公开(公告)号：EP2334978A2

公开(公告)日：2011-06-22

申请号：EP09785184.4

申请日：2009-10-01

申请人： Optovate Limited

发明人： WOODGATE, Graham, John ,  HARROLD, Jonathan

IPC分类号： F21K99/00 ,  G02B17/08 ,  F21Y101/02

CPC分类号： G02B19/0066 ,  F21K9/232 ,  F21V5/007 ,  F21V5/008 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2107/30 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/95 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/7898 ,  H01L2224/83801 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

摘要： An illumination apparatus and method of manufacture of the same in which an array of light-emitting elements is aligned to an array of optical elements to achieve a thin and efficient light source that can also be arranged to provide directional and/or programmable illumination.

摘要翻译： 一种照明装置及其制造方法，其中发光元件阵列与光学元件阵列对准以实现薄且高效的光源，该光源也可被布置为提供定向和/或可编程照明。

公开(公告)号：EP2041783A2

公开(公告)日：2009-04-01

申请号：EP07785583.1

申请日：2007-06-29

申请人： Epcos AG

发明人： BLOCK, Christian ,  BRUNNER, Sebastian ,  HOFFMANN, Christian

IPC分类号： H01L21/603 ,  H01L21/607 ,  H01L23/485 ,  H01L23/31 ,  H01L23/14 ,  H01L23/15

CPC分类号： H01L24/85 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05644 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49175 ,  H01L2224/4945 ,  H01L2224/78301 ,  H01L2224/83 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： Disclosed is a module for electrical components. In said module, a component chip is glued to the top of a multilayer substrate which comprises integrated wiring and on which bondable terminal faces are provided. The component chip is fitted with bond pads on the upward-facing surface thereof and is connected to the substrate by means of bond wires. The bond wires are guided such that one respective ball thereof is bonded to a terminal face while the wedge thereof is bonded directly to one of the bond pads.

公开(公告)号：EP1343109A3

公开(公告)日：2004-11-24

申请号：EP03251395.4

申请日：2003-03-07

申请人： FUJITSU LIMITED

发明人： Manasala, Michael

IPC分类号： G06K9/00 ,  H01L21/60 ,  H01L21/56 ,  H01L23/49

CPC分类号： H01L24/85 ,  G06K9/0002 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/4554

摘要： System for providing an open-cavity semiconductor package and method for wire bonding a finger sensor die (300) to an external circuit. The finger sensor die includes a sensor array (316) having one or more die contacts (302) that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire (314), forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height (310), and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact.

公开(公告)号：EP2334978B1

公开(公告)日：2018-12-12

申请号：EP09785184.4

申请日：2009-10-01

申请人： Optovate Limited

发明人： WOODGATE, Graham, John ,  HARROLD, Jonathan

IPC分类号： F21K9/90 ,  F21K9/232 ,  F21V5/00 ,  F21Y105/10 ,  F21Y107/30 ,  F21Y115/10 ,  G02B19/00 ,  H01L33/58 ,  H01L33/60

CPC分类号： G02B19/0066 ,  F21K9/232 ,  F21V5/007 ,  F21V5/008 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2107/30 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0071 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/95 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/7898 ,  H01L2224/83801 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

摘要： An illumination apparatus and method of manufacture of the same in which an array of light-emitting elements is aligned to an array of optical elements to achieve a thin and efficient light source that can also be arranged to provide directional and/or programmable illumination.

公开(公告)号：EP2444999A4

公开(公告)日：2012-11-14

申请号：EP10789561

申请日：2010-06-17

申请人： ROHM CO LTD

发明人： HAGA MOTOHARU ,  YOSHIDA SHINGO ,  KASUYA YASUMASA ,  NAGAHARA TOICHI ,  KIMURA AKIHIRO ,  FUJII KENJI

IPC分类号： H01L23/31 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/29 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  B23K20/24 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78307 ,  H01L2224/78309 ,  H01L2224/83 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20757 ,  H01L2924/3512 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/207 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/00015

摘要： A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

摘要翻译： 根据本发明的半导体器件包括半导体芯片，由包含铝的金属材料制成并形成在半导体芯片的顶表面上的电极焊盘，设置在半导体芯片的外围的电极引线，具有 线性延伸的主体部分，并且具有焊盘接合部分和引线接合部分，所述引线接合部分形成在所述主体部分的各个端部处并且分别接合到所述电极焊盘和所述电极引线;以及树脂封装，密封所述半导体芯片，所述电极 引线和接合线，接合线由铜制成，并且整个电极焊盘和整个焊盘接合部分由不透水膜一体地覆盖。

公开(公告)号：EP2461358A1

公开(公告)日：2012-06-06

申请号：EP10804273.0

申请日：2010-07-16

申请人： Nippon Steel Materials Co., Ltd. ,  Nippon Micrometal Corporation

发明人： TERASHIMA, Shinichi ,  UNO, Tomohiro ,  YAMADA, Takashi ,  ODA, Daizo

IPC分类号： H01L21/60 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06

CPC分类号： C22C5/04 ,  C22C5/02 ,  C22C5/06 ,  C22C9/00 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48011 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/4851 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/85564 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/01034 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0102 ,  H01L2924/01013 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2924/01204 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/01001 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01007 ,  H01L2224/45669 ,  H01L2924/2076 ,  H01L2924/01018 ,  H01L2224/48465 ,  H01L2924/20654 ,  H01L2924/20652 ,  H01L2924/20655 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/01004 ,  H01L2924/01033

摘要： There is provided a bonding wire for semiconductor, capable of ensuring a favorable wedge bondability even when bonded to a palladium-plated lead frame, superior in oxidation resistivity and having a core wire of copper or a copper alloy. This bonding wire comprises: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200nm; and an alloy layer formed on a surface of the coating layer, such alloy layer containing a noble metal and palladium and having a thickness of 1 to 80nm. The aforementioned noble metal is either silver or metal, and a concentration of such noble metal in the alloy layer is not less than 10% and not more than 75% by volume.

摘要翻译： 提供了一种用于半导体的接合线，即使当结合到具有优异的氧化电阻率并且具有铜或铜合金的芯线的镀钯引线框时，也能够确保良好的楔形粘结性。 该接合线包括：铜或铜合金的芯线; 含有钯的涂层，其厚度为10〜200nm; 以及形成在涂层表面上的合金层，该合金层含有贵金属和钯，厚度为1〜80nm。 上述贵金属是银或金属，合金层中这种贵金属的浓度不小于10体积％且不大于75体积％。

公开(公告)号：EP0852807B1

公开(公告)日：2010-01-06

申请号：EP96937189.7

申请日：1996-09-19

申请人： Infineon Technologies AG

发明人： HEITZER, Josef ,  KIRSCHBAUER, Josef ,  STAMPKA, Peter

IPC分类号： H01L21/607

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48455 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48624 ,  H01L2224/49425 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015

摘要： The invention concerns a method of electrically connecting a semiconductor chip (1) to at least one contact surface by means of a thin wire whose first end is welded to the at least one contact surface and whose second end is connected to a contact area of the semiconductor chip (1). In order to establish a good connection between the wire and the contact area of the semiconductor chip (1), the second end of the wire is welded to a wedge-shaped metal part (5) which is disposed on the contact area of the semiconductor chip (1) and is conductively connected thereto. The metal part (5) is formed by a nailhead contact (6) whose free end is guided in a loop and connected to the nailhead by a wedge contact.

公开(公告)号：EP0397426A2

公开(公告)日：1990-11-14

申请号：EP90304901.3

申请日：1990-05-04

申请人： Citizen Watch Co. Ltd.

发明人： Ohi, Masayuki

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78302 ,  H01L2224/85051 ,  H01L2224/85148 ,  H01L2224/85203 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/4554

摘要： In an IC packaging structure, ball bonding is per­formed on patterns (4) on a circuit substrate (1) as first bonding, and ballless bonding is performed on pad electrodes (5) on an IC chip (2) as second bonding. An IC packaging method includes a first step of forming a gold ball electrode (5a) on each of pad electrodes (5) of an IC chip, a second step of ball-bonding one end of a gold wire (6) on each of patterns of a circuit substrate, and a third step of thermally com­pression-bonding the other end of the gold wire on a corre­sponding one of the gold ball electrodes formed on the pad electrodes.

摘要翻译： 在IC封装结构中，作为第一接合，在电路基板（1）上的图案（4）上进行球接，并且作为第二接合对IC芯片（2）上的焊盘电极（5）进行无球接合。 IC封装方法包括在IC芯片的每个焊盘电极（5）上形成金球电极（5a）的第一步骤，将金线（6）的一端与每个图案 以及将形成在焊盘电极上的相应的一个金球电极上的金线的另一端热压接的第三步骤。

公开(公告)号：EP0126664B1

公开(公告)日：1989-08-02

申请号：EP84400788.0

申请日：1984-04-19

申请人： FUJITSU LIMITED

发明人： Mizukoshi, Masataka ,  Endo, Teiichi

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/498 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49052 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/4945 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2224/05599 ,  H01L2224/85399

公开(公告)号：EP2461358A4

公开(公告)日：2015-10-14

申请号：EP10804273

申请日：2010-07-16

申请人： NIPPON STEEL & SUMIKIN MAT CO ,  NIPPON MICROMETAL CORP

发明人： TERASHIMA SHINICHI ,  UNO TOMOHIRO ,  YAMADA TAKASHI ,  ODA DAIZO

IPC分类号： H01L21/60 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06

CPC分类号： C22C5/04 ,  C22C5/02 ,  C22C5/06 ,  C22C9/00 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4516 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48011 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/4851 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/85564 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/01034 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0102 ,  H01L2924/01013 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2924/01204 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/01001 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01007 ,  H01L2224/45669 ,  H01L2924/2076 ,  H01L2924/01018 ,  H01L2224/48465 ,  H01L2924/20654 ,  H01L2924/20652 ,  H01L2924/20655 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/01004 ,  H01L2924/01033