公开(公告)号：EP2709144A2

公开(公告)日：2014-03-19

申请号：EP13183374.1

申请日：2013-09-06

申请人： Freescale Semiconductor, Inc.

发明人： Leal, George R ,  Pham, Tim V

IPC分类号： H01L21/56 ,  H01L23/433 ,  H01L23/00

CPC分类号： H01L23/49568 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/17738 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).

摘要翻译： 提供了一种用于制造具有暴露的散热器盖阵列（310）的基于引线框架的热增强倒装芯片封装的方法和设备，所述裸露散热器盖阵列（310）通过包括热界面粘附层（308）而被设计用于直接附接到集成电路裸片（306） ）到除了散热器盖（312）的平坦上盖表面之外的每个管芯（306）并且用附接模制化合物（321）封装附接的散热器盖阵列（310）和集成电路管芯阵列（306）。

公开(公告)号：EP2709144A3

公开(公告)日：2014-05-14

申请号：EP13183374.1

申请日：2013-09-06

申请人： Freescale Semiconductor, Inc.

发明人： Leal, George R ,  Pham, Tim V

IPC分类号： H01L21/56 ,  H01L23/433 ,  H01L23/00

CPC分类号： H01L23/49568 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/17738 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).