公开(公告)号：EP2027477A2

公开(公告)日：2009-02-25

申请号：EP07811949.2

申请日：2007-05-25

Applicant: FormFactor, Inc.

Inventor： MILLER, Charles, A. ,  SPORCK, A., Nicholas ,  ELDRIDGE, Benjamin, N.

IPC: G01R31/02

CPC classification number: G01R1/06711 ,  G01R1/06727 ,  G01R1/07 ,  G01R31/3025

Abstract: A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capacitively or inductively coupled from the probe tip to the IC. Testing can be performed during early fabrication steps of the wafer without the need for applying a metalization layer to the wafer to form bond pads. Testing can be performed by inductively coupling an AC signal to the probe tip, with coupling enhanced by including a magnetic material in the dielectric probe tip. Using an AC test signal enables testing of ICs without requiring separate power and ground connections.

公开(公告)号：EP1877807A2

公开(公告)日：2008-01-16

申请号：EP06750561.0

申请日：2006-04-18

Applicant: FormFactor, Inc.

Inventor： ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W. ,  HOBBS, Eric, D. ,  MATHIEU, Gaetan, L. ,  SHINDE, Makarand, S. ,  SPORCK, A., Nicholas ,  WATSON, Thomas, N. ,  SLOCUM, Alexander, N.

IPC: G01R31/02

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

Abstract: A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

公开(公告)号：EP2198315A1

公开(公告)日：2010-06-23

申请号：EP08832821.6

申请日：2008-09-25

Applicant: FormFactor, Inc.

Inventor： BERRY, Tommie, Edward ,  SPORCK, A., Nicholas

IPC: G01R31/02

CPC classification number: G01R1/07342 ,  G01R31/2889

Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.

公开(公告)号：EP1573815A1

公开(公告)日：2005-09-14

申请号：EP03799897.8

申请日：2003-12-12

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, K. ,  ELDRIDGE, Benjamin, N. ,  MILLER, Charles, A. ,  SPORCK, A., Nicholas ,  GRUBE, Gary, W. ,  MATHIEU, Gaetan, L.

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H01L23/495

CPC classification number: H01L23/13 ,  H01L23/4951 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/4824 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical conductors on the substrate or to pads on another die attached to the substrate. The substrate may have one or more openings, exposing pads of the die. The assembly may comprise one or more dice.

Abstract translation: 在集成电路组件中，将良好的裸芯（KGD）组装在基板上。 互连元件将附接到衬底的芯片上的焊盘电连接到衬底上的迹线或其他电导体或连接到衬底的另一裸片上的焊盘。 衬底可以具有一个或多个开口，暴露管芯的焊盘。 组件可以包括一个或多个骰子。