公开(公告)号：EP3277504A2

公开(公告)日：2018-02-07

申请号：EP16704626.7

申请日：2016-02-15

申请人： Feinmetall GmbH

发明人： BURGOLD, Jörg ,  KÖNIG, Christian ,  SCHÄFER, Wolfgang

IPC分类号： B33Y80/00 ,  G01R1/067 ,  H01R13/24 ,  G01R3/00 ,  B29C67/00

CPC分类号： B33Y80/00 ,  B29C64/00 ,  B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  G01R1/06716 ,  G01R1/06722 ,  G01R3/00 ,  H01R12/714 ,  H01R13/03 ,  H01R13/035 ,  H01R13/2407 ,  H01R43/16

摘要： The invention relates to a method for producing at least one spring contact pin (9) acting as an electrical contact, or a spring contact pin arrangement (25) comprising at least one such spring contact pin (9). The following steps are provided: - producing at least one base part (8) of the spring contact pin (9), at least one section of said base part (8) being made of plastic, and - subsequently metallising at least the section of the base part (8) that is made of plastic. The invention also relates to a spring contact pin (9) produced according to said method, or a spring contact pin arrangement (25) having at least one such spring contact pin (9).

公开(公告)号：EP3241028A1

公开(公告)日：2017-11-08

申请号：EP15823139.9

申请日：2015-12-14

申请人： Technoprobe S.p.A

发明人： CRIPPA, Giuseppe

IPC分类号： G01R1/067

CPC分类号： G01R1/06761 ,  G01R1/06716 ,  G01R1/06738 ,  G01R3/00 ,  H01R13/03 ,  H01R13/2464

摘要： It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.

公开(公告)号：EP3227692A2

公开(公告)日：2017-10-11

申请号：EP15820057.6

申请日：2015-11-30

申请人： Technoprobe S.p.A

发明人： ACCONCIA, Daniele ,  VALLAURI, Raffaele

IPC分类号： G01R1/073

CPC分类号： G01R1/07357 ,  G01R1/06716

摘要： It is described a testing head (20) comprising vertical probes including at least one guide (22) provided with guide holes (22A) for housing a plurality of contact probes (21), each of the contact probes (21) having at least one contact tip (25) able to ensure the mechanical and electrical contact with a corresponding contact pad (26) of a device under test (27), the guide (22) being housed in a containment element (23) of the testing head (20). Suitably, each of the contact probes (21) comprises a deformed portion (30), placed in a bending zone (20A) between the guide (22) and the device under test (27), that deformed portion (30) being adapted to further deform during the normal working of the testing head (20) and being prolonged, at least towards the device under test (27), by an end portion (31) having a diameter suitable to realize the contact tip (25), the end portion (31) having a longitudinal extension or height exceeding 500 μm.

摘要翻译： 描述了包括垂直探针的测试头（20），所述垂直探针包括设置有用于容纳多个接触探针（21）的引导孔（22A）的至少一个引导件（22），每个接触探针（21）具有至少一个 （25），其能够确保与被测设备（27）的相应接触垫（26）的机械和电接触，所述引导件（22）被容纳在所述测试头（20）的容纳元件（23） ）。 合适地，每个接触探针（21）包括放置在引导件（22）和被测试器件（27）之间的弯曲区域（20A）中的变形部分（30），该变形部分（30）适于 在测试头（20）的正常工作期间进一步变形，并且被具有适于实现接触尖端（25）的直径的端部（31）至少朝向被测试器件（27）延长， 部分（31）具有超过500μm的纵向延伸或高度。

公开(公告)号：EP2747210B1

公开(公告)日：2017-08-16

申请号：EP12839653.8

申请日：2012-03-15

申请人： Omron Corporation

发明人： SAKAI, Takahiro ,  HEMMI, Yoshinobu

IPC分类号： H01R13/24 ,  H01R33/76 ,  G01R1/067

CPC分类号： G01R1/06716 ,  G01R1/06722 ,  H01R13/2428 ,  H01R2201/20

公开(公告)号：EP3037828A1

公开(公告)日：2016-06-29

申请号：EP15201907.1

申请日：2015-12-22

申请人： Tektronix, Inc.

发明人： McGrath, James ,  Pollock, Ira

IPC分类号： G01R1/067 ,  G01R31/02

CPC分类号： G01R1/06716 ,  G01R1/06788 ,  G01R31/026

摘要： A fault detection circuit for a flexible probe tip (200) includes one or more conductive fault detection traces (210) on a flexible substrate (202) which are connected to a fault detector (240) capable of determining if an electrical discontinuity or defect is present in the fault detection traces (210). The fault detector (240) may also include a fault indicator, such as a light, to indicate to a user that it has detected a discontinuity and therefore that flexible probe tip (200) should not be soldered onto the user's device under test. The fault detector (240) may determine that there is a discontinuity in the fault detection traces (210) by checking if the impedance of the fault detection trace (210) changes, or by checking for a drop in voltage from one end of the fault detection trace to the other end, or by using other methods.

摘要翻译： 用于柔性探针尖端（200）的故障检测电路包括柔性基板（202）上的一个或多个导电故障检测迹线（210），所述导电故障检测迹线连接到故障检测器（240），所述故障检测器能够确定电不连续性或缺陷是否为 存在于故障检测迹线（210）中。 故障检测器（240）还可以包括诸如光的故障指示器，以向用户指示其已经检测到不连续性，并且因此灵活的探针尖端（200）不应该被焊接到被测试的用户的设备上。 故障检测器（240）可以通过检查故障检测迹线（210）的阻抗是否改变或者通过检查故障一端的电压下降来确定故障检测迹线（210）中存在不连续性 检测轨迹到另一端，或使用其他方法。

公开(公告)号：EP2689259A4

公开(公告)日：2014-12-17

申请号：EP12761411

申请日：2012-03-07

申请人： UNIV WINDSOR

发明人： RASHIDZADEH RASHID ,  KANDALAFT NABEEH ,  AHMADI MAJID

IPC分类号： G01R31/28 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073

CPC分类号： G01R1/0408 ,  G01R1/06716 ,  G01R31/2822 ,  G01R31/2889

公开(公告)号：EP2725364A1

公开(公告)日：2014-04-30

申请号：EP11868278.0

申请日：2011-06-22

申请人： Meiko Electronics Co., Ltd.

发明人： SHINGAI, Noboru

IPC分类号： G01R1/067

CPC分类号： G01R1/06733 ,  G01R1/06716 ,  G01R1/06761 ,  G01R3/00 ,  H01R13/2421 ,  H01R2201/20

摘要： A spiral probe includes a tapered distal end portion (2) configured to be brought into direct contact with an inspection object, a hollow, nearly cylindrical distal body (3) extending in one direction from the base of the distal end portion (2), a hollow, nearly cylindrical flexible portion (4) integral with and continuously extending in the one direction from the distal body (3) and having a spiral outer peripheral surface, and a hollow, nearly cylindrical proximal end portion (5) integral with and continuously extending in the one direction from the flexible portion (4), wherein the distal body (3), the flexible portion (4) and the proximal end portion (5) have outer peripheral surfaces aligned with each other in the one direction.

摘要翻译： 螺旋探头包括被构造成与检查对象直接接触的锥形远端部分（2），从远端部分（2）的基部沿一个方向延伸的中空的几乎圆柱形的远端本体（3） 一个中空的近似圆柱形的柔性部分（4），与远侧本体（3）在一个方向上形成一个整体并连续地延伸，并且具有一个螺旋形外周表面，以及一个中空的几乎圆柱形的近端部分（5） 从所述柔性部分（4）沿所述一个方向延伸，其中所述远端本体（3），所述柔性部分（4）和所述近端部分（5）具有在所述一个方向上彼此对准的外周表面。

公开(公告)号：EP2645113A2

公开(公告)日：2013-10-02

申请号：EP13160968.7

申请日：2013-03-26

申请人： Kabushiki Kaisha Nihon Micronics

发明人： Sato, Minoru

IPC分类号： G01R1/073 ,  G01R1/067

CPC分类号： G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/07357

摘要： Occurrence of a spark is suppressed, and burnout or removal of a probe is prevented in a probe of the present invention.
The probe of the present invention is a probe provided with a linear main body portion having a tip in contact with an electrode of a member to be tested in a state where a board-side end is in contact with the circuit board side of a probe card and an elastic support portion which is provided on a board-side end portion of the main body portion and elastically supports the main body portion on the probe card side. The elastic support portion has its base end side integrally fixed to the board-side end portion of the main body portion and is formed with the distal end side directed toward the tip portion of the main body portion and curved having an arc shape toward the main body portion side. Moreover, two pieces of the elastic support portion are provided symmetrically on the both sides sandwiching the main body portion on the board-side end portion of the main body portion and they are configured by being curved, each having an arc shape with the same radius of curvature. The above-described probe is used as a probe to be provided in plural in the probe card.

摘要翻译： 抑制火花的发生，并且在本发明的探针中防止探测器的烧坏或去除。 本发明的探针是具有线状主体部分的探针，该线性主体部分在板侧端与探针的电路板侧接触的状态下具有与待测试部件的电极接触的尖端 卡片和弹性支撑部分，其设置在主体部分的板侧端部并且弹性地支撑探针卡侧的主体部分。 弹性支撑部的基端侧一体地固定在主体部的基板侧端部，并且形成有朝向主体部的前端侧的前端侧，朝向主体部的弧形弯曲 身体部分侧。 此外，在主体部的基板侧端部的夹着主体部的两侧对称地设置有两个弹性支撑部，并且它们通过弯曲构成，每个具有相同半径的弧形 的曲率。 将上述探针用作在探针卡中多个提供的探针。

公开(公告)号：EP2293086A8

公开(公告)日：2012-01-18

申请号：EP10012000.5

申请日：2006-10-31

申请人： Capres A/S

发明人： Petersen, Dirch Hjort

IPC分类号： G01R1/067

CPC分类号： G01R1/06716

摘要： The present invention relates to a probe (502) for testing electrical properties of test samples (508). The probe may comprise a body (504) having a probe arm (506) defining a proximal and an opposite distal end, the probe arm extending from the body at the proximal end of the probe arm, a first axis defined by the proximal and the distal end. Further, the probe arm may define a geometry allowing flexible movement of the probe arm along the first axis and along a second axis perpendicularly to the first axis and along a third axis orthogonal to a plane defined by the first axis and second axis.

公开(公告)号：EP1321978B1

公开(公告)日：2010-02-17

申请号：EP03003489.6

申请日：1997-05-15

申请人： FormFactor, Inc.

发明人： Khandros, Igor Y. ,  Pedersen, David V.

IPC分类号： H01L21/48 ,  H01L21/60 ,  H05K1/18 ,  H05K3/34 ,  G01R1/073

CPC分类号： H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2224/13099 ,  H01L2924/00

摘要： Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate (106 and 108) having active electronic components (106a, 106b, 106c, 106d) such as ASICs mounted to an interconnection substrate (108) or incorporated therein, metallic spring contact element (110) effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) (102a, 102b, 102c, 102d) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements (110) may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. A significant reduction in interconnect count and consequent simplification of the interconnection substrate (108) is realized because the ASICs are capable of receiving a plurality of signals for testing the DUTs over relatively few signal lines from a host controller (116) and promulgating these signals over the relatively many interconnections between the ASICs and the DUTS.