公开(公告)号：EP1343109A2

公开(公告)日：2003-09-10

申请号：EP03251395.4

申请日：2003-03-07

申请人： FUJITSU LIMITED

发明人： Manasala, Michael

IPC分类号： G06K9/00

CPC分类号： H01L24/85 ,  G06K9/0002 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/4554

摘要： System for providing an open-cavity semiconductor package and method for wire bonding a finger sensor die (300) to an external circuit. The finger sensor die includes a sensor array (316) having one or more die contacts (302) that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire (314), forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height (310), and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact.

摘要翻译： 系统在外部电路提供用于引线接合的手指传感器（300）的开放腔半导体封装和方法。 手指传感器，其包括传感器阵列（316）具有一个或多个触头（302）是金属丝键合并到外部电路的一个或多个外部触点所以也传感器阵列的可用部分最大化。 所述方法包括在键合线（314）的第一端部形成球的步骤，在所述球与外部电路的选择的外部接触之间的导电连接形成，接合线延伸到选择的接触，以便 形成具有低环路高度（310），与接合线的第二端和所选择的接触之间的导电线迹连接的形成导线环。

公开(公告)号：EP1343109A3

公开(公告)日：2004-11-24

申请号：EP03251395.4

申请日：2003-03-07

申请人： FUJITSU LIMITED

发明人： Manasala, Michael

IPC分类号： G06K9/00 ,  H01L21/60 ,  H01L21/56 ,  H01L23/49

CPC分类号： H01L24/85 ,  G06K9/0002 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/4554

摘要： System for providing an open-cavity semiconductor package and method for wire bonding a finger sensor die (300) to an external circuit. The finger sensor die includes a sensor array (316) having one or more die contacts (302) that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire (314), forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height (310), and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact.