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公开(公告)号：EP0953207B1
公开(公告)日：2001-08-16
申请号：EP97950330.7
申请日：1997-12-24
IPC分类号： H01L21/607 , H01L21/603
CPC分类号： H01L24/85 , B23K20/007 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/06135 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48505 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48744 , H01L2224/48824 , H01L2224/48844 , H01L2224/49175 , H01L2224/78268 , H01L2224/78301 , H01L2224/78313 , H01L2224/78318 , H01L2224/85001 , H01L2224/8502 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85444 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/00014 , H01L2224/05655 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： A method is disclosed for on-line doping of metallic connecting wire for use in integrated circuits. The method comprises the steps of: providing a bonding apparatus (70) comprising a bonding tool (40), said bonding tool having a tip (44) through which a capillary (42) runs, such that metallic connecting wire (20) may be fed through said tip (44); extending an end of the connecting wire (20) a predetermined length beyond the tip (44) of said bonding tool (40); and forming a doped area on the end of said wire by: bringing the end of said wire into contact with dopant material (52), and applying predetermined amounts of pressure, heat, and ultrasonic vibration to said end of the wire (20) for a predetermined amount of time.
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公开(公告)号：EP0953207A1
公开(公告)日：1999-11-03
申请号：EP97950330.0
申请日：1997-12-24
CPC分类号： H01L24/85 , B23K20/007 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/06135 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48505 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48744 , H01L2224/48824 , H01L2224/48844 , H01L2224/49175 , H01L2224/78268 , H01L2224/78301 , H01L2224/78313 , H01L2224/78318 , H01L2224/85001 , H01L2224/8502 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2224/85444 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/00014 , H01L2224/05655 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要： A method is disclosed for on-line doping of metallic connecting wire for use in integrated circuits. The method comprises the steps of: providing a bonding apparatus (70) comprising a bonding tool (40), said bonding tool having a tip (44) through which a capillary (42) runs, such that metallic connecting wire (20) may be fed through said tip (44); extending an end of the connecting wire (20) a predetermined length beyond the tip (44) of said bonding tool (40); and forming a doped area on the end of said wire by: bringing the end of said wire into contact with dopant material (52), and applying predetermined amounts of pressure, heat, and ultrasonic vibration to said end of the wire (20) for a predetermined amount of time.
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