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公开(公告)号：EP3112070A1
公开(公告)日：2017-01-04
申请号：EP14883691.9
申请日：2014-02-27
发明人： HIRUKAWA, Ritsuo , KATO, Takenobu , ASAOKA, Kento
CPC分类号： B23K3/0638 , B05C5/00 , B23K2201/42 , H05K3/1233 , H05K3/3484 , H05K2203/0139
摘要： Solder supply device 26 is provided with solder cup 70 housing liquid solder that is tubular and open at one end, a positive/negative pressure supply device capable of controlling the pressure inside the solder cup, supply nozzle 74 for dispensing solder from the solder cup, and solder cutting device 77 that cuts solder supplied from the supply nozzle by ejecting compressed air; solder is supplied from the supply nozzle by increasing the pressure inside the solder cup using the positive/negative pressure supply device; when stopping the supply of solder from the supply nozzle, the pressure inside the solder cup is decreased using positive/negative pressure supply device, and solder is cut by the solder cutting device to match the timing of pressure inside the solder cup decreasing. Thus, because cutting of solder at the supply nozzle and drawing back of solder into the supply nozzle are performed at the same time, dripping of solder is reliably prevented.
摘要翻译： 焊剂供给装置26具有容纳一端开口的管状的液体焊料的焊料杯70，能够控制焊料杯内的压力的正负压供给装置，从焊料杯分配焊料的供给喷嘴74， 以及通过喷射压缩空气切断从供给喷嘴供给的焊料的焊料切断装置77; 通过使用正/负压供应装置增加焊料杯内的压力从供应喷嘴供应焊料; 当停止从供应喷嘴供应焊料时，使用正/负压供应装置来降低焊料杯内部的压力，并且通过焊料切割装置切割焊料以匹配焊料杯内部的压力的时间递减。 因此，由于同时进行供给喷嘴处的焊料的切割和将焊料拉回到供给喷嘴中，所以可靠地防止了焊料的滴落。
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公开(公告)号：EP3305525A1
公开(公告)日：2018-04-11
申请号：EP15894892.7
申请日：2015-06-08
发明人： HIRUKAWA, Ritsuo , KAMEGAI, Yasunori , KONDO, Takeshi , KATO, Mitsuaki , MIZUKOSHI, Tsuyoshi , TORII, Atsushi , IISAKA, Jun , KUSUNOKI, Kazuhiro
CPC分类号： B41F15/36 , B41F15/08 , B41F15/0881 , B41F15/18 , B41F15/20 , B41F15/26 , B41F27/005 , B41P2215/112 , B41P2215/114 , H05K3/1216
摘要： There is provided a printing device 20 including a conveyance rod 25a which discharges and introduces a screen mask M and a board support member 70; and a control section. The control section can perform a mask exchange process including a mask discharge process of discharging the screen mask M to be discharged and a mask introduction process of introducing the screen mask M to be introduced by controlling the conveyance rod 25a. In addition, the control section 21 can perform a support member exchange process including a support member discharge process of discharging the board support member 70 to be discharged and a support member introduction process of introducing the support member 70 to be introduced by controlling the conveyance rod 25a.
摘要翻译： 提供了一种打印装置20，其包括：排出并引入丝网掩模M和板支撑构件70的传送杆25a; 和一个控制部分。 控制部分可以执行掩模更换过程，该过程包括放出要放电的掩模M的掩模放电过程和通过控制传送杆25a引入要引入的掩模M的掩模引入过程。 另外，控制部21能够进行包括将排出的基板支撑部件70排出的支撑部件排出工序和通过控制搬送杆导入支撑部件70而导入的支撑部件导入工序的支撑部件更换工序 25A。
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公开(公告)号：EP3078441A1
公开(公告)日：2016-10-12
申请号：EP13898551.0
申请日：2013-12-05
CPC分类号： H05K3/3468 , B05C11/1002 , B05C17/00533 , B23K3/06 , B23K3/0638 , B23K2101/42 , B41F15/40 , B41F15/405 , B41F15/42 , B41F15/423 , H05K3/1233
摘要： Solder supply device 26 is provided with solder cup 70 housing liquid solder that is tubular and open at one end; nozzle section 88, for ejecting solder from the solder container, that is inserted into the solder container; flange section 90 that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and outer tube 72 that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. According to the present invention of a solder supply device, solder is supplied from a solder container without using an air cylinder, electromagnetic motor, or the like.
摘要翻译： 焊剂供给装置26具有容纳液体焊料的焊料杯70，所述焊料容器在一端为管状且开口; 用于从焊料容器喷射焊料的喷嘴部88，其插入到焊料容器中; 凸缘部分90，其设置在喷嘴部分的外周部分上并且接合在焊料杯的内部; 以及将空气室与焊杯的底面划分的外管72。 通过焊料杯从喷嘴部分的末端供应焊料，并且通过向空气室供应空气来相对移动凸缘部分。 根据本发明的焊料供给装置，不使用气缸或电磁马达等从焊料容器供给焊料。
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公开(公告)号：EP3078441B1
公开(公告)日：2018-09-19
申请号：EP13898551.0
申请日：2013-12-05
CPC分类号： H05K3/3468 , B05C11/1002 , B05C17/00533 , B23K3/06 , B23K3/0638 , B23K2101/42 , B41F15/40 , B41F15/405 , B41F15/42 , B41F15/423 , H05K3/1233
摘要： Solder supply device 26 is provided with solder cup 70 housing liquid solder that is tubular and open at one end; nozzle section 88, for ejecting solder from the solder container, that is inserted into the solder container; flange section 90 that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and outer tube 72 that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. According to the present invention of a solder supply device, solder is supplied from a solder container without using an air cylinder, electromagnetic motor, or the like.
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公开(公告)号：EP2744319A1
公开(公告)日：2014-06-18
申请号：EP12822167.8
申请日：2012-07-10
CPC分类号： H05K13/0465 , H05K13/0061 , H05K13/084
摘要： It is an object of the invention to provide a multi-lane solder printing system having high utility. In a solder printing system having: two printers which are disposed side by side in a substrate conveyance direction and each of which includes two conveyor lanes 118, 120 on one of which solder printing is performed; and a conveyor-lane changer disposed between the two printers and configured to switch a lane for conveying a substrate between the two conveyor lanes, identification information (U, L) is stored for each of the substrates 130 output from the system in association with an output order and the stored details are displayed, the identification information being information for identifying which one of the two printers has performed printing on each of the substrates 130 output from the system. In an instance where any failure is found in any of downstream-side operation-performing apparatus, the identification information is useful for finding the cause of the failure. Accordingly, the present system ensures high convenience in management of the output substrates.
摘要翻译： 本发明的目的是提供具有高效用的多通道焊料印刷系统。 在一个焊料印刷系统中，该系统具有：在基板传送方向上并排布置的两个印刷机，每个印刷机包括两个传送道118,120，其中一个传送道118,120在其中一个上执行焊料印刷; 以及设置在两个打印机之间并且被配置为切换用于在两个传送带之间传送基板的通道的传送道变换器，针对从系统输出的每个基板130存储识别信息（U，L）以及与 输出顺序和存储的细节被显示，识别信息是用于识别两个打印机中的哪一个已经在从系统输出的每个基板130上执行了打印的信息。 在任何下游侧操作执行装置中发现任何故障的情况下，识别信息对于找出故障的原因是有用的。 因此，本系统确保输出基板管理的高度便利性。
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