公开(公告)号：EP3232743A1

公开(公告)日：2017-10-18

申请号：EP15866432.6

申请日：2015-12-08

Applicant: Fujikura, Ltd.

Inventor： OGURA, Shingo ,  HAMMURA, Tetsu

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0283 ,  H05K1/0271 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09281 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09845 ,  H05K2201/0989 ,  H05K2201/10522

Abstract: A stretchable board is configured to include: a base material (10) having stretchability; a first and second electronic components (20 and 30) mounted on the base material (10); a wire (40) arranged on the base material (10); and a first and second connectors (50A and 50B) for connecting the first and second electronic components (20 and 30) and the wire (40) to each other, in which at least a portion of the first electronic component (20) and at least a portion of the second electronic component (30) face each other in a planned stretching direction (D) in which the base material (10) includes: a facing zone (Z1) interposed between the first and second electronic components (20 and 30) in a planned stretching direction (D) and a non-facing zone (Z2) other than the facing zone (Z1) on the base material (10), in which at least a portion of the first connector (50A) or at least a portion of the second connector (50B) are arranged in the non-facing zone (Z2), and in which at least one of the wires (40) is arranged in the non-facing zone (Z2).

Abstract translation: 伸缩性板构成为具有：具有伸缩性的基材（10） 安装在基材（10）上的第一和第二电子元件（20和30）; 布置在所述基底材料（10）上的导线（40）; 以及用于将第一和第二电子元件（20和30）与导线（40）彼此连接的第一和第二连接器（50A和50B），其中第一电子元件（20）的至少一部分和 所述第二电子部件（30）的至少一部分在所述基材（10）具有包含所述第一电子部件（20）和所述第二电子部件（30）之间的相对区域（Z1）的预定拉伸方向（D） ）在所述基材（10）上沿着预定的拉伸方向（D）和除所述面对区域（Z1）之外的非面向区域（Z2）形成，其中所述第一连接器（50A）的至少一部分或 第二连接器50B的一部分布置在非面对区域Z2中，并且其中至少一个导线40布置在非面对区域Z2中。

公开(公告)号：EP1873826B1

公开(公告)日：2016-04-20

申请号：EP06730385.9

申请日：2006-03-29

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： SUESADA, Tsuyoshi ,  HIGASHIBATA, Kazuaki ,  HOSOKAWA, Toshihiro ,  KAWATA, Masaki

IPC: H01L23/15 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L23/49816 ,  H01L23/15 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/81385 ,  H01L2924/09701 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/10727 ,  Y02P70/613

公开(公告)号：EP2899751A1

公开(公告)日：2015-07-29

申请号：EP13839334.3

申请日：2013-05-17

Applicant: NGK Spark Plug Co., Ltd.

Inventor： HAYASHI, Takahiro ,  NAGAI, Makoto ,  MORI, Seiji ,  NISHIDA, Tomohiro ,  WAKAZONO, Makoto ,  ITO, Tatsuya

IPC: H01L23/12 ,  H01L21/60 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/111 ,  G03F7/038 ,  G03F7/20 ,  G03F7/2024 ,  G03F7/30 ,  H01L23/49822 ,  H01L2224/16237 ,  H05K1/0298 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/058 ,  H05K2203/0594 ,  H05K2203/1476

Abstract: To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction. The solder resist layer 25 includes, within the opening portion 43, a side-surface covering portion 55 that covers the side surface of the connecting terminal portion 41 and a projecting wall portion 56 that is integrally formed with the side-surface covering portion 55 and disposed to project so as to intersect with the connection region 51.

Abstract translation: 提供与半导体芯片的连接可靠性优异的布线板。 在有机配线基板10的基板主面11侧形成层叠有树脂绝缘层21,22和导体层24的第一堆积层31.第一堆积层31的最外层用导体层24包含 多个用于倒装安装半导体芯片的连接端子部分41。 多个连接端子部分41通过阻焊层25的开口部分43暴露。每个连接端子部分41包括用于半导体芯片的连接区域51和布置成从连接区域51沿着 平面方向。 阻焊层25在开口部分43内包括覆盖连接端子部分41的侧表面的侧表面覆盖部分55和与侧表面覆盖部分55一体形成的突出壁部分56以及 设置成突出以便与连接区域51相交。

公开(公告)号：EP2738798A4

公开(公告)日：2015-06-03

申请号：EP12817380

申请日：2012-07-20

Applicant: KYOCERA CORP

Inventor： TSUJINO MAHIRO ,  MIYAHARA MANABU

IPC: H01L23/04 ,  H01L23/00 ,  H01L23/057 ,  H01L23/10

CPC classification number: H01L24/42 ,  H01L23/057 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/171 ,  H05K3/3442 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09409 ,  H05K2201/09909 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2726925A4

公开(公告)日：2015-05-20

申请号：EP12803948

申请日：2012-06-27

Applicant: FINISAR CORP

Inventor： ZHAO YAN YANG ,  HUEBNER BERND ,  DU TENGDA ,  LEE YUHENG

IPC: G02B6/38 ,  G02B6/42 ,  G02B6/46 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: G02B6/4279 ,  G01J1/0425 ,  G02B6/4246 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/10121

Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

公开(公告)号：EP2218144A4

公开(公告)日：2015-04-15

申请号：EP08846823

申请日：2008-10-30

Applicant: FRAMATOME CONNECTORS INT

Inventor： JOHNESCU DOUGLAS M ,  MINICH STEVEN ,  SMITH STEPHEN B

IPC: H01R13/514 ,  H01R12/51 ,  H01R12/70 ,  H01R12/71 ,  H01R13/6471 ,  H01R13/6477 ,  H05K1/14 ,  H05K7/14

CPC classification number: H01R13/6471 ,  H01R12/51 ,  H01R12/7082 ,  H01R12/71 ,  H01R13/514 ,  H01R13/6477 ,  H05K1/0245 ,  H05K1/116 ,  H05K3/325 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10189 ,  H05K2201/1059 ,  Y10T29/49222

公开(公告)号：EP2621250B1

公开(公告)日：2014-02-26

申请号：EP13152505.7

申请日：2013-01-24

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Muramatsu, Shigetsugu ,  Shimizu, Hiroshi ,  Horikawa, Yasuyoshi

IPC: H05K1/02 ,  H05K1/05 ,  F21K99/00 ,  H05K3/34

CPC classification number: H05K7/2039 ,  F21K9/90 ,  F21V7/00 ,  H01L2224/16225 ,  H05K1/0274 ,  H05K1/056 ,  H05K3/3452 ,  H05K3/46 ,  H05K2201/0191 ,  H05K2201/09409 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054

公开(公告)号：EP2587533A1

公开(公告)日：2013-05-01

申请号：EP12189184.0

申请日：2012-10-19

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Shimizu, Hiroshi ,  Kimura, Yasuyuki ,  Arai, Tadashi

IPC: H01L23/14 ,  H01L25/075

CPC classification number: H01L23/142 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K2201/09409 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wiring substrate (1) includes a substrate (10), a first insulating layer (20) formed on the substrate (10), wiring patterns (30) formed on a first surface (R1) of the first insulating layer (20), and a second insulating layer (50) formed on the first surface (R1) of the first insulating layer (20). The second insulating layer (50) covers the wiring patterns (30) and includes a first opening (50X) that partially exposes adjacent wiring patterns (30) as a pad (CA). A projection (70) is formed in an outer portion of the substrate (10) located outward from where the first opening (50X) is arranged. The projection (70) rises in a thickness direction of the substrate (10).

Abstract translation: 的布线基板（1）包括形成在第一表面上的第一绝缘层的（R 1）（20）形成在所述基板的基板（10），一个第一绝缘层（20）（10），配线图案（30）， 和第二绝缘层（50）形成在所述第一表面上的第一绝缘层（20）的（R 1）上。 在第二绝缘层（50）覆盖所述配线图案（30）和包括第一开口（50X）做部分地暴露相邻布线图案（30），其为垫（CA）。 的突出物（70）形成在位于向外从所述第一开口（50X）设置在所述基板（10）的外部部分。 所述突出部（70）升起衬底（10）的厚度方向。

公开(公告)号：EP2360661A4

公开(公告)日：2013-01-02

申请号：EP09827400

申请日：2009-07-01

Applicant: SHARP KK

Inventor： MORIWAKI HIROYUKI

IPC: H05K3/36 ,  H01L23/498 ,  H01L27/02 ,  H01L27/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K3/361 ,  H01L23/49811 ,  H01L27/0203 ,  H01L27/12 ,  H01L27/124 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K1/025 ,  H05K1/113 ,  H05K3/323 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09436 ,  H05K2201/10128 ,  H01L2924/00

公开(公告)号：EP2529605A1

公开(公告)日：2012-12-05

申请号：EP11736612.0

申请日：2011-01-17

Applicant: BYD Company Limited ,  Shenzhen BYD Auto R&D Company Limited

Inventor： XIE, Bingbin ,  PANG, Daocheng

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H01R13/03 ,  H01R13/04 ,  H01R13/113 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09709

Abstract: A contact piece of a gold finger comprises: a first main body segment; a second main body segment; and a transition segment connected to the first main body segment and the second main body segment, respectively, in a vertical direction, in which an upper edge and a lower edge of the transition segment are inclined with respect to a lateral direction respectively. A gold finger and a connector comprising the same are also provided.