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公开(公告)号：EP1219148A1
公开(公告)日：2002-07-03
申请号：EP00951731.9
申请日：2000-08-10
申请人： Ford Motor Company
CPC分类号： H05K3/361 , H01R12/62 , H05K1/0293 , H05K1/117 , H05K1/118 , H05K3/0052 , H05K3/225 , H05K2201/053 , H05K2201/09127 , H05K2201/09409 , H05K2201/09709 , H05K2201/0979 , H05K2203/0228 , H05K2203/175
摘要： A repairable flex circuit (1), comprising: a generally flexible, electrically insulative substrate (2) having a first edge (3) thereof, and a plurality of electrically conductive circuit traces (5) arranged on the substrate. Each circuit trace has an end thereof terminating at a first connector element (8) proximate the first edge (3), and at least one second connector element (13) spaced apart from the first connector element, with each of said first and second connector elements being a plated through hole, a plated blind via, or a solder pad.
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公开(公告)号：EP1210849A1
公开(公告)日：2002-06-05
申请号：EP00953287.0
申请日：2000-08-10
申请人： Ford Motor Company
CPC分类号： H05K3/361 , H05K1/0292 , H05K1/0295 , H05K1/117 , H05K2201/09227 , H05K2201/09954
摘要： A multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate (11) having a first edge (22) and first and second edge regions (44/55), wherein at least the first edge region (44) is defined along the first edge (22); (b) a first array (77) of electrical connection features (66) disposed on or within the substrate proximate the first edge region (44); (c) a second array (88) of electrical connection features (66) disposed on or within the substrate proximate the second edge region (55), wherein the second array (88) is substantially a duplication or a mirror image of the first array (77); and (d) a plurality of circuit traces (99) disposed on or within the substrate such that each electrical connection feature (66) of the first array (77) is connected by one of the circuit traces (99) to a corresponding electrical connection feature (66) of the second array (88).
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3.发明公开
公开(公告)号：EP1219149A1
公开(公告)日：2002-07-03
申请号：EP00951739.2
申请日：2000-08-10
申请人： Ford Motor Company
CPC分类号： H05K3/361 , H05K1/0293 , H05K1/117 , H05K1/118 , H05K3/0052 , H05K3/225 , H05K2201/053 , H05K2201/09127 , H05K2201/09409 , H05K2201/09709 , H05K2201/0979 , H05K2203/0228 , H05K2203/175 , Y10T29/49124 , Y10T29/49169 , Y10T29/4973 , Y10T29/49732
摘要： An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article (10) includes: a flexible dielectric substrate (12) having first and second edges 14/16, and a plurality of conductive circuit traces (18) arranged on or within the substrate, wherein each of the traces extends from proximate the first edge (14) to proximate the second edge (16). Each of the circuit traces (18) includes: a first connection feature (20) disposed proximate the first edge (14); a second connection feature (22) disposed proximate the second edge (16); and at least one third connection feature (24) disposed between the first and second edges (14/16). Each of the first, second, and third connection features (20/22/24) is a plated through hole, a plated blind via, or a mounting pad. This article (10) may be used to connect together the first and second circuits (50/60) using the first and second connection features (20/22), such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article (10) may be cut so as to present a set of third connection features (24) to which a new replacement circuit may be connected.
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