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    WIRELESS COMMUNICATION DEVICE AND CONTROL METHOD THEREOF
    2.
    发明公开
    WIRELESS COMMUNICATION DEVICE AND CONTROL METHOD THEREOF 审中-公开
    无线通信装置及其控制方法

    公开(公告)号：EP3068046A1

    公开(公告)日：2016-09-14

    申请号：EP16159109.4

    申请日：2016-03-08

    申请人： FUJITSU LIMITED

    发明人： HONDA, Atsushi ,  OHASHI, Yoji

    IPC分类号： H03F1/02 ,  H01Q3/26 ,  H03F3/19 ,  H03F3/21 ,  H03F3/24 ,  H03F3/72 ,  H03G3/30 ,  H03H11/16

    CPC分类号： H04B7/0667 ,  H01Q3/26 ,  H03F1/0277 ,  H03F3/19 ,  H03F3/211 ,  H03F3/245 ,  H03F3/72 ,  H03F2200/451 ,  H03F2203/21112 ,  H03G3/3042 ,  H03G3/3052 ,  H03G3/3084 ,  H03H11/34 ,  H04B1/40 ,  H04L5/006

    摘要： A wireless communication device includes a delay circuit to generate four or more delay signals, an amplifier circuit amplifying the four or more delay signals to generate four or more amplified delay signals, and a combiner circuit combining at least two amplified delay signals to generate an output signal, a second phase of a second amplified delay signal is between a first phase of a first amplified delay signal and a third phase of a third amplified delay signal, gains of the amplifier circuit for the four or more delay signals are controlled such that the output signal is generated by combining the first amplified delay signal and the third amplified delay signal, and a phase of the output signal is between the first phase of the first amplified delay signal and the third phase of the third amplified delay signal.

    摘要翻译： 一种无线通信设备包括：延迟电路，用于生成四个或更多个延迟信号;放大器电路，放大四个或更多个延迟信号以生成四个或更多个放大的延迟信号;以及组合器电路，组合至少两个放大的延迟信号以生成输出 信号，第二放大延迟信号的第二相位在第一放大延迟信号的第一相位和第三放大延迟信号的第三相位之间，控制用于四个或更多个延迟信号的放大器电路的增益，使得 通过组合第一放大延迟信号和第三放大延迟信号来生成输出信号，并且输出信号的相位在第一放大延迟信号的第一相位和第三放大延迟信号的第三相位之间。

    CIRCUIT MODULE
    3.
    发明公开
    CIRCUIT MODULE 审中-公开
    SCHALTUNGSMODUL

    公开(公告)号：EP2983203A1

    公开(公告)日：2016-02-10

    申请号：EP15183032.0

    申请日：2006-03-23

    申请人： FUJITSU LIMITED ,  Sumitomo Electric Device Innovations, Inc.

    发明人： SHIMURA, Toshihiro ,  OHASHI, Yoji ,  NUNOKAWA, Mitsuji

    IPC分类号： H01L23/552 ,  H01L23/66 ,  H01L23/055 ,  H01L23/06

    CPC分类号： H01L23/66 ,  H01L23/055 ,  H01L23/06 ,  H01L23/552 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/3011

    摘要： In a high-frequency circuit module, a resistance film (7a) is formed on a side of a semiconductor circuit chip (6), mounted above a dielectric substrate (1) through a ground metal layer (4), facing the dielectric substrate. A distance from the ground metal layer (2) to the resistance film (7) is a 1/4 wavelength at a predetermined frequency, and the resistance film has a sheet resistance equal to a characteristic impedance of air. A second dielectric substrate (12) with a metal layer (13) formed on a side opposite to the resistance film (7a) can be mounted. When being adhered to the second dielectric substrate (12), the resistance film (7a) has a characteristic impedance determined by a permittivity of a material of the semiconductor circuit chip (6). When it is formed spaced apart from the semiconductor circuit chip, the resistance film has a sheet resistance equal to a characteristic impedance of air. The thickness of the second dielectric substrate is a 1/4 wavelength in a desired frequency.

    摘要翻译： 在高频电路模块中，电阻膜（7a）形成在半导体电路芯片（6）的一侧，通过接地金属层（4）安装在电介质基片（1）的上方，面对电介质基片。 距接地金属层（2）至电阻膜（7）的距离为预定频率的1/4波长，电阻膜具有与空气的特性阻抗相等的薄层电阻。 可以安装具有形成在与电阻膜（7a）相对的一侧上的金属层（13）的第二电介质基板（12）。 当粘附到第二电介质基板（12）时，电阻膜（7a）具有由半导体电路芯片（6）的材料的介电常数确定的特性阻抗。 当其形成为与半导体电路芯片间隔开时，电阻膜具有等于空气的特性阻抗的薄层电阻。 第二电介质基板的厚度为期望频率的1/4波长。

    STACKED WAVEGUIDE SUBSTRATE, RADIO COMMUNICATION MODULE, AND RADAR SYSTEM
    4.
    发明公开
    STACKED WAVEGUIDE SUBSTRATE, RADIO COMMUNICATION MODULE, AND RADAR SYSTEM 审中-公开
    GESTAPELTES WELLENLEITERSUBSTRAT，FUNKKOMMUNIKATIONSMODUL UND RADARSYSTEM

    公开(公告)号：EP2963729A1

    公开(公告)日：2016-01-06

    申请号：EP15174285.5

    申请日：2015-06-29

    申请人： FUJITSU LIMITED

    发明人： ASHIDA, Hiroshi ,  OHASHI, Yoji

    IPC分类号： H01P1/162 ,  H01P5/02

    CPC分类号： G01S7/03 ,  G01S13/0209 ,  H01P1/162 ,  H01P3/16 ,  H01P5/028

    摘要： A stacked-waveguide substrate includes: a body configured to include a first dielectric-substrate, a second dielectric-substrate, and a third dielectric-substrate which are stacked in this order; a first conductor-pattern configured to be formed on a bottom surface of the first dielectric-substrate; a second conductor-pattern configured to be formed on a top surface of the third dielectric-substrate in a position corresponding to the first conductor-pattern; a first conductor-film configured to be located at an interface between the first dielectric-substrate and the second dielectric-substrate, and to have a first opening which faces the first conductor-pattern; a second conductor-film configured to be located at an interface between the second dielectric-substrate and the third dielectric-substrate, and to have a second opening which faces the second conductor-pattern; a first wiring line configured to cross the first opening to the first conductor-pattern; and a second wiring line configured to cross the second opening to the second conductor-pattern.

    摘要翻译： 叠层波导基板包括：主体，被配置为包括依次堆叠的第一介质衬底，第二电介质衬底和第三电介质衬底; 构造成形成在所述第一电介质基板的底表面上的第一导体图案; 第二导体图案，被配置为在与第一导体图案对应的位置形成在第三电介质基板的顶表面上; 第一导体膜，被配置为位于第一电介质基板和第二电介质基板之间的界面处，并且具有面向第一导体图案的第一开口; 第二导体膜，被配置为位于第二电介质基板和第三电介质基板之间的界面处，并且具有面向第二导体图案的第二开口; 配置成将第一开口与第一导体图案交叉的第一布线; 以及第二配线，被配置为将第二开口与第二导体图案交叉。