公开(公告)号：EP1129510B1

公开(公告)日：2005-10-26

申请号：EP99962755.7

申请日：1999-11-10

Applicant: FormFactor, Inc.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  KHANDROS, Igor, Y. ,  MADSEN, Alec ,  MATHIEU, Gaetan, L.

IPC: H01R12/22

CPC classification number: H01R13/2407 ,  G01R1/06711 ,  G01R1/06727 ,  H01R4/26 ,  H01R9/091 ,  H01R12/57 ,  H01R13/2442 ,  H01R2201/20 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

公开(公告)号：EP1579225A2

公开(公告)日：2005-09-28

申请号：EP03800059.2

申请日：2003-12-18

Applicant: FormFactor, Inc.

Inventor： GRUBE, Gary, W. ,  MATHIEU, Gaetan, L. ,  MADSEN, Alec

IPC: G01R1/067

CPC classification number: G01R1/06733 ,  G01R1/06716 ,  G01R1/0675 ,  G01R1/07314 ,  G01R3/00

Abstract: An elongate, columnar micro-mechanical structure (100) disposed along a central longitudinal axis (101); the structure is made up of laminated structural layers (102, 104, 106), each comprised of a structural material. The layers define a substantially rigid base portion (108) at a proximal end of the structure, a resilient intermediate portion (110) extending from the base portion along the central axis, and a contact tip (112) extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.

公开(公告)号：EP1129510A1

公开(公告)日：2001-09-05

申请号：EP99962755.7

申请日：1999-11-10

Applicant: FORMFACTOR, INC.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  KHANDROS, Igor, Y. ,  MADSEN, Alec ,  MATHIEU, Gaetan, L.

IPC: H01R12/22

CPC classification number: H01R13/2407 ,  G01R1/06711 ,  G01R1/06727 ,  H01R4/26 ,  H01R9/091 ,  H01R12/57 ,  H01R13/2442 ,  H01R2201/20 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.