio

IPC分类号： H01L23/44

CPC分类号： H01L23/445 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3011 ,  H01L2924/00014

公开(公告)号：EP0554966B1

公开(公告)日：1995-07-12

申请号：EP93201033.3

申请日：1989-11-20

申请人： FUJITSU LIMITED

发明人： Yokouchi, Kishio ,  Yamada, Mitsutaka ,  Kamehara, Nobuo ,  Niwa, Koichi

IPC分类号： C09K5/06 ,  H01L23/44

CPC分类号： C09K5/045 ,  C09K5/04 ,  C09K2205/128 ,  F25D3/10 ,  H01L23/445 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP0372108B1

公开(公告)日：1994-08-31

申请号：EP88120335.0

申请日：1988-12-05

申请人： Diedrich, Heinz Karl

发明人： Diedrich, Heinz Karl

IPC分类号： H01L23/34 ,  H01L23/42 ,  F25B19/00 ,  H01L31/024

CPC分类号： H01L23/445 ,  F25D19/006 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005

公开(公告)号：EP0309543B1

公开(公告)日：1993-08-04

申请号：EP88903615.8

申请日：1988-03-23

申请人： NCR INTERNATIONAL INC.

发明人： LAUFFER, Donald, Keith ,  SANWO, Ikuo, Jimmy ,  TIPON, Donald, Greathouse

IPC分类号： H01L23/44

CPC分类号： H01L23/4093 ,  H01L23/445 ,  H01L23/48 ,  H01L2224/48091 ,  H01R12/82 ,  Y10T29/49213 ,  H01L2924/00014

摘要： Integrated circuit packaging assembly (10) in which a plurality of electrical pins (46) of an integrated circuit package (40, 42) is removably mounted to a corresponding plurality of mating pins (50) each having a receptacle (52) filled with liquid mercury (60), and the temperature is reduced such that the liquid mercury (60) solidifies thereby firmly bonding the electrical pins (46 and 50) together. The mating pins (50) are mounted inside a Dewar type vessel (12) and the assembly is covered with a low temperature liquified gas (20) for the dual purpose of solidifying the liquid mercury (60) and cooling the integrated circuit package (40, 42).

公开(公告)号：EP0453786A2

公开(公告)日：1991-10-30

申请号：EP91104665.4

申请日：1991-03-25

申请人： International Business Machines Corporation

发明人： Zingher, Arthur R.

IPC分类号： H01L23/473 ,  H01L23/44 ,  H05K3/00

CPC分类号： F28F13/02 ,  H01L23/445 ,  H01L23/4735 ,  H01L2924/0002 ,  H01M8/04074 ,  H05K3/0085 ,  H01L2924/00

摘要： A system provides convective transfer from a workpiece (10) to a flowing fluid. A gap (16) is formed between the workpiece (10) and a facesheet (12) containing fluid supply nozzles (18) and fluid return nozzles (20). The fluid is fed to the supply nozzles (18), travels a short distance within the gap (16) adjacent to the facesheet (12), and exits via return nozzles (20). The flow cross section and flow density facilitate heat transfer at a moderate flow rate and low fluid pressure. The system is also applicable for chemical transfer such as plating or etching printed circuit boards and for transfer through a semi-permeable membrane.

摘要翻译： 系统提供从工件（10）到流动流体的对流传递。 在工件（10）和包含流体供给喷嘴（18）和流体返回喷嘴（20）的面板（12）之间形成间隙（16）。 流体被供给到供给喷嘴（18），在与面板（12）相邻的间隙（16）内行进短距离，并通过返回喷嘴（20）离开。 流动横截面和流动密度有助于在适度的流速和低流体压力下进行热传递。 该系统还适用于化学转移，如电镀或蚀刻印刷电路板，并通过半透膜转移。

公开(公告)号：EP0144071A3

公开(公告)日：1985-09-25

申请号：EP84114439

申请日：1984-11-29

申请人： FUJITSU LIMITED

发明人： Saito, Toshiyuki ,  Okubo, Naofumi Raionzu Manshon Miyamaedaira ,  Kaneko, Yoshiaki Fujitsu Dai 1 Fujigaoka-ryo 416 ,  Tokumitsu, Yasuyuki

IPC分类号： H01L23/42

CPC分类号： H01L23/445 ,  H01L23/427 ,  H01L23/66 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/45099

摘要： A liquid cooling type high frequency solid state device arrangement comprising: a solid state chip (8); at least one matching circuit (6) connected to the solid state chip (8); a carrier (7) for mounting the solid state chip (8) and the matching circuit (6), constituting a solid state device (24) to be cooled; a coolant vessel (1) for containing a liquid coolant (2), a space for coolant vapor remaining at the top thereof; and a means for condensing the coolant vapor contained in the top space of the vessel (1). At least a part of the solid state device (24) contacts the liquid coolant (2) for boiling and evaporating the coolant. The arrangement is such as to prevent amplitude modulation of the solid state device (24) due to the boiling of the coolant (2).

公开(公告)号：EP2677230A1

公开(公告)日：2013-12-25

申请号：EP13172968.3

申请日：2013-06-20

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives

发明人： Lasfargues, Gilles ,  Cigna, Jean-Charles ,  Fendler, Manuel

IPC分类号： F17C3/08 ,  F25D19/00 ,  G01J5/06

CPC分类号： F28F3/00 ,  G01J5/061 ,  H01L23/445

摘要： L'agencement pour composant électronique à refroidir lors de son fonctionnement, ledit agencement comporte un support (1) destiné à recevoir le composant électronique (16), une embase (2) configurée de sorte à être refroidie, et un élément de liaison (3) reliant mécaniquement et thermiquement l'embase (2) au support (1) de sorte à le refroidir. L'élément de liaison (3) est configuré de sorte que le support (1) soit mobile par rapport à l'embase (2), et l'agencement comporte un système d'ajustement de déplacement (4) configuré de sorte à appliquer un mouvement audit support (1) par rapport à l'embase.

摘要翻译： 布局具有支架（1），所有这些提供了一种用于电子部件的安装。 一种基站被配置为冷却。 连接元件被设置用于机械和热的基体连接到支撑以便冷却基座。 连接元件设置有用于移动应用到支撑相对于寻求做的支撑自由地相对于基座移动所述底座的位移调节系统（4）。 该连接元件设置有两个终端设备并通过一个可变形的元件连接到海誓山盟。 独立权利要求中包括了以下内容：（1）真空冷却室; 和（2）使用真空冷却系统的方法。