摘要:
A method for retrieving and presenting objects in an automated Surface Mount Device (SMD) warehouse adapted to obtain information related to upcoming SMT jobs, the method comprising receiving at least one of input data and a parameter representing a position within said automated Surface Mount Device (SMD) warehouse; retrieving a bin from said position within said automated SMD warehouse at least partly based on said at least one of input data and/or a parameter representing said position within said automated Surface Mount Device (SMD) warehouse; and -presenting said retrieved bin at, or close to, an output port, such as an opening, of said automated Surface Mount Device (SMD) warehouse.
摘要:
Die Erfindung betrifft ein Verfahren zur Bearbeitung der Programmfunktionen eines Automatisierungssystems (AS), bei dem die einer zu steuernden Anlage (ANL) zugeordneten Teilprogramme und/oder Systemfunktionen (A; A1, A2; Ax1, Ax2, Ay1, Ay2, Ay3, Ay4) Systemressourcen (SR) im Automatisierungssystem (AS) belegen. Die mit den Teilprogrammen im Betrieb durchgeführten Systemfunktionen oder Auslösebausteine (A; A1, A2; Ax1, Ax2, Ay1, Ay2, Ay3, Ay4) erhalten einen Aktualparameter (CMP_ID), der eine logische Verknüpfung zwischen den durch das Teilprogramm repräsentierten Systemfunktionen (A; A1, A2; Ax1, Ax2, Ay1, Ay2, Ay3, Ay4) und den dadurch belegten Systemressourcen (SR) bis zum Beenden der Systemfunktion (A; A1, A2; Ax1, Ax2, Ay1, Ay2, Ay3, Ay4) herstellt, und nach einem Erstlauf eines bearbeiteten Teilprogramms werden alle diesbezüglichen Systemressourcen (SR) im Automatisierungsgerät durch eine Resetfunktion (RESET) freigegeben.
摘要:
The present specification discloses a method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head. In the method, the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. The present specification also discloses an electronic component mounting system which is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. In the electronic component mounting system, the control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.
摘要:
The present specification discloses a method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head. In the method, the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. The present specification also discloses an electronic component mounting system which is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. In the electronic component mounting system, the control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.
摘要:
A method for retrieving and presenting objects in an automated Surface Mount Device (SMD) warehouse adapted to obtain information related to upcoming SMT jobs, the method comprising receiving at least one of input data and a parameter representing a position within said automated Surface Mount Device (SMD) warehouse; retrieving a bin from said position within said automated SMD warehouse at least partly based on said at least one of input data and/or a parameter representing said position within said automated Surface Mount Device (SMD) warehouse; and -presenting said retrieved bin at, or close to, an output port, such as an opening, of said automated Surface Mount Device (SMD) warehouse.
摘要:
A method for retrieving and presenting objects in an automated Surface Mount Device (SMD) warehouse adapted to obtain information related to upcoming SMT jobs, the method comprising receiving at least one of input data and a parameter representing a position within said automated Surface Mount Device (SMD) warehouse; retrieving a bin from said position within said automated SMD warehouse at least partly based on said at least one of input data and/or a parameter representing said position within said automated Surface Mount Device (SMD) warehouse; and -presenting said retrieved bin at, or close to, an output port, such as an opening, of said automated Surface Mount Device (SMD) warehouse.
摘要:
A method for retrieving and presenting objects in an automated Surface Mount Device (SMD) warehouse adapted to obtain information related to upcoming SMT jobs, the method comprising receiving at least one of input data and a parameter representing a position within said automated Surface Mount Device (SMD) warehouse; retrieving a bin from said position within said automated SMD warehouse at least partly based on said at least one of input data and/or a parameter representing said position within said automated Surface Mount Device (SMD) warehouse; and—presenting said retrieved bin at, or close to, an output port, such as an opening, of said automated Surface Mount Device (SMD) warehouse.
摘要:
The present specification discloses a method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head. In the method, the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. The present specification also discloses an electronic component mounting system which is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. In the electronic component mounting system, the control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.
摘要:
Die Erfindung betrifft ein Verfahren zur Bearbeitung der Programmfunktionen eines Automatisierungssystems (AS), bei dem die einer zu steuernden Anlage (ANL) zugeordneten Teilprogramme und/oder Systemfunktionen (A; A1, A2; Ax1, Ax2, Ay1, Ay2, Ay3, Ay4) Systemressourcen (SR) im Automatisierungssystem (AS) belegen. Die mit den Teilprogrammen im Betrieb durchgeführten Systemfunktionen oder Auslösebausteine (A; A1, A2; Ax1, Ax2, Ay1, Ay2, Ay3, Ay4) erhalten einen Aktualparameter (CMP_ID), der eine logische Verknüpfung zwischen den durch das Teilprogramm repräsentierten Systemfunktionen (A; A1, A2; Ax1, Ax2, Ay1, Ay2, Ay3, Ay4) und den dadurch belegten Systemressourcen (SR) bis zum Beenden der Systemfunktion (A; A1, A2; Ax1, Ax2, Ay1, Ay2, Ay3, Ay4) herstellt, und nach einem Erstlauf eines bearbeiteten Teilprogramms werden alle diesbezüglichen Systemressourcen (SR) im Automatisierungsgerät durch eine Resetfunktion (RESET) freigegeben.